2023年7月7日
A Comprehensive Guide to Wire Harness Design, Development, and Manufacturing
Introduction In the complex world of electronic devices, a wire harness plays a pivotal role in transmitting electrical...
Rapid Prototyping in 3-5 Days
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Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
| Material | Value / Description |
|---|---|
| Housing Material | Liquid Crystal Polymer (LCP), Black, UL 94V-0 |
| Contact Material | Phosphor Bronze (C5191, T=0.12mm) |
| Contact Plating | Gold Plating 1 u" (AU 1u") |
| Shell Material | Brass (C2680, T=0.30mm) |
| Shell Plating | Nickel Plated overall |
| Characteristic | Value |
|---|---|
| Contact Resistance | 30 mΩ Max. |
| Insulation Resistance | 1000 MΩ Min. |
| Dielectric Withstanding Voltage | AC 500V, 1 Minute |
| Operating Temperature Range | -25°C to +85°C |
| General Tolerances | 0 Place: ±0.50 mm; 1 Place: ±0.35 mm; 2 Place: ±0.25 mm; 3 Place: ±0.15 mm; Angular: ±3° |
Embedded Single Board Computers (SBC) and compact industrial motherboards
Ultra-thin digital cameras, camcorders, and portable video recording systems
Handheld test equipment, diagnostic devices, and field instruments
Drone payload systems, gimbal controllers, and miniature FPV video transmitters
Wearable enterprise devices, AR/VR optical modules, and portable medical monitors
The Micro HDMI Type D 19-Pin female receptacle is designed for high-density audio/video signal transmission in ultra-compact electronics. Featuring a top-mount dual-row SMT layout with a center height of 1.55mm, this interface provides robust signal integrity and compact board integration.
Engineered for high-volume automated SMT pick-and-place assembly, the connector features dual-row contact leads paired with sturdy shell retention posts to absorb mechanical insertion stress. The center height of 1.55mm ensures seamless alignment with ultra-thin enclosure apertures. For reliable solder fillet formation and structural grounding, adhere strictly to the recommended PCB land pattern tolerances and stencil aperture guidelines.
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