B2B Electronic Connection Solution

USB 3.0 Type-A Receptacle, Vertical SMT, H11.5mm (PN: EU09FG1N12274)

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EU09FG1N12274-USB3.0 AF VERTICAL SMT H11.50
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USB 3.0 Type-A Receptacle, Vertical SMT, H11.5mm (PN: EU09FG1N12274)

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Product Specifications

Key parameters for OEM, distributor and engineering evaluation.

Parameters
USB Connector Style
Type A
USB Version
3.0
Interface
A
Waterproof
N/A
Approvals
N/A
Gender
Receptacle (socket)
PCB Orientation
Vertical
Number of Contacts
9
PCB Mount Position
Top Mount
Elevated
Yes
Mating Cycles
10,000
Power Rating
N/A
Current Rating
1.8A
Contact Pin Type
Surface Mount
Voltage Rating
30V AC/DC
Shell Stake Type
Through Hole
Locating Peg
Without
Mating Face Lead In
Without

Detailed Product Information

Technical Data & Reference

Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.

Competitor & Cross-Reference

Alternative Type
Drop-in Replacement
Competitor Part Number
Wurth Elektronik 692112030100 / Amphenol GSB3111 Series (Vertical SMT configurations)
Mates With
Standard USB 3.0 & 2.0 Type-A Male Cable Assemblies

Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.

Material Composition

Material Value / Description
Housing Material High-Temperature Thermoplastic (UL 94V-0), LCP
Contact Material Copper Alloy
Contact Plating Gold Flash on Contact Area, Tin on Solder Tails
Shielding Shell Brass / Stainless Steel, Nickel Plated

Technical Characteristics

Characteristic Value
Rated Voltage 30V AC (RMS) Max
Rated Current 1.8A (Pin 1 & 4), 0.25A (Other Pins)
Contact Resistance 30 mΩ Max (Initial)
Insulation Resistance 1000 MΩ Min
Dielectric Withstanding 500V AC for 1 minute
Mating Cycles 10,000 Cycles
Operating Temperature -40°C to +85°C

Application Scenarios

  • Industrial PCs (IPCs) & Motherboards: Provides a vertically oriented, space-saving high-speed data interface for embedded motherboards where horizontal edge mounting is not feasible.

  • Self-Service Kiosks & POS Terminals: Guarantees long-term reliability with an extended 10,000-cycle lifespan, drastically reducing maintenance costs in high-traffic commercial environments.

  • Medical Diagnostic Equipment: Ensures secure, high-bandwidth data logging and peripheral connections for stationary medical carts and diagnostic mainframes.

  • Telecommunications & Edge Routers: Acts as a reliable physical diagnostic, firmware update, or expansion interface on the top face of networking boards.

Frequently Asked Questions

Is this vertical USB connector suitable for automated SMT assembly?
Yes. The signal contacts are designed for Surface Mount Technology (SMT), and the housing is molded from high-temperature LCP to withstand standard lead-free reflow soldering profiles. The parts can be supplied in tape-and-reel packaging for pick-and-place machines.
How does the connector achieve the rated 10,000 mating cycles?
The robust design combines high-quality copper alloy contacts, optimized retention spring forces, and through-hole shell stakes that transfer plugging stress directly to the PCB, preventing pad lifting over time.
Can we request thicker gold plating for harsh environments?
Absolutely. While standard plating is often gold flash, we offer custom OEM plating thickness up to 30µ" (micro-inches) to enhance corrosion resistance and durability in challenging industrial settings.
Are you a direct manufacturer? What is the MOQ and lead time?
We are an ISO-certified direct manufacturer. Our standard MOQ is flexible for prototyping, and typical mass production lead time is 2 to 3 weeks depending on the order volume and packaging requirements.

Overview and Application Notes

Overview Engineered for reliable high-speed data transmission in space-constrained industrial environments, this vertical USB 3.0 Type-A receptacle delivers up to 5 Gbps bandwidth in a robust top-mount footprint. The 11.50mm elevated profile is optimized for easy access on complex PCB layouts. Featuring surface-mount (SMT) signal pins for precise automated assembly and through-hole shell stakes for maximum mechanical retention, it easily withstands up to 10,000 mating cycles. As a direct-from-factory OEM/ODM partner, we offer customizable plating options and tape-and-reel packaging ready for your automated production lines.

Application Notes

  • PCB Footprint & Coplanarity: Ensure strict adherence to the recommended PCB layout tolerances to maintain SMT pad coplanarity during reflow soldering.

  • Mechanical Grounding: The through-hole outer shell stakes must be wave-soldered or manually soldered securely to the PCB ground plane. This is critical for absorbing the mechanical stress of frequent plugging (10,000 cycles) and providing 360° EMI/RFI shielding.

  • Thermal Profiling: The high-temperature LCP (Liquid Crystal Polymer) housing supports standard lead-free SMT reflow processes. Ensure thermal profiles do not exceed standard JEDEC guidelines.

  • Impedance Control: Maintain 90Ω differential impedance routing on the PCB for the SuperSpeed (TX/RX) data traces to prevent signal degradation.

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EU09FG1N12274-USB3.0 AF VERTICAL SMT H11.50

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  • 1 Target quantity, annual forecast, and delivery destination.
  • 2 Drawing, datasheet, sample photo, or current supplier part number.
  • 3 Electrical, mechanical, compliance, testing, and packaging requirements.