2026年7月30日
Wiring and Harness Design for OEM Buyers: Key Specification Points
Get essential wiring and harness design specs for OEM buyers: wire gauge, connectors, routing. Prevent costly errors—read now.
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Product Specifications
Key parameters for OEM, distributor and engineering evaluation.
Detailed Product Information
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
| Material | Value / Description |
|---|---|
| Housing Material | LCP, Black (UL 94V-0) |
| Contact Material | Phosphor Bronze (C5191) & Brass (C2680) |
| Contact Plating | 30u" Gold on Contact Area, Tin on Solder Tails |
| Shielding Shell | Stainless Steel, Nickel Plated (Laser Spot Welded) |
| Characteristic | Value |
|---|---|
| Rated Voltage | 30V AC (RMS) Max |
| Rated Current | 1.8A (Power Pins), 0.25A (Signal Pins) |
| Contact Resistance | 30 mΩ Max (Initial) |
| Insulation Resistance | 1000 MΩ Min |
| Dielectric Withstanding | 500V AC for 1 minute |
| Mating Cycles | 5,000 Cycles |
| Operating Temperature | -25°C to +85°C |
Industrial PCs (IPCs) & Embedded Motherboards: Provides a space-saving, 180° vertical high-speed data interface (H12.50mm) where horizontal edge mounting is not feasible due to enclosure constraints.
Smart Kiosks & POS Terminals: Delivers long-term mechanical reliability with a standard 5,000-cycle lifespan and heavy-duty stainless steel shell retention.
Medical & Diagnostic Carts: Guarantees secure, high-bandwidth data logging, 500V AC dielectric withstanding voltage, and 1000 MΩ insulation resistance for stationary equipment.
Networking & Edge Routers: Acts as a reliable physical diagnostic, firmware update, or memory expansion interface on top-facing telecom boards across -25°C to +85°C.
Overview Engineered for reliable high-speed 5 Gbps data transmission in demanding industrial environments, this vertical USB 3.0 Type-A receptacle offers a robust top-mount connectivity solution for space-constrained PCB layouts. Featuring a 180-degree vertical DIP orientation with an elevated 12.50mm profile, it provides convenient top-facing accessibility for peripheral integration on embedded motherboards. The through-hole (DIP) signal pins and reinforced stainless steel shell with laser spot welding ensure superior mechanical retention, reliably supporting up to 5,000 mating cycles. Molded from black high-temperature LCP (UL 94V-0) and rated for operating temperatures from -25°C to +85°C, this connector delivers high electrical stability and corrosion resistance with 30u” gold-plated contacts. As an ISO-certified OEM/ODM manufacturer, EDOM Electronics provides factory-direct pricing, scalable production, and custom packaging options to meet your exact engineering specifications.
Application Notes
Mechanical Grounding: The outer stainless steel through-hole shell stakes feature laser spot welding for enhanced rigidity and must be wave-soldered securely to the PCB ground plane. This absorbs the mechanical stress of frequent insertion (5,000 cycles) while providing continuous 360° EMI/RFI shielding.
PCB Footprint & Hole Tolerances: Ensure precision hole sizing and alignment according to the recommended layout (0.70mm signal pin holes, 2.30mm shell stake slots) to avoid mechanical strain on the contacts during automated DIP insertion.
Thermal Compatibility: The connector is molded from black LCP (UL 94V-0) thermoplastic. Verify that wave soldering pre-heat and peak solder pot temperatures align with standard assembly profiles within the -25°C to +85°C operating parameters.
Impedance Matching: Maintain 90Ω differential trace impedance on the PCB for SuperSpeed (TX/RX) differential pairs to prevent signal loss and ensure full 5 Gbps performance.
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Get essential wiring and harness design specs for OEM buyers: wire gauge, connectors, routing. Prevent costly errors—read now.
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Use this document for internal review, engineering comparison, and RFQ preparation.
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