2026年8月14日
What Is an RJ45 Connector? Understanding RJ45 Pinout and Uses
What is RJ45 connector? Get pinout details, Ethernet uses, and sourcing specs like plating and termination to avoid...
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Drop-in Replacement
- Competitor Part Number
- Amphenol RJCSE-5380-01 / Molex 85505 Series Alternative
- Mates With
- Standard RJ45 / 8P8C Male Ethernet Plugs (Cat5e / Cat6)
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
Technical Specifications
- Connector Type
- RJ45 8P8C Female Modular Jack
- Number of Positions / Contacts
- 8 Positions / 8 Contacts (8P8C)
- Mounting Type
- Mid-Mount (Sinking) / Through-Hole DIP Right Angle
- Center / Sinking Depth (H)
- 5.50 mm
- Shell Style
- Half-Shielded (Semi-Shielded)
- Overall Dimensions (L x W x H)
- 17.05 mm x 16.80 mm x 11.90 mm (Body envelope)
- Contact Pitch
- 1.02 mm (1.02 mm x 7 = 7.14 mm total span)
- PCB Cutout Width
- 15.10 mm (16.80 mm at outer clearance steps)
- Signal Hole Diameters
- 8x Ø0.90 mm
- Shield Retention Hole Size
- 2x 2.00 mm x 0.70 mm ground slots (11.00 mm center pitch)
- Standard Compliance
- RoHS Compliant, UL 94V-0
Material Composition
| Material | Value / Description |
|---|---|
| Housing Material | Thermoplastic (UL 94V-0) |
| Contact Material | Phosphor Bronze |
| Contact Plating | Gold 1µ" / Tin (Au 1µ"/Sn) Plated |
| Shell Material | Stainless Steel |
| Shell Plating | Nickel 50µ" (Ni 50u) Plated |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Voltage Rating | 125 VAC RMS |
| Current Rating | 1.5 A |
| Contact Resistance | 30 mΩ Max. |
| Insulation Resistance | 1000 MΩ Min. |
| Dielectric Strength | 1000V AC RMS 50Hz, 1 Minute |
| Operating Temperature Range | -40°C to +85°C |
| Relative Humidity Resistance | 90% ~ 95% RH (40°C ± 2°C) |
| General Tolerances | 0 Place: ±0.50 mm; 1 Place: ±0.35 mm; 2 Place: ±0.25 mm; 3 Place: ±0.15 mm; Angular: ±3° |
Application Scenarios
-
Low-profile industrial embedded systems and Single Board Computers (SBC)
-
Compact network switches, industrial IoT routers, and edge hubs
-
Commercial smart POS terminals, interactive digital displays, and slim kiosks
-
Factory automation field controllers and DIN-rail networking interfaces
-
Thin-profile security transmission appliances and surveillance hardware
Frequently Asked Questions
What are the mechanical advantages of a 5.50mm mid-mount sinking RJ45 connector?
A mid-mount sinking RJ45 connector recesses 5.50mm into a pre-routed PCB edge cutout rather than resting entirely above the board surface. This geometry significantly reduces the above-board vertical profile height, allowing the connector to fit ultra-slim chassis constraints while utilizing through-hole DIP solder pegs to absorb cable mating forces and mechanical shock.
What is the recommended PCB cutout and footprint for this half-shield sinking jack?
The PCB requires an edge cutout 15.10mm wide with 0.70mm lateral clearance steps (16.80mm overall clearance). The footprint layout accommodates 8 signal pins through 8x Ø0.90mm through-holes on a 1.02mm pitch (7.14mm span), supported by two 2.00mm x 0.70mm ground tab slots spaced 11.00mm apart with a ±0.05mm positioning tolerance.
What is the structural purpose of the half-shield (semi-shielded) design?
The half-shield design utilizes a top and side stainless steel wrap with 50µ" nickel plating to provide critical EMI shielding and grounding across vulnerable surface paths while reducing overall metallic mass and optimizing thermal reflow/wave soldering dynamics on high-density PCBs.
What electrical isolation and environmental ratings does this modular jack fulfill?
The connector is rated for 125 VAC RMS at 1.5A across a -40°C to +85°C operating range. It delivers dielectric withstanding breakdown strength of 1000V AC RMS (50Hz for 1 minute) and minimum insulation resistance of 1000 MΩ, meeting industrial Ethernet physical layer isolation requirements.
Overview and Application Notes
This mid-mount sinking RJ45 8P8C female modular jack features a half-shield structure (semi-shielded) with a 5.50mm sinking depth and through-hole DIP mounting. Specifically designed for compact industrial boards and low-profile networking communications hardware, it lowers vertical profile height above the PCB while maintaining rugged mechanical retention, standard 8P8C Ethernet signal integrity, and durable stainless steel shielding.
Key Features
- Modular Port Configuration: Standard 8 positions and 8 contacts (8P8C) female modular interface.
- Mid-Mount Sinking Depth: 5.50mm drop-in sink offset depth significantly minimizes above-board vertical stack height.
- Half-Shielded Structural Architecture: Semi-shielded body design optimized for targeted EMI shielding and streamlined PCB thermal profiles.
- Through-Hole DIP Solder Legs: Multi-point solder pegs provide rigid mechanical anchoring against mating shock and vibration.
- High-Reliability Materials: UL 94V-0 rated thermoplastic housing, phosphor bronze contacts with 1µ” gold-over-nickel plating and tin solder tails, and a 50µ” nickel-plated stainless steel shell.
- Industrial-Grade Ratings: Rated at 125 VAC RMS / 1.5A, contact resistance ≤ 30 mΩ, insulation resistance ≥ 1000 MΩ, and dielectric strength of 1000V AC RMS.
- Broad Operating Temperature: Fully qualified for industrial applications from -40°C to +85°C under 90%–95% relative humidity.
Engineering Specifications & PCB Integration
Engineered for PCB edge drop-in mounting with a 15.10mm wide panel cutout and dual 0.70mm lateral clearance steps (16.80mm overall clearance width). The signal pin layout follows standard 1.02mm pitch (7.14mm total span) with 8x Ø0.90mm through-holes, accompanied by dual 2.00mm x 0.70mm slotted shield retention ground tabs spaced 11.00mm apart and dual Ø2.50mm / Ø1.40mm mounting features. Solder tails extend into through-holes to ensure complete solder barrel fill and mechanical stability under standard FR-4 board fabrication.
