2026年7月14日
What Is a USB-C Connector? A Practical FAQ for OEM Buyers
What is a USB-C connector? Learn the four hidden parameters OEM buyers must check to avoid SMT rework...
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Drop-in Replacement
- Competitor Part Number
- Molex 105444 Series / TE Connectivity 2320115 Series (Depending on specific PCB cutout tolerances)
- Mates With
- Standard USB 3.2 Gen2 Type-C Plugs & Cable Assemblies
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
Material Composition
| Material | Value / Description |
|---|---|
| Housing / Insulator | High-Temperature Thermoplastic (UL 94V-0) |
| Contacts | Copper Alloy, Gold Plated |
| Outer Shell | Stainless Steel Shell (Ni Plated) with Stainless Steel Mid Plate & EMC Shield (Unplated) |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Voltage Rating | 100V AC RMS |
| Current Rating | 3.0A (VBUS: A4, A9, B4, B9) / 1.25A (Signal Pins) |
| Power Rating | Standard Bus Power (3.0A Rating) |
| Mating Cycles | 10,000 Cycles (Minimum) |
| Operating Temperature | -40°C to +85°C |
| Contact Resistance | 40 mΩ Max (Initial) |
| Dielectric Strength | 100V AC RMS (50Hz, 1 Min) |
| Insulation Resistance | 100 MΩ Min |
Application Scenarios
-
Ultra-Thin Laptops & Tablets : Leverages the 0.75mm mid-mount center height to significantly reduce the Z-axis profile, enabling slimmer consumer electronic chassis designs while supporting 240W fast charging.
-
Industrial Panel PCs (IPCs) : Utilizes the hybrid DIP+SMT termination to provide exceptional mechanical tear-out resistance, surviving continuous plugging and unplugging in harsh factory automation settings.
-
Medical Diagnostic Monitors : Delivers reliable, high-speed 10 Gbps video and data connectivity with a 10,000-cycle lifespan, essential for high-use portable medical equipment.
-
Smart Home Hubs & Docking Stations : Acts as a unified, single-cable solution handling both high-power EPR delivery and high-bandwidth networking, simplifying internal PCB real estate.
Frequently Asked Questions
What is the advantage of the Hybrid DIP+SMT design over pure SMT?
The hybrid design combines 12 front through-hole DIP pins and through-hole outer shell retention stakes with 12 rear surface-mount (SMT) contacts. This provides superior mechanical tear-out resistance and joint strength on the PCB while preserving high-speed signal integrity.
What are the certified electrical and voltage ratings for EU24F2B3N11339SR?
According to the factory engineering drawing, it is rated for 100V AC RMS dielectric strength, supporting 3.0A max on VBUS power pins (A4, A9, B4, B9) and 1.25A on all other signal pins across an operating temperature range of -40°C to +85°C.
What is the standard MOQ and lead time?
Our standard Minimum Order Quantity (MOQ) for tape-and-reel packaging is typically 1,000 pieces per reel. Lead times generally range from 2 to 4 weeks, depending on current manufacturing capacity and custom plating requirements.
Can this connector withstand lead-free reflow soldering processes?
Absolutely. The housing is molded from high-temperature LCP (Liquid Crystal Polymer) rated at UL94V-0, making it fully compatible with standard RoHS lead-free IR reflow and pin-in-paste soldering profiles up to 260°C.
Do you provide 3D CAD models and PCB footprints?
Yes, we provide comprehensive technical documentation. 2D dimension drawings, 3D STEP files, and recommended PCB cutout/layout guidelines are available upon request to assist your hardware engineers.
Overview and Application Notes
-
Overview: Engineered for ultra-thin portable electronics, industrial controllers, and compact embedded devices, the EU24F2B3N11339SR is a 24-pin USB 3.1 Type-C female receptacle featuring a space-saving mid-mount hybrid termination (sink center height CH=0.75mm, overall length L=9.21mm). Constructed with a high-temperature UL94 V-0 thermoplastic housing, a nickel-plated stainless steel shell, an internal stainless steel mid-plate, and EMC shielding, it incorporates 24 gold-plated copper alloy contacts supporting high-speed data transmission and reliable power delivery (3.0A on VBUS pins A4, A9, B4, B9; 1.25A on signal pins). Its hybrid architecture—pairing 12 through-hole front pins and 12 surface-mount rear contacts with robust through-hole shell stakes—provides outstanding mechanical retention against heavy mating cycles across an operating temperature range of -40°C to +85°C.
-
Application Notes:
-
PCB Edge Cutout & Sink Alignment: Designed for mid-mount installation with a 0.75mm center drop height (CH=0.75mm) and 9.21mm total body depth; strictly adhere to the recommended PCB layout (cutout width 9.50mm / 12.15mm) to ensure precise board seating and front-panel clearance.
-
Hybrid DIP + SMT Termination: Features a mixed terminal layout with 12 front through-hole pins (12-Ø0.40mm holes) and 12 rear SMT pads (0.35mm pad width, 0.50mm pitch), combined with 6 outer shell through-hole DIP retention legs (6-0.50×1.00mm); ensure proper solder paste stencil apertures and complete through-hole solder fill.
-
Lead-Free Reflow & Soldering Process: Molded from high-temperature UL94 V-0 thermoplastic, fully compatible with standard RoHS lead-free reflow and selective/pin-in-paste soldering profiles (peak temperature up to 260°C).
-
Shielding & Grounding: Combines a nickel-plated stainless steel outer shell, unplated stainless steel mid-plate, and dedicated EMC shielding to deliver continuous 360-degree EMI/RFI suppression while absorbing mechanical mating forces.
-
