2022年1月10日
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Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Intermateable With
- Competitor Part Number
- Hirose DM1AA-SF-PEJ / Molex 500901-0801 / TE Connectivity 2041021-1 / Amphenol 10100581
- Mates With
- Standard Secure Digital (SD / SDHC / SDXC) Memory Cards (24.0mm x 32.0mm x 2.1mm)
Intermateable: This part is mechanically and electrically compatible for mating with the listed competitor connector. Mixed use in the same connector system is supported.
Technical Specifications
- Connector Type
- Secure Digital (SD) Memory Card Connector
- Connector Style
- Push-Pull (Manual Insertion / Extraction), Top-Mount
- Number of Positions / Pins
- 11 Pins (9 Signal/Power Pins + Pin 10 Card Detect + Pin 11 Write Protect)
- Mounting Type
- Surface Mount (SMT) with Dual Polarized PCB Locating Pegs
- Key Dimensions
- Profile Height: 2.85mm; Body Width: 24.24mm (26.45mm Overall with Tabs); Depth: 19.60mm
- PCB Locating Pegs & Footprint
- Pegs: Ø0.85mm & Ø1.40mm (21.03mm Pitch); Recommended PCB Holes: Ø0.95mm & Ø1.50mm; Outer Pad Span: 27.30mm
- Solder Tail Coplanarity
- 0.08 mm Max.
- Card Detection & Write Protect Switch
- Normally Open (Card Ejected: OPEN; Card Inserted: CLOSE to Ground)
- Packaging Method & Quantity
- 44.0mm Tape & Reel (Ø330mm Reel), 600 PCS/Reel, 6 Reels/Carton (3,600 PCS/Carton, Carton Size: 350x350x330mm)
- Standard Compliance
- RoHS Compliant, UL 94V-0 Flammability Rating
Material Composition
| Material | Value / Description |
|---|---|
| Housing Material | High-Temperature Thermoplastic LCP, UL 94V-0 Rated (Reflow Temperature: 230°C–260°C) |
| Contact Material | Copper Alloy / C5191-EH Phosphor Bronze (Thickness T = 0.20mm) |
| Shell Material | Copper Alloy (Thickness T = 0.20mm) |
| Packaging Material | 44.0mm Embossed Carrier Tape with Cover Tape, Ø330mm Reel, 650x620x0.05mm PE Inner Bag |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Current Rating | 0.5 A per Contact |
| Contact Resistance | 40 mΩ Max. |
| Insulation Resistance | 1000 MΩ Min. |
| Dielectric Withstanding Voltage | AC 500V R.M.S. |
| Operating Temperature Range | -25°C to +85°C |
| Reflow Soldering Temperature | 230°C to 260°C Peak |
| General Tolerances | 1 Place: ±0.35mm; 2 Place: ±0.25mm; 3 Place: ±0.15mm; Angular: ±3° |
Application Scenarios
-
Industrial Programmable Logic Controllers (PLCs) & Human-Machine Interfaces (HMIs)
-
Single-Board Computers (SBCs) & Embedded Edge Computing Gateways
-
Automotive Infotainment, Dashcams & High-Vibration Fleet Telematics Data Loggers
-
Medical Diagnostic Monitors & Portable Patient Recording Devices
-
Commercial Digital Signage, POS Terminals & Smart Security Recorders
Frequently Asked Questions
What are the profile height and PCB layout requirements for this 11-pin push-pull SMT SD card connector?
This push-pull surface-mount Secure Digital (SD) card socket features a low-profile 2.85mm body height, a 24.24mm housing width (26.45mm overall width including solder tabs), and a 19.60mm depth. For accurate PCB alignment, the footprint requires a 27.30mm outer solder pad span and two polarized non-plated locating holes (Ø0.95mm and Ø1.50mm) spaced 21.03mm apart, with solder tail coplanarity controlled within 0.08mm maximum.
How do the normally open Card Detection (CD) and Write Protection (WP) switches operate on Pin 10 and Pin 11?
Pin 10 (Card Detect) and Pin 11 (Write Protect) function as normally open mechanical switches referenced to the ground terminal (G). When the SD card is ejected, both switches remain in the OPEN state; when a standard SD card is fully inserted, the switches transition to the CLOSED state to ground, enabling direct microcontroller GPIO detection.
Can this SD card connector withstand lead-free SMT reflow soldering processes?
Yes, the insulator housing is molded from high-temperature liquid crystal polymer (LCP) rated UL 94V-0, capable of withstanding peak reflow soldering temperatures of 230°C to 260°C. Its 0.20mm thick copper alloy (C5191-EH) contacts maintain a maximum contact resistance of 40mΩ across an operating temperature range of -25°C to +85°C.
What are the tape and reel packaging specifications for automated SMT pick-and-place assembly?
For high-speed automated SMT assembly, the connector is supplied in 44.0mm wide embossed carrier tape wound on Ø330mm reels. Standard factory packaging includes 600 pieces per reel and 6 reels per outer carton (3,600 pieces total per 350x350x330mm carton) with protective PE moisture-barrier bagging.
Overview and Application Notes
This 11-pin surface-mount (SMT) push-pull SD memory card connector features a low-profile 2.85mm body height and a compact 24.24mm x 19.60mm housing footprint. Engineered for reliable data storage and high-vibration resistance in industrial and commercial electronics, it integrates dedicated Card Detection (CD) and Write Protection (WP) mechanical switches alongside dual asymmetrical PCB locating pegs for precise automated pick-and-place assembly.
Key Features
- 11-Position SMT Interface: Standard 9-pin Secure Digital (SD) data/power interface (DAT0–DAT3, CMD, CLK, VDD, VSS) plus 2 integrated switch contacts (Pin 10 CD, Pin 11 WP) with 0.08mm maximum solder tail coplanarity.
- Normally Open CD & WP Switches: Integrated Card Detection and Write Protection switches remain normally open (OPEN when card is ejected) and close to ground upon card insertion.
- High-Temperature Reflow Ready: Molded from UL 94V-0 rated High-Temperature Thermoplastic LCP capable of withstanding 230°C to 260°C peak SMT reflow soldering profiles.
- Robust Electrical Performance: Rated at 0.5A contact current, 40mΩ maximum contact resistance, 1000MΩ minimum insulation resistance, and AC 500V R.M.S. dielectric withstanding voltage across a -25°C to +85°C operating temperature range.
- Automated Tape & Reel Packaging: Supplied in 44.0mm wide carrier tape on Ø330mm reels (600 PCS/Reel, 3,600 PCS/Carton) for high-speed SMT production lines.
Engineering Specifications & PCB Integration
Designed for top-mount PCB layouts, this push-pull SD card socket has an overall width of 26.45mm across the side hold-down tabs (27.30mm recommended PCB outer pad span) and a body depth of 19.60mm. To prevent rotational misalignment during reflow, the housing base incorporates two polarized locating pegs (Ø0.85mm left, Ø1.40mm right) spaced at a 21.03mm center-to-center pitch, mating with Ø0.95mm and Ø1.50mm non-plated through-holes on the PCB. Four perimeter metallic hold-down solder tabs reinforce mechanical retention against repeated card insertion and withdrawal forces.
