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RJ45 8P8C Female Modular Jack Mid-Mount Sinking H8.60 SMT Full-Shield | EDOM

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RJ45 8P8C Female Modular Jack Mid-Mount Sinking H8.60 SMT Full-Shield | EDOM

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Product Specifications

Key parameters for OEM, distributor and engineering evaluation.

Parameters
Category
Cat3
Mount type options
Surface Mount
PCB orientation options
Right Angle
Number of positions
8
Positions loaded
8
Latch position
Standard (latch bottom)
Shielding
Shielded

Detailed Product Information

Technical Data & Reference

Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.

Competitor & Cross-Reference

Alternative Type
Drop-in Replacement
Competitor Part Number
Amphenol RJCSE-5380-01 / Molex 85505 Series Alternative
Mates With
Standard RJ45 / 8P8C Male Ethernet Plugs (Cat5e / Cat6)

Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.

Technical Specifications

Connector Type
RJ45 8P8C Female Modular Jack
Number of Positions / Contacts
8 Positions / 8 Contacts (8P8C)
Mounting Type
Mid-Mount (Sinking) / Surface Mount (SMT) Right Angle
Sinking Profile Height (H)
8.60 mm
Shielding Style
Full-Shielded (Full-Wrap Shield)
Overall Dimensions (L x W x H)
17.24 mm x 14.40 mm x 11.50 mm (Excluding solder tabs)
Signal Pin Pitch
1.016 mm (7.11 mm total span across 8 pins)
Coplanarity
0.10 mm Max.
PCB Locating & Alignment Holes
Dual Ø1.00 mm locating holes, Dual Ø1.90 mm alignment holes
Recommended PCB Cutout Width
13.59 mm (14.20 mm at outer relief steps, 19.44 mm overall span)
Standard Compliance
RoHS Compliant, UL 94V-0

Material Composition

Material Value / Description
Housing Material Thermoplastic Liquid Crystal Polymer (LCP), UL 94V-0
Contact Material & Plating Phosphor Bronze (C5191), Selective Au/Sn Plated
Shell Material & Plating Copper Alloy (C2680), Nickel (Ni) Plated

Technical Characteristics

Characteristic Value
Voltage Rating 125 VAC RMS
Current Rating 1.5 A
Contact Resistance 30 mΩ Max.
Insulation Resistance 1000 MΩ Min.
Dielectric Strength 1000V AC RMS 50Hz, 1 Minute
Operating Temperature Range -40°C to +85°C
Relative Humidity Resistance 90% ~ 95% RH (40°C ± 2°C)
General Dimensional Tolerances 0 Place: ±0.50 mm; 1 Place: ±0.35 mm; 2 Place: ±0.25 mm; 3 Place: ±0.15 mm; Angular: ±3°

Application Scenarios

  • Ultra-slim Single Board Computers (SBC) and embedded computing motherboards

  • Compact industrial IoT gateways, edge routers, and switches

  • Commercial smart POS terminals, interactive digital kiosks, and thin display hardware

  • Networked video surveillance hardware, IP cameras, and NVR controllers

  • Low-profile DIN-rail communications hardware with tight vertical chassis restrictions

Frequently Asked Questions

What are the mechanical advantages of an 8.60mm sinking mid-mount full-shield RJ45 jack?
Sinking 8.60mm into a pre-routed PCB edge cutout drops the connector body into the board plane, significantly reducing the vertical profile above the PCB. This full-wrap version incorporates 360-degree copper alloy shielding with wide side SMT solder pads and alignment pegs to absorb repeated mating shock and vibration.
What is the recommended PCB cutout and footprint for this sinking SMT jack?
The board requires an edge cutout widening from 13.59mm to 14.20mm with 0.40mm process clearance gaps. The footprint features 8 SMT signal pads (1.016mm pitch, 0.70mm width), two Ø1.00mm locating holes, two Ø1.90mm alignment holes, and dual 4.30mm x 8.05mm ground solder pads holding ±0.05mm positioning tolerances.
How do the full-wrap shield and contact plating ensure signal integrity and corrosion resistance?
The shell is formed from C2680 copper alloy with nickel plating to provide comprehensive EMI/RFI shielding and oxidation defense. The C5191 phosphor bronze contacts feature selective gold plating on mating points and tin plating on solder areas, maintaining contact resistance below 30 mΩ under 90%–95% RH conditions.
What reflow temperature and electrical isolation standards does this connector meet?
The connector housing is molded from high-temp thermoplastic LCP (UL 94V-0) to maintain strict 0.10mm coplanarity during lead-free reflow soldering. Electrically, it delivers 1000V AC RMS dielectric strength and a minimum insulation resistance of 1000 MΩ across an industrial -40°C to +85°C thermal range.

Overview and Application Notes

This mid-mount sinking RJ45 8P8C female modular jack features an 8.60mm drop-in profile height, surface-mount (SMT) signal interface, and a full-wrap metal shielding enclosure. Engineered for ultra-compact networking devices, it dramatically recesses the connector body into the PCB cutout to lower above-board clearance while providing 360-degree EMI/RFI shielding, 0.10mm coplanarity precision, and rugged board-level grounding for slim embedded computing and IoT gateways.

Key Features

  • Modular Port Configuration: Standard 8 positions and 8 contacts (8P8C) female modular interface.
  • Deep Mid-Mount Sinking Profile: 8.60mm drop-in sinking profile significantly minimizes above-board vertical stack height.
  • Surface-Mount Signal Termination: 8-pin SMT straight contacts with strict 0.10mm maximum coplanarity for automated reflow assembly.
  • Full-Wrap Shielding: C2680 copper alloy full-metal enclosure delivers complete 360-degree EMI/RFI suppression with side and rear ground tabs.
  • High-Temperature Polymer: Thermoplastic LCP housing (UL 94V-0) supports standard lead-free convection reflow soldering profiles.
  • Robust Electrical Performance: Rated at 125 VAC RMS / 1.5A, contact resistance ≤ 30 mΩ, insulation resistance ≥ 1000 MΩ, and dielectric strength of 1000V AC RMS.
  • Industrial Thermal Range: Tested and validated for continuous operation from -40°C to +85°C under 90%–95% relative humidity.

Engineering Specifications & PCB Integration

Designed for panel-edge routing cutouts requiring a 13.59mm to 14.20mm notch width with 0.40mm clearance offsets and an overall 19.44mm outer ground pad span. The SMT footprint features 8 signal pads on a 1.016mm pitch (7.11mm total span, 0.70mm pad width) resting on standard FR-4 circuit boards, complemented by dual Ø1.00mm locating pegs, dual Ø1.90mm alignment holes, and dual 4.30mm x 8.05mm side ground pads holding ±0.05mm positioning tolerances.

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Product Document

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Use this document for internal review, engineering comparison, and RFQ preparation.

RJ45-8P8C-Female-Mid-Mount-Sinking-H8.60-SMT-Full-Shield-Datasheet

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