B2B Electronic Connection Solution

Dual-Port Stacked USB 3.0 Type-A Receptacle, Horizontal PCB Mount (PN: EU18FL2N1234)

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Dual-Port Stacked USB 3.0 Type-A Receptacle, Horizontal PCB Mount (PN: EU18FL2N1234)

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Product Specifications

Key parameters for OEM, distributor and engineering evaluation.

Parameters
USB Connector Style
Type A
USB Version
3.0
Interface
A
Waterproof
N/A
Approvals
N/A
Gender
Dual Receptacle
PCB Orientation
Horizontal
Number of Contacts
18
PCB Mount Position
Top Mount
Elevated
Yes
Mating Cycles
1,500
Power Rating
N/A
Current Rating
1.8A
Contact Pin Type
Through Hole
Voltage Rating
30V AC/DC
Shell Stake Type
Through Hole
Locating Peg
Without
Mating Face Lead In
With

Detailed Product Information

Technical Data & Reference

Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.

Competitor & Cross-Reference

Alternative Type
Drop-in Replacement
Competitor Part Number
Amphenol GSB311231HR / TE Connectivity 1932258-1 / Molex 48405-0001
Mates With
Standard USB 3.0 Type-A Male Cable Assemblies / Plugs

Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.

Material Composition

Material Value / Description
Contact Material Phosphor Bronze / Copper Alloy
Contact Plating Selective Gold Plating on Contact Area, Tin on Solder Tails, over Nickel Underplate
Housing Material High-Temperature Thermoplastic / LCP (UL94V-0 Rated)
Shield / Shell Stainless Steel or Brass Alloy, Nickel Plated

Technical Characteristics

Characteristic Value
Rated Voltage 30V AC/DC
Current Rating 1.8A (Power Pins), 0.5A (Signal Pins)
Dielectric Withstanding Voltage 100V AC per minute
Insulation Resistance 100 MΩ Min.
Contact Resistance 30 mΩ Max.
Operating Temperature -40°C to +85°C
Mating Cycles 1,500 Cycles Min.
Flammability Rating UL94V-0

Application Scenarios

  • Industrial PCs & Embedded Automation Controls : Provides high-speed dual USB 3.0 expansion ports on compact motherboard designs for connecting peripheral sensors, flash drives, and vision cameras.

  • Networking Routers & Edge Gateways : Offers high-density I/O connectivity in network hardware where panel space is at a premium and dual SuperSpeed data access is required.

  • Medical Diagnostic Equipment & Workstations : Ensures reliable, EMI-shielded signal transmission for external diagnostic modules and handheld data logging devices.

  • Automotive & Transportation Control Units : Delivers robust through-hole mechanical retention capable of enduring high-vibration environments in commercial vehicle fleet telemetry.

Frequently Asked Questions

Are compliance certifications like RoHS and REACH available for this connector?
Yes. All our connectors, including the 25.EU18FL2N1234 dual USB 3.0 receptacle, strictly comply with RoHS 3.0 and REACH environmental standards. Material test reports and compliance certificates are available upon request.
What customization options are available for OEM orders?
As an OEM manufacturer, we offer custom gold plating thicknesses (from Gold Flash up to 30u"), custom pin tail lengths, alternative shell staking options, and modified housing materials to meet high-temperature or specific environmental requirements.
What is the minimum order quantity (MOQ) and typical production lead time?
Our standard MOQ for connector components is 1,000 pieces. Sample prototyping takes approximately 3–5 days, while full volume production lead time typically ranges from 2 to 3 weeks depending on order quantity.
How does the through-hole mounting design benefit high-vibration applications?
The dual through-hole shell stakes and through-hole signal pins create strong mechanical anchor points on the PCB, providing significantly higher retention force and strain relief compared to surface-mount (SMT) designs.
Can this connector withstand standard wave soldering automated assembly?
Yes. The insulator housing is molded from high-temperature thermoplastic capable of withstanding standard lead-free wave soldering profiles with peak temperatures up to 260°C.

Overview and Application Notes

Overview

The Dual-Port Stacked USB 3.0 Type-A Receptacle (PN: EU18FL2N1234) is an industrial-grade, high-density connector engineered for space-constrained PCB designs requiring dual SuperSpeed USB connectivity. Featuring an 18-pin through-hole configuration (9 pins per port) and robust EMI/RFI shielding, this dual receptacle delivers data transfer speeds up to 5 Gbps while maintaining strict signal integrity. Designed for elevated horizontal top-mount PCB installation, it provides superior mechanical stability and mating durability up to 1,500 cycles. As a factory-direct OEM/ODM provider, EDOM Electronics offers customized contact plating, housing modifications, and rigorous quality testing to meet demanding commercial and industrial standards.

Application Notes

  • Grounding & EMI Control: Ensure all shell solder stakes are fully tied to the system ground plane to provide optimal shielding against electromagnetic interference and high-frequency noise.

  • PCB Layout & Clearance: Maintain recommended solder pad spacing for all 18 contacts to prevent solder bridging during automated wave soldering processes.

  • Mechanical Load Relief: Incorporate adequate panel cutout clearance to prevent physical strain on the PCB solder tails when external cable assemblies are plugged or unplugged.

  • Thermal Profiling: Compatible with standard lead-free wave soldering profiles; verify peak temperature limits (up to 260°C for 5 seconds) to avoid housing deformation.

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Product Document

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Use this document for internal review, engineering comparison, and RFQ preparation.

EU18FL2N1234-USB3.0 AF

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  • 1 Target quantity, annual forecast, and delivery destination.
  • 2 Drawing, datasheet, sample photo, or current supplier part number.
  • 3 Electrical, mechanical, compliance, testing, and packaging requirements.