2026年7月9日
How to Vet Wiring Harness Suppliers for Custom OEM Assemblies
Learn to vet wiring harness suppliers forensically: live crimp-force curves, 100% continuity tests, and IPC/WHMA-A-620 compliance. Stop field...
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Drop-in Replacement
- Competitor Part Number
- Molex 105444 Series / TE Connectivity 2320115 Series (Depending on exact PCB cutout tolerances)
- Mates With
- Standard USB Type-C Plugs & Cable Assemblies
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
Material Composition
| Material | Value / Description |
|---|---|
| Housing / Insulator | High-Temperature LCP, UL94V-0 Rated (Black) |
| Contacts | Copper Alloy, Au 15μ" on Contact Area, Au 1~3μ" on Solder Area, 50μ" Min Nickel Underplate |
| Outer Shell | Dual Stainless Steel Shells (Shell-1 & Shell-2) & Mid Plate with 50μ" Min Nickel Plating |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Voltage Rating | 100V AC |
| Current Rating | 1.5A/Pin (VBUS: A4, A9, B4, B9) / 1.25A/Pin (GND: A1, A12, B1, B12) / 0.25A (Other Pins) |
| Mating Cycles | 10,000 Cycles (Minimum) |
| Operating Temperature | -40°C to +85°C |
| Contact Resistance | 30 mΩ Max |
| Recommended PCB Thickness | 0.80mm |
| Insertion | 5N–20N |
| Unmating | 8N–20N (Initial), 6N–20N (After 10k Cycles) |
Application Scenarios
-
Ultra-Thin Laptops & Tablets: Leverages the 1.60mm mid-mount sink profile and 0.80mm PCB design to minimize Z-axis height for sleek enclosure styling with 10Gbps SuperSpeed+ data throughput.
-
Industrial Panel PCs (IPCs): Dual-SMT termination with dual-layer spot-welded stainless steel shells (pulling force > 50N) ensures superior signal integrity and mechanical retention against severe vibration.
-
Portable Medical Diagnostic Monitors: High-reliability Au 15μ" contact plating and 10,000-cycle durability deliver dependable video and data transmission in space-constrained medical hardware.
-
Smart Home Hubs & Docking Stations: Serves as a low-profile high-speed peripheral interface handling 10Gbps data and multi-channel I/O in compact form factors.
Frequently Asked Questions
What are the exact sink dimensions and recommended PCB thickness for EU24F2B3N11406SR?
The connector features a 1.60mm mid-mount sink depth with a 2.40mm tongue protrusion, engineered specifically for a recommended PCB thickness of 0.80mm.
What are the contact plating and current ratings specified in the engineering drawing?
The copper alloy contacts feature Au 15u" gold plating on mating areas and Au 1~3u" on solder tails over a 50u" nickel underplate, rated for 1.5A/pin max on VBUS contacts and 1.25A/pin max on GND contacts.
Does this connector support the latest USB Power Delivery standards?
The connector is rated for 1.5A/pin max on VBUS power pins (pins A4, A9, B4, B9) and 1.25A/pin max on GND pins, providing reliable standard bus power transfer and signal integrity up to 100V AC dielectric withstanding voltage.
What is the standard MOQ and lead time for mass production?
Our standard Minimum Order Quantity (MOQ) is typically 1,000 pieces per reel. Lead times range from 2 to 4 weeks depending on current factory capacity, with rapid prototyping options available in 3-5 days.
Do you provide STEP files and PCB footprint recommendations?
Absolutely. We offer comprehensive engineering support, including 2D drawings, 3D STEP files, and recommended mid-mount PCB cutout guidelines for your hardware design team.
Overview and Application Notes
-
Overview: Engineered for ultra-thin consumer electronics, portable medical equipment, and high-density industrial devices, the EU24F2B3N11406SR is a premium 24-pin USB 3.2 Gen2 Type-C female receptacle featuring a space-saving mid-mount dual-SMT configuration (sink depth 1.60mm, tongue protrusion 2.40mm). Constructed with a high-temperature UL94 V-0 black LCP housing, dual stainless steel shielding shells (Shell-1 & Shell-2 with 50u” min Ni plating), an internal stainless steel mid-plate, and 24 copper alloy contacts (Au 15u” plating on contact area, Au 1~3u” on solder area), it delivers 10 Gbps SuperSpeed+ data transmission and stable power transfer (1.5A max on VBUS pins, 1.25A max on GND pins). The dual-SMT surface mount architecture provides seamless automated lead-free reflow assembly, exceptional EMI suppression, and an operating temperature range of -40°C to +85°C across 10,000 mating cycles.
-
Application Notes:
-
PCB Cutout & Mid-Mount Alignment: Designed for mid-mount sink installation with a 1.60mm sink depth (flat mouth, 2.40mm tongue protrusion); strictly follow the recommended PCB layout (cutout width 8.64mm, recommended PCB thickness 0.80mm) to ensure precise terminal coplanarity and flush enclosure seating.
-
Dual-SMT Soldering & Stencil Design: Features a dual-row SMT layout with 24 surface-mount contact pads and outer shell grounding pads; precisely calibrate solder stencil aperture and paste volume to prevent bridging across fine-pitch terminals.
-
Lead-Free Reflow Compatibility: Molded from high-temperature UL94 V-0 black LCP thermoplastic, fully compatible with standard RoHS lead-free IR reflow soldering processes (peak temperature up to 260°C).
-
Dual-Shell EMI Shielding & Retention: Built with dual spot-welded stainless steel shells (pulling force > 50N, spot height < 0.05mm) and an internal mid-plate to deliver seamless 360-degree shielding while withstanding plug insertion force > 13.6kg, initial 5N–20N insertion force, and 6N–20N durability extraction force.
-
