2024年4月12日
10 Reliable Custom Wire Harness Manufacturers in China (2026 Guide for OEMs)
China’s booming electronics sector offers thousands of wire harness suppliers, but finding the right fit for mid-to-high volume...
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Drop-in Replacement
- Competitor Part Number
- Molex 105444 Series / TE Connectivity 2320115 Series (Depending on exact PCB cutout tolerances)
- Mates With
- Standard USB 3.1 Type-C Plugs & Cable Assemblies
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
Material Composition
| Material | Value / Description |
|---|---|
| Housing / Insulator | High-Temperature Thermoplastic (UL 94V-0) |
| Contacts | Copper Alloy, Gold Plated |
| Outer Shell | Stainless Steel, Nickel Plated for EMI shielding |
| Shielding & Internal Components | Stainless Steel Shell (Ni Plated) with Stainless Steel Mid Plate & EMC Shield (Unplated) |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Voltage Rating | 100V AC RMS |
| Current Rating | 3.0A (VBUS: A4, A9, B4, B9) / 1.25A (Signal Pins) |
| Mating Cycles | 10,000 Cycles (Minimum) |
| Operating Temperature | -40°C to +85°C |
| Contact Resistance | 40 mΩ Max (Initial) |
| Dielectric Strength | 100V AC RMS (50Hz, 1 Min) |
| Insulation Resistance | 100 MΩ Min |
Application Scenarios
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Ultra-Thin Laptops & Tablets : Utilizes the 1.0mm mid-mount (sink board) design and 8.0mm short body to significantly reduce the Z-axis profile, enabling slimmer consumer electronic designs without compromising on 240W charging capabilities.
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Industrial Panel PCs & IPCs : Provides robust, vibration-resistant dual SMT termination and a 10,000-cycle lifespan, ensuring stable 10Gbps data transmission in harsh factory automation environments.
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Medical Diagnostic Equipment : Delivers reliable, high-speed connectivity for portable ultrasound and patient monitoring systems where space constraints and high mating frequency are critical design factors.
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Smart Home & IoT Gateways : Acts as a unified interface for both high-power delivery and high-speed data networking, simplifying the internal BOM and reducing overall device footprint.
Frequently Asked Questions
What are the exact sink dimensions and body length for EU24FB3N11305?
The connector features a 1.0mm mid-mount sink depth with a short body length of L=8.75mm and dual-SMT surface mount terminals, engineered specifically for ultra-thin PCB cutouts.
What are the electrical ratings specified in the engineering drawing?
According to the engineering drawing, it is rated for 100V AC RMS voltage, 3.0A current on VBUS contacts (A4, A9, B4, B9), and 1.25A on all remaining signal contacts.
Can EDOM Electronics modify the housing or mounting stakes for a custom PCB layout?
Absolutely. As an OEM/ODM factory, we have an in-house engineering team that can modify the shell stakes, body length, or plating thickness to perfectly match your proprietary PCB footprint or mechanical enclosure constraints.
How is the product packaged for automated assembly lines?
The EU24FB3N11305 receptacles are packaged in EIA-standard Tape and Reel (T&R) formats, complete with a flat pick-and-place area on the connector housing to seamlessly integrate with your automated SMT pick-and-place machinery.
Do you provide 3D CAD models and STEP files for engineering evaluation?
Yes, we provide comprehensive technical documentation, including 2D drawings, 3D STEP files, and PCB footprint recommendations upon request. Contact our sales engineering team to accelerate your design-in process.
Overview and Application Notes
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Overview: Engineered for ultra-thin consumer electronics, portable medical devices, and high-density industrial equipment, the EU24FB3N11305 is a 24-pin USB 3.1 Type-C female receptacle featuring a space-saving mid-mount dual-SMT short-body design (total length L=8.75mm, sink depth 1.0mm). Constructed with a high-temperature UL94 V-0 thermoplastic housing, a nickel-plated stainless steel shell, an internal stainless steel mid-plate, EMC shielding, and 24 gold-plated copper alloy contacts, it supports high-speed data transmission and reliable power delivery (3.0A on VBUS pins A4, A9, B4, B9; 1.25A on signal pins). Its all-SMT surface mount architecture delivers seamless automated lead-free reflow assembly, exceptional 360-degree EMI suppression, and an operating temperature range of -40°C to +85°C across 10,000 mating cycles.
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Application Notes:
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PCB Cutout & Mid-Mount Alignment: Designed for mid-mount sink installation with a 1.0mm sink depth (L=8.75mm short body); strictly adhere to the recommended PCB layout (cutout width 8.64mm, edge distance 9.45mm / 11.75mm) to ensure precise terminal registration and avoid mechanical interference.
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Dual-SMT Soldering & Stencil Design: Features a dual-row SMT layout with 24 surface-mount contact pads (0.25mm / 0.30mm pad widths, 0.50mm pitch) and outer shell grounding pads; optimize solder stencil aperture and paste volume to prevent solder bridging.
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Lead-Free Reflow Compatibility: Molded from high-temperature UL94 V-0 thermoplastic, fully rated for standard RoHS lead-free IR reflow soldering profiles (peak temperature up to 260°C).
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Multi-Component EMI Shielding: Integrates a nickel-plated stainless steel shell, internal stainless steel mid-plate, and dedicated EMC shield to deliver seamless 360-degree EMI suppression and maintain signal integrity.
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