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USB 3.0 Type-A Receptacle, Vertical SMT, H11.5mm (PN: EU09FG1N12274)

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USB 3.0 Type-A Receptacle, Vertical SMT, H11.5mm (PN: EU09FG1N12274)

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Product Specifications

Key parameters for OEM, distributor and engineering evaluation.

Parameters
USB Connector Style
Type A
USB Version
3.0
Interface
A
Waterproof
N/A
Approvals
N/A
Gender
Receptacle (socket)
PCB Orientation
Vertical
Number of Contacts
9
PCB Mount Position
Top Mount
Elevated
Yes
Mating Cycles
5,000
Power Rating
N/A
Current Rating
1.5A
Contact Pin Type
Surface Mount
Voltage Rating
30V AC/DC
Shell Stake Type
Through Hole
Locating Peg
Without
Mating Face Lead In
Without

Detailed Product Information

Technical Data & Reference

Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.

Competitor & Cross-Reference

Alternative Type
Drop-in Replacement
Competitor Part Number
Wurth Elektronik 692112030100 / Amphenol GSB3111 Series (Vertical SMT configurations)
Mates With
Standard USB 3.0 & 2.0 Type-A Male Cable Assemblies

Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.

Material Composition

Material Value / Description
Housing Material LCP (UL 94V-0), Black
Contact Material Copper Alloy
Contact Plating 1u" Gold on Contact Area, 100u" Tin on Solder Tails
Shielding Shell Steel, Nickel Plated (50u" Min)

Technical Characteristics

Characteristic Value
Rated Voltage 30V AC (RMS) Max
Rated Current 1.5A
Contact Resistance 30 mΩ Max (Initial)
Insulation Resistance 1000 MΩ Min
Dielectric Withstanding 500V AC for 1 minute
Mating Cycles 5,000 Cycles
Operating Temperature -25°C to +85°C

Application Scenarios

  • PCB Footprint & Coplanarity: Ensure strict adherence to the recommended PCB layout tolerances (1.00mm pitch) to maintain SMT pad coplanarity during reflow soldering.

  • Mechanical Grounding: The through-hole steel shell stakes must be securely soldered to the PCB ground plane. This is critical for absorbing the mechanical stress of frequent plugging (5,000 cycles) and providing effective 360° EMI/RFI shielding.

  • Thermal Profiling: The high-temperature black LCP housing supports standard lead-free SMT reflow soldering processes within an operating temperature range of -25°C to +85°C. Ensure thermal profiles adhere to standard JEDEC guidelines.

  • Impedance Control: Maintain 90Ω differential impedance routing on the PCB for the SuperSpeed data traces to prevent signal degradation and maintain 5 Gbps performance.

Frequently Asked Questions

Is this vertical USB connector suitable for automated SMT assembly?
Yes. The signal contacts are designed for Surface Mount Technology (SMT), and the housing is molded from high-temperature black LCP to withstand standard lead-free reflow soldering profiles. The parts include a pick-and-place cap and are supplied in tape-and-reel packaging for automated placement machines.
What are the durability rating and electrical specifications of this receptacle?
The receptacle is rated for 5,000 mating cycles. Electrically, it supports a contact current rating of 1.5A, a contact resistance of 30 mΩ max, insulation resistance of 1000 MΩ min, and dielectric withstanding voltage of 500V AC (for 1 minute).
Can we request thicker gold plating for demanding applications?
Yes. While our standard configuration features 1u" gold plating on the contact interface, EDOM provides custom OEM plating options up to 30µ" (micro-inches) to enhance corrosion resistance and electrical reliability in harsh environments.
What materials are used for the housing, contacts, and outer shell?
The insulator is molded from high-temperature black LCP (UL 94V-0 rated). The contacts are copper alloy plated with 1u" gold on the mating area and 100u" tin on solder tails. The outer shielding shell is made of steel with 50u" minimum nickel plating for robust EMI shielding and mechanical ground retention.
Are you a direct manufacturer? What is the standard MOQ and lead time?
EDOM is an ISO-certified direct connector manufacturer. We support flexible MOQs for engineering evaluation and prototyping, with standard mass production lead times typically between 2 to 3 weeks based on volume and packaging requirements.

Overview and Application Notes

Overview Engineered for reliable high-speed data transmission in space-constrained industrial and commercial environments, this vertical USB 3.0 Type-A receptacle delivers up to 5 Gbps SuperSpeed bandwidth in a space-saving top-mount footprint. The 11.50mm elevated vertical profile is optimized for seamless top-facing accessibility on dense PCB layouts. Featuring surface-mount (SMT) signal pins for precise automated assembly, an integrated pick-and-place cap, and through-hole steel shell stakes for rugged mechanical retention, it delivers a rated durability of 5,000 mating cycles. Constructed with a high-temperature black LCP insulator (UL 94V-0) and rated for an operating temperature of -25°C to +85°C, this receptacle supports efficient reflow soldering. As a direct factory OEM/ODM partner, EDOM Electronics provides customizable contact plating options and tape-and-reel packaging ready for high-speed automated production lines.

Application Notes

  • Industrial PCs (IPCs) & Motherboards: Provides a vertically oriented, space-saving 5 Gbps high-speed data interface for embedded motherboards where horizontal edge mounting is not feasible.

  • Self-Service Kiosks & POS Terminals: Guarantees reliable connectivity with standard 5,000-cycle durability, providing stable peripheral expansion for commercial point-of-sale systems.

  • Medical Diagnostic Equipment: Delivers secure high-bandwidth data logging, 500V AC dielectric withstanding voltage, and 1000 MΩ insulation resistance for stationary carts and diagnostic mainframes.

  • Telecommunications & Edge Routers: Acts as a rugged vertical top-facing diagnostic port, firmware upgrade interface, or expansion slot across operating temperatures of -25°C to +85°C.

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Product Document

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Use this document for internal review, engineering comparison, and RFQ preparation.

EU09FG1N12274-USB3.0 AF VERTICAL SMT H11.50

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  • 1 Target quantity, annual forecast, and delivery destination.
  • 2 Drawing, datasheet, sample photo, or current supplier part number.
  • 3 Electrical, mechanical, compliance, testing, and packaging requirements.