2026年7月30日
Wiring and Harness Design for OEM Buyers: Key Specification Points
Get essential wiring and harness design specs for OEM buyers: wire gauge, connectors, routing. Prevent costly errors—read now.
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Drop-in Replacement
- Competitor Part Number
- Molex 48320 Series / TE Connectivity 1932799-1
- Mates With
- Standard USB 3.0 Type-A Plugs and Cable Assemblies
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
Material Composition
| Material | Value / Description |
|---|---|
| Insulator / Housing | High-Temperature Thermoplastic (UL94V-0), Black or Blue |
| Contact Material | Copper Alloy |
| Contact Plating | Gold Flash or customized (e.g., 15μ", 30μ") over Nickel |
| Shell Material | Stainless Steel or Brass |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Data Rate | Up to 5 Gbps (SuperSpeed) |
| Current Rating | 1.8A (Pins 1 & 4), 0.25A (Other Signal Pins) |
| Voltage Rating | 30V AC/DC Max |
| Contact Resistance | 30 mΩ Max (Initial) |
| Insulation Resistance | 1000 MΩ Min |
| Dielectric Withstanding | 500V AC for 1 minute |
| Mating Cycles | Up to 5,000 Cycles (Industrial Durability) |
| Operating Temperature | -40°C to +85°C |
Application Scenarios
-
Industrial Panel PCs and IPCs : Provides a low-profile, rugged data port that seamlessly fits into thin-chassis industrial controllers without compromising board space.
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Medical & Diagnostic Equipment : Ensures reliable SuperSpeed data transfer for portable imaging devices where compact PCB real estate and stable connections are critical.
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Network Routers & Edge Computing : Delivers high-speed 5Gbps connectivity for local firmware updates or external storage expansion in space-constrained networking hardware.
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Automotive Infotainment Systems : Acts as a durable, vibration-resistant media input port within thin dashboard head units thanks to its secure mid-mount SMT anchoring.
Frequently Asked Questions
Does this mid-mount USB 3.0 connector support standard lead-free SMT reflow soldering?
Yes, the insulator is molded from high-temperature UL94V-0 thermoplastic, which is fully compatible with standard RoHS/Pb-free reflow soldering profiles (typically peaking at 260°C).
What is the mechanical advantage of a mid-mount (sink-board) configuration?
A mid-mount design drops the connector profile into a cutout in the PCB. This significantly reduces the overall height of the connector above the board, making it perfect for ultra-thin enclosures and compact devices.
Are custom contact plating options available for high-humidity environments?
Absolutely. While gold flash is standard, we can provide 15μ" or 30μ" hard gold plating for the contact areas upon request to enhance corrosion resistance and increase mating cycle life for harsh environments.
What is your standard lead time and Minimum Order Quantity (MOQ) for OEM buyers?
Standard lead times typically range from 2 to 4 weeks, with rapid prototyping available in 3-5 days. MOQ depends on the specific customization requirements, but we offer flexible initial pilot-run quantities to support your engineering validation.
Can you provide the 3D STEP files and PCB footprint (DXF) for layout design?
Yes. We provide comprehensive engineering support. 3D models and exact PCB layout recommendations are available for immediate download or by contacting our technical sales team to ensure flawless integration.
Overview and Application Notes
Overview Engineered for reliable 5 Gbps SuperSpeed data transmission, this USB 3.0 Type-A receptacle features a space-saving horizontal mid-mount design ideal for low-profile PCB layouts. Manufactured with high-temperature, UL94V-0 rated thermoplastics and robust surface-mount (SMT) hold-downs, it withstands rigorous industrial environments while ensuring excellent signal integrity. As a direct factory OEM solution, we offer flexible customization options, guaranteeing seamless integration for your device manufacturing lines with rapid prototyping and reliable volume delivery.
Application Notes
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PCB Clearance: The mid-mount design requires a specific PCB cutout; verify board thickness and routing tolerances to prevent mechanical interference with surrounding components.
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Reflow Soldering: Designed with high-temperature LCP/Thermoplastic to withstand standard Pb-free SMT reflow profiles; ensure proper thermal profiling to avoid plastic housing warpage.
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Grounding & Shielding: Features multiple robust shield grounding tabs; ensure PCB ground pads are properly dimensioned and connected to system ground to mitigate EMI/RFI issues.
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Mechanical Reinforcement: Utilize the SMT shell stakes effectively during layout to absorb insertion/extraction forces, protecting the delicate 9-pin signal contacts from mechanical stress.
