2026年7月31日
What Is a Cable Assembly? Definition, Components, and Applications
What is a cable assembly? Learn the engineered definition per IPC/WHMA-A-620, key components, and applications. Avoid mismatched specs—read...
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Product Specifications
Key parameters for OEM, distributor and engineering evaluation.
Detailed Product Information
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
| Material | Value / Description |
|---|---|
| Housing Material | LCP (UL 94V-0), Black |
| Contact Material | Copper Alloy |
| Contact Plating | 1u" Gold on Contact Area, 100u" Tin on Solder Tails |
| Shielding Shell | Steel, Nickel Plated (50u" Min) |
| Characteristic | Value |
|---|---|
| Rated Voltage | 30V AC (RMS) Max |
| Rated Current | 1.5A |
| Contact Resistance | 30 mΩ Max (Initial) |
| Insulation Resistance | 1000 MΩ Min |
| Dielectric Withstanding | 500V AC for 1 minute |
| Mating Cycles | 5,000 Cycles |
| Operating Temperature | -25°C to +85°C |
PCB Footprint & Coplanarity: Ensure strict adherence to the recommended PCB layout tolerances (1.00mm pitch) to maintain SMT pad coplanarity during reflow soldering.
Mechanical Grounding: The through-hole steel shell stakes must be securely soldered to the PCB ground plane. This is critical for absorbing the mechanical stress of frequent plugging (5,000 cycles) and providing effective 360° EMI/RFI shielding.
Thermal Profiling: The high-temperature black LCP housing supports standard lead-free SMT reflow soldering processes within an operating temperature range of -25°C to +85°C. Ensure thermal profiles adhere to standard JEDEC guidelines.
Impedance Control: Maintain 90Ω differential impedance routing on the PCB for the SuperSpeed data traces to prevent signal degradation and maintain 5 Gbps performance.
Overview Engineered for reliable high-speed data transmission in space-constrained industrial and commercial environments, this vertical USB 3.0 Type-A receptacle delivers up to 5 Gbps SuperSpeed bandwidth in a space-saving top-mount footprint. The 11.50mm elevated vertical profile is optimized for seamless top-facing accessibility on dense PCB layouts. Featuring surface-mount (SMT) signal pins for precise automated assembly, an integrated pick-and-place cap, and through-hole steel shell stakes for rugged mechanical retention, it delivers a rated durability of 5,000 mating cycles. Constructed with a high-temperature black LCP insulator (UL 94V-0) and rated for an operating temperature of -25°C to +85°C, this receptacle supports efficient reflow soldering. As a direct factory OEM/ODM partner, EDOM Electronics provides customizable contact plating options and tape-and-reel packaging ready for high-speed automated production lines.
Application Notes
Industrial PCs (IPCs) & Motherboards: Provides a vertically oriented, space-saving 5 Gbps high-speed data interface for embedded motherboards where horizontal edge mounting is not feasible.
Self-Service Kiosks & POS Terminals: Guarantees reliable connectivity with standard 5,000-cycle durability, providing stable peripheral expansion for commercial point-of-sale systems.
Medical Diagnostic Equipment: Delivers secure high-bandwidth data logging, 500V AC dielectric withstanding voltage, and 1000 MΩ insulation resistance for stationary carts and diagnostic mainframes.
Telecommunications & Edge Routers: Acts as a rugged vertical top-facing diagnostic port, firmware upgrade interface, or expansion slot across operating temperatures of -25°C to +85°C.
2026年7月31日
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