2026年7月30日
Wiring and Harness Design for OEM Buyers: Key Specification Points
Get essential wiring and harness design specs for OEM buyers: wire gauge, connectors, routing. Prevent costly errors—read now.
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Drop-in Replacement
- Competitor Part Number
- Generic USB 3.1 Gen 2 Type-A Mid-Mount SMT 9-Pin (H=3.50mm)
- Mates With
- Standard USB 3.0 / USB 3.1 / USB 3.2 Gen 2 Type-A Plugs and Cable Assemblies
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
Material Composition
| Material | Value / Description |
|---|---|
| Insulator / Housing | Thermoplastic (UL 94V-0), Blue |
| Contact Material | Copper Alloy |
| Contact Plating | Au on Contact Area, Tin on Solder Tails over Nickel |
| Shell Material | Stainless Steel, Nickel Plated |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Data Rate | Up to 10 Gbps (SuperSpeed+) |
| Current Rating | 1.5A |
| Voltage Rating | 30V AC/DC Max |
| Contact Resistance | 30 mΩ Max (Initial) |
| Insulation Resistance | 1000 MΩ Min |
| Dielectric Withstanding | 500V AC for 1 minute |
| Mating Cycles | 5,000 Cycles |
| Operating Temperature | -25°C to +85°C |
| Mating Force | 35N Max / Unmating Force: 8N Min |
Application Scenarios
-
Industrial Panel PCs & Single Board Computers (SBC): Low-profile 3.50mm mid-mount design saves critical vertical enclosure space while enabling 10Gbps data throughput.
-
High-Speed Edge Computing & NVMe Storage Hubs: Delivers stable SuperSpeed+ 10Gbps transmission with optimized 9-pin signal contact layout.
-
Medical Diagnostic & Imaging Equipment: Robust shielding and secure SMT hold-downs resist continuous cable pulling and vibration.
-
Automotive Infotainment & Dashboard Modules: Engineered for harsh temperature ranges (-25°C to +85°C) and tight dashboard clearance.
Frequently Asked Questions
Does this mid-mount USB 3.1 Gen 2 connector support standard lead-free SMT reflow soldering?
Yes, the housing is molded from high-temperature UL94V-0 rated thermoplastic, which is fully compatible with standard RoHS lead-free reflow soldering profiles (peak temperature up to 260°C).
What is the mechanical advantage of this mid-mount (sink H=3.50mm) configuration?
The mid-mount sink design sets the connector into a PCB cutout with a low overall height of 3.50mm, significantly reducing vertical clearance requirements for ultra-thin enclosures and compact devices.
What are the insertion and extraction force specifications for this connector?
According to the engineering drawing, the maximum insertion force is 35N and the minimum unmating/extraction force is 8N, ensuring a secure mating retention while protecting SMT solder joints.
What is your standard lead time and Minimum Order Quantity (MOQ) for OEM buyers?
Standard lead times typically range from 2 to 4 weeks, with rapid prototyping available in 3-5 days. MOQ depends on the specific customization requirements, but we offer flexible initial pilot-run quantities to support your engineering validation.
Can you provide the 3D STEP files and PCB footprint (DXF) for layout design?
Yes. We provide comprehensive engineering support. 3D models and exact PCB layout recommendations are available for immediate download or by contacting our technical sales team to ensure flawless integration.
Overview and Application Notes
Overview Engineered for reliable 10 Gbps SuperSpeed+ data transmission, this USB 3.1 Gen 2 Type-A receptacle features a space-saving horizontal mid-mount (sink type, H=3.50mm) design ideal for low-profile PCB layouts. Manufactured with high-temperature, UL94V-0 rated blue thermoplastic housing, 9 copper alloy contacts with Au/Tin plating rated at 1.5A, and a nickel-plated stainless steel shell, it withstands rigorous industrial operating temperatures from -25°C to +85°C while ensuring excellent high-frequency signal integrity. As a direct factory OEM solution, we provide robust SMT integration and consistent quality for high-volume electronic manufacturing lines.
Application Notes
-
PCB Cutout & Profile: The mid-mount configuration requires a dedicated PCB edge cutout (center height CH=0.64mm, total connector height 3.50mm); verify board thickness and routing tolerances against the recommended PCB layout to prevent mechanical interference.
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SMT Reflow Soldering: Molded from high-temperature UL94V-0 thermoplastic, fully compatible with standard lead-free reflow profiles (peak ~260°C); ensure proper thermal profiling to avoid housing deformation.
-
Grounding & Shielding: Features multiple shell grounding tabs and dedicated drain pin (Pin 7) to provide continuous 360-degree shielding and minimize EMI/RFI interference.
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Mechanical Retention: Ensure full solder fillet on the 4 shell mounting stakes (0.45±0.05mm) during SMT layout to absorb insertion (max 35N) and extraction (min 8N) mating forces, protecting the 9-pin signal terminals from mechanical stress.
