2026年7月25日
What Connectors Are Commonly Used in Custom Cable Assemblies?
Discover what connectors are essential for custom cable assemblies. From wire-to-board to circular connectors, learn to specify with...
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Functional Alternative
- Competitor Part Number
- Molex Milli-Grid / TE Connectivity AMPMODU 2.00mm series equivalents
- Mates With
- Standard 2.00mm pitch dual-row surface mount or through-hole male pin headers (0.50mm square pins)
Functional Alternative: This part provides equivalent performance characteristics as a cost-optimized substitute. Minor design review recommended before adoption.
Material Composition
| Material | Value / Description |
|---|---|
| Insulator | High-Temperature LCP, UL 94V-0 (Black) |
| Contact Terminal | Phosphor Bronze |
| Contact Plating | Gold flash over Nickel underplating (Customizable) |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Rated Current | 2.0A max. per contact |
| Voltage Rating | 250V AC/DC |
| Contact Resistance | 20 mΩ max. initial |
| Insulation Resistance | 1000 MΩ min. |
| Withstanding Voltage | 500V AC RMS for 1 minute |
| Operating Temperature | -40°C to +105°C |
Application Scenarios
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Industrial Automation (PLC & Motor Drives): Secures compact, low-profile board-to-board connections between main control boards and secondary sensor modules in vibration-prone factory environments.
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Telecommunication Infrastructure: Provides reliable signal transmission pathways within high-density network switches, routers, and base station transceivers where internal space is at a premium.
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Consumer Electronics & IoT Devices: Facilitates modular internal assemblies in smart home gateways, computing peripherals, and commercial displays, offering a perfect balance between footprint and electrical performance.
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Medical Diagnostic Equipment: Delivers stable, repeatable connections for internal display panels and portable diagnostic carts, ensuring critical data integrity.
Frequently Asked Questions
Are these surface mount (SMD) female headers compatible with automated pick-and-place machines?
Yes, we provide these connectors in Tape and Reel packaging with high-temperature pick-and-place caps specifically designed for high-speed automated SMT assembly lines.
Can I customize the contact plating thickness for high-reliability applications?
Absolutely. While gold flash is standard, our OEM services offer customized selective gold plating (e.g., 10μ", 15μ", or 30μ") to meet enhanced durability and anti-corrosion requirements.
What is the typical Minimum Order Quantity (MOQ) for standard and custom configurations?
For standard 2.00mm pitch female headers, we offer very flexible MOQs to support your prototyping needs. Custom configurations generally require a higher MOQ to offset setup costs. Please contact our sales team for exact figures based on your specs.
Do you offer the corresponding male pin headers to mate with these sockets?
Yes, we manufacture a complete ecosystem of mating 2.00mm pitch male pin headers (both SMT and through-hole, straight or right-angle) to provide you with a guaranteed drop-in board-to-board solution.
Are your electronic connectors RoHS and REACH compliant?
Yes, all our connector products are manufactured using eco-friendly materials and strictly comply with the latest RoHS and REACH environmental directives.
Overview and Application Notes
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Overview: Engineered for space-constrained yet demanding board-to-board applications, our 2.00mm pitch dual-row female pin headers feature a reliable surface mount (SMD) design and vertical top-entry configuration. Utilizing high-performance leaf spring contacts, these sockets ensure excellent electrical conductivity and mechanical retention against vibration. Manufactured with high-temperature LCP insulators for flawless reflow soldering, our connectors are backed by comprehensive OEM/ODM capabilities, allowing you to customize pin counts, plating specifications, and packaging to meet your exact assembly line requirements.
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Application Notes:
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SMT Coplanarity: Ensure PCB pads are designed to accommodate a maximum coplanarity of 0.10mm to 0.15mm to guarantee reliable solder joints during reflow.
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Mating Alignment: Utilize the locating pegs provided on the connector housing to prevent misalignment and mechanical stress on the solder pads during mating.
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Reflow Profile: The high-temperature LCP insulator is compatible with standard lead-free reflow soldering profiles; maintain strict temperature control to prevent thermal shock.
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Automated Assembly: For high-volume manufacturing, request tape-and-reel packaging with pick-and-place caps to streamline automated vacuum nozzle placement.
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