2026年7月19日
Wire Harness Design Principles for Reliable OEM Products
Learn wire harness design principles for reliable OEM cable assemblies. Discover best practices, components, and tips to optimize...
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Product Specifications
Key parameters for OEM, distributor and engineering evaluation.
Detailed Product Information
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
| Material | Value / Description |
|---|---|
| Housing Material | LCP, Blue (UL 94V-0) |
| Contact Material | Copper Alloy |
| Contact Plating | Gold Flash on Contact Area, Tin on Solder Tails |
| Shielding Shell | Copper Alloy, Nickel Plated |
| Characteristic | Value |
|---|---|
| Rated Voltage | 30V AC (RMS) Max |
| Rated Current | 1.8A (Power Pins), 0.25A (Signal Pins) |
| Contact Resistance | 30 mΩ Max (Initial) |
| Insulation Resistance | 1000 MΩ Min |
| Dielectric Withstanding | 500V AC for 1 minute |
| Mating Cycles | 1,500 Cycles |
| Operating Temperature | -55°C to +105°C |
Industrial PCs (IPCs) & Embedded Motherboards: Provides a space-saving, vertically oriented 5 Gbps data interface (H11.50mm) where standard horizontal edge mounting is not feasible.
Networking & Edge Routers: Acts as a reliable physical diagnostic, firmware update, or memory expansion interface on the top face of telecommunications boards across -55°C to +105°C.
Medical & Diagnostic Equipment: Delivers secure high-bandwidth data logging, 500V AC dielectric withstanding voltage, and 1000 MΩ insulation resistance for stationary carts and monitoring units.
Smart Kiosks & POS Terminals: Features a standard 1,500-cycle lifespan and robust copper alloy through-hole retention for internal board expansion.
Overview Engineered for reliable high-speed 5 Gbps data transmission in industrial and commercial environments, this vertical USB 3.0 Type-A receptacle offers a robust top-mount connectivity solution for space-constrained PCB layouts. Featuring a 180-degree vertical orientation and an elevated 11.50mm profile, it provides convenient top-facing accessibility for peripheral expansion on dense motherboards. The through-hole (DIP) signal pins and copper alloy shell stakes ensure solid PCB mechanical retention, supporting a rated durability of 1,500 mating cycles. Molded from blue high-temperature LCP (UL 94V-0) and rated for an extended operating temperature range of -55°C to +105°C, this connector guarantees stable electrical performance and corrosion resistance with gold-plated contacts. As an ISO-certified direct manufacturer, EDOM Electronics provides factory pricing, scalable production, and customized contact plating options to meet your exact engineering specifications.
Application Notes
Mechanical Grounding: The outer through-hole copper alloy shell stakes must be wave-soldered securely to the PCB ground plane to absorb mechanical strain from frequent insertion (1,500 cycles) and maintain 360° EMI/RFI shielding.
PCB Footprint & Tolerances: Adhere strictly to the recommended PCB layout (0.70mm signal pin holes, 2.30mm shell stake slots) to avoid mechanical stress during manual or automated DIP insertion.
Thermal Compatibility: Molded from blue LCP (UL 94V-0), the housing supports wave soldering within the broad operating temperature range of -55°C to +105°C.
Impedance Control: Maintain 90Ω differential impedance on the PCB for SuperSpeed (TX/RX) differential pairs to prevent signal attenuation at 5 Gbps data rates.
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