2026年7月14日
What Is a USB-C Connector? A Practical FAQ for OEM Buyers
What is a USB-C connector? Learn the four hidden parameters OEM buyers must check to avoid SMT rework...
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Drop-in Replacement
- Competitor Part Number
- Molex 48393-0011 / TE Connectivity 1932258-1
- Mates With
- Standard USB 3.0 Type-A Male Plugs / Cable Assemblies
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
Material Composition
| Material | Value / Description |
|---|---|
| Contact Base Material | High-Conductivity Copper Alloy |
| Contact Plating | Gold Plated on Mating Area, Tin on Solder Tails |
| Housing Insulator | Thermoplastic (LCP), Blue, UL94V-0 Rated |
| Shell Material | Copper Alloy, Nickel Plated |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Rated Voltage | 30V AC (RMS) / DC Max |
| Rated Current | 1.5A |
| Insulation Resistance | 1000 MΩ Min. |
| Dielectric Withstanding Voltage | 500V AC for 1 minute |
| Operating Temperature | -55°C to +105°C |
Application Scenarios
-
Industrial Automation & Embedded Computing: Space-saving USB 3.0 data transfer interface for ultra-slim panel PCs, PLC modules, and edge controllers where vertical PCB clearance is strictly restricted.
-
Medical Diagnostic & Portable Equipment: Compact, durable external USB logging ports for portable monitoring carts needing high mating durability and reliable grounding.
-
Consumer Electronics & Thin Docking Stations: Low-profile USB 3.0 connectivity integrated into slim hubs, laptops, and external storage enclosures.
-
Automotive In-Vehicle Infotainment: High-speed media interface modules requiring robust mid-mount mechanical stability under continuous vibration.
Frequently Asked Questions
What is the primary benefit of selecting a mid-mount USB 3.0 receptacle?
A mid-mount receptacle sits partially inside a PCB cutout rather than on top of the board. This drastically reduces the overall height profile of the finished electronic device, making it ideal for ultra-thin consumer and industrial equipment.
Can EDOM customize the contact plating or shell peg dimensions for custom PCB designs?
Yes, we provide full OEM customization including selective gold plating thicknesses (from Gold Flash up to 30µ") and modified shell stake lengths to meet your exact mechanical enclosure specifications.
Are these connectors compliant with international environmental and quality standards?
Absolutely. All EDOM connectors are manufactured in compliance with RoHS, REACH, and UL94V-0 flame-retardant requirements, with full material test certification provided upon request.
What is the standard minimum order quantity (MOQ) and production lead time?
Our standard production MOQ is typically 1,000 units (Tape & Reel packaging). Prototype samples can be shipped within 3 to 5 days, and full mass production lead time is generally 2 to 3 weeks.
Overview and Application Notes
Overview The EU09FL1N11289 is a precision-engineered USB 3.0 Type-A female receptacle designed for low-profile PCB applications. Featuring a 9-pin SMT contact layout and a horizontal mid-mount (sink-board) configuration, it delivers reliable 5 Gbps SuperSpeed data transmission while significantly reducing vertical board height in compact electronic devices. Manufactured to strict industrial standards with sturdy through-hole solder stakes for EMI shielding and strain relief, EDOM Electronics offers complete OEM/ODM customization—including bespoke contact plating, custom reel packaging, and engineering DFM support.
Application Notes
-
PCB Cutout Precision: Ensure board cutouts precisely align with the mid-mount mechanical footprint to accommodate the recessed housing height without interfering with adjacent components.
-
Reflow Soldering Temperature: Follow standard lead-free SMT reflow profiles (peak temperature max 260°C). The high-temperature LCP (Liquid Crystal Polymer) thermoplastic housing (UL 94V-0) provides excellent thermal stability during the SMT process to prevent deformation.
-
EMI Shielding & Grounding: Solder all through-hole shell stakes securely to the PCB ground plane to optimize mechanical retention and maximize High-Speed EMI shielding performance.
-
Coplanarity Verification: Check that terminal coplanarity is maintained within 0.10 mm prior to reflow to prevent solder bridging or opens across the 9 SMT pads.
