2026年7月30日
Wiring and Harness Design for OEM Buyers: Key Specification Points
Get essential wiring and harness design specs for OEM buyers: wire gauge, connectors, routing. Prevent costly errors—read now.
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Drop-in Replacement
- Competitor Part Number
- TE Connectivity 1932258-1 / Amphenol GSB311131HR (Functional equivalent)
- Mates With
- Standard USB 3.0 and backward-compatible USB 2.0 Type-A Plugs (Cable Assemblies)
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
Material Composition
| Material | Value / Description |
|---|---|
| Insulator / Housing | High-Temperature Thermoplastic (UL94V-0 Rated), Blue |
| Contacts | Copper Alloy |
| Contact Plating | Gold Flash on Mating Area, Tin on Solder Tails, Nickel Underplate |
| Shell | Stainless Steel or Brass, Nickel Plated |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Voltage Rating | 30V AC/DC |
| Current Rating | 1.8A Max for VBUS & GND; 0.25A for other contacts |
| Contact Resistance | 30 mΩ Max (Initial) |
| Insulation Resistance | 1000 MΩ Min at 500V DC |
| Dielectric Withstanding | 500V AC for 1 Minute |
| Mating Cycles | 10,000 Cycles |
| Operating Temperature | -40°C to +85°C |
Application Scenarios
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Industrial Panel PCs & HMIs : Utilizes the reverse mid-mount design to drastically reduce the vertical profile of the motherboard, enabling ultra-slim touchscreen enclosures without sacrificing physical durability on the factory floor.
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Medical Diagnostic Equipment : Provides highly reliable, 10,000-cycle high-speed 5 Gbps data connections essential for portable imaging carts and critical patient monitoring systems.
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Test & Measurement Devices : Delivers a rugged, through-hole anchored diagnostic interface capable of withstanding constant plug-ins and lateral stress from field technicians.
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Embedded Computing & Thin Clients : Solves severe space constraints in compact mini-PCs by sinking the connector directly into the PCB cutout, maximizing internal layout efficiency and thermal airflow.
Frequently Asked Questions
What is the standard Minimum Order Quantity (MOQ) for this USB 3.0 mid-mount receptacle?
Our standard MOQ for tray or tape-and-reel packaging is typically 1,000 to 3,000 pieces per batch for volume production. However, we offer flexible prototype quantities for engineering validation and NPI (New Product Introduction) builds.
Can the gold plating thickness on the mating contacts be customized?
Yes. While Gold Flash is our standard offering, we can customize the plating thickness up to 15μ" or 30μ" gold over nickel to meet strict military or harsh-environment industrial specifications upon request.
Is this connector a functional replacement for major brands like TE Connectivity or Amphenol?
Yes, the 13.EU09FL1N12156 features an industry-standard reverse mid-mount footprint, making it a highly cost-effective, drop-in alternative for many tier-1 brand part numbers. We highly encourage requesting 3D CAD models (STEP/IGES) to verify your PCB cutout tolerances.
Are the thermoplastic housings compatible with reflow soldering?
This specific part is designed with DIP through-hole pins optimized for wave soldering. If your automated assembly process requires Pin-in-Paste (intrusive reflow), we can manufacture the insulator using specialized high-temp LCP plastics. Please specify this requirement during your RFQ.
What are the typical lead times for bulk OEM production?
Standard factory lead times range between 2 to 4 weeks, depending on order volume and raw material availability. Expedited production schedules can be arranged for critical OEM projects.
Overview and Application Notes
Overview The EU09FL1N12156 is a premium industrial-grade USB 3.0 Type-A female receptacle featuring a space-saving reverse mid-mount (sink-board) architecture. Engineered with a highly durable right-angle through-hole (DIP) design, it delivers exceptional mechanical stability against heavy mating forces in harsh environments. Capable of supporting 5 Gbps SuperSpeed data transmission and rigorously tested for 10,000 mating cycles, this connector is the ultimate choice for OEM industrial PCs, automation controllers, and compact commercial electronics. As a factory-direct manufacturing partner, we provide tailored solutions and flexible packaging to integrate seamlessly into your automated SMT/DIP assembly lines.
Application Notes
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Footprint & Clearance: The reverse mid-mount configuration requires a precise PCB cutout. Thoroughly verify the 3D CAD models and mechanical drawings to ensure adequate clearance for the connector body to achieve the desired vertical height reduction.
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Soldering Guidelines: The through-hole contact pins and shell stakes are optimized for standard wave soldering processes. Maintain strict thermal profiling to prevent heat damage to the UL94V-0 thermoplastic insulator.
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Impedance Matching: To guarantee 5 Gbps signal integrity, ensure the SuperSpeed differential pairs (SSTX/SSRX) on your printed circuit board are routed with a strict 90-ohm differential impedance.
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EMI/RFI Shielding: Connect the through-hole metal shell stakes directly to the continuous PCB ground plane to maximize electromagnetic shielding effectiveness, which is critical for noisy industrial applications.
