2026年7月19日
Wire Harness Design Principles for Reliable OEM Products
Learn wire harness design principles for reliable OEM cable assemblies. Discover best practices, components, and tips to optimize...
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Drop-in Replacement
- Competitor Part Number
- Wurth Elektronik 692112030100 / Amphenol GSB31 Series (Vertical Through-Hole configurations)
- Mates With
- Standard USB 3.0 & 2.0 Type-A Male Cable Assemblies
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
Material Composition
| Material | Value / Description |
|---|---|
| Housing Material | High-Temperature Thermoplastic (UL 94V-0) |
| Contact Material | Copper Alloy |
| Contact Plating | Gold Flash on Contact Area, Tin on Solder Tails |
| Shielding Shell | Brass / Stainless Steel, Nickel Plated |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Rated Voltage | 30V AC (RMS) Max |
| Rated Current | 1.8A (Power Pins), 0.25A (Signal Pins) |
| Contact Resistance | 30 mΩ Max (Initial) |
| Insulation Resistance | 1000 MΩ Min |
| Dielectric Withstanding | 500V AC for 1 minute |
| Mating Cycles | 5,000 Cycles |
| Operating Temperature | -40°C to +85°C |
Application Scenarios
-
Industrial PCs (IPCs) & Embedded Motherboards: Provides a space-saving, vertically oriented high-speed data interface where standard horizontal edge mounting is not feasible due to enclosure constraints.
-
Networking & Edge Routers: Acts as a reliable physical diagnostic, firmware update, or memory expansion interface on the top face of telecommunications boards.
-
Medical & Diagnostic Carts: Guarantees secure, high-bandwidth data logging for stationary medical equipment requiring frequent peripheral connections.
-
Smart Kiosks & POS Terminals: Delivers long-term reliability with a 5,000-cycle lifespan, drastically reducing maintenance downtime in high-traffic retail and self-service environments.
Frequently Asked Questions
Is this vertical USB connector manufactured in-house, or are you a distributor?
We are an ISO-certified direct manufacturer. We handle the entire engineering, tooling, and OEM/ODM mass production process in-house, ensuring factory-direct pricing and strict quality control.
Does this 11.50mm height connector support automated wave soldering?
Yes. The through-hole (DIP) contacts and high-temperature thermoplastic housing are fully compatible with standard industrial wave soldering processes.
Can we customize the gold plating thickness for harsher environments?
Absolutely. While standard plating is gold flash, we offer customizable plating options (up to 30µ") to meet stringent anti-corrosion and durability requirements for heavy-duty industrial applications.
What is the standard lead time and MOQ for mass production?
Our standard mass production lead time is typically 2 to 3 weeks. We offer flexible MOQs to support both prototyping phases and high-volume continuous manufacturing.
Overview and Application Notes
Overview Engineered for reliable high-speed 5 Gbps data transmission in industrial environments, this vertical USB 3.0 Type-A receptacle offers a robust top-mount connectivity solution for space-constrained PCB layouts. Featuring a 180-degree vertical orientation and an 11.50mm elevated profile, it provides excellent accessibility for peripheral integration. The through-hole (DIP) signal pins and reinforced shell stakes ensure superior mechanical retention, effortlessly withstanding up to 5,000 mating cycles. As an ISO-certified OEM/ODM manufacturer, we deliver factory-direct pricing, scalable production, and customized plating options to meet your exact specifications.
Application Notes
-
Mechanical Grounding: The outer through-hole shell stakes must be wave-soldered securely to the PCB ground plane to absorb the mechanical stress of frequent plugging and to provide 360° EMI/RFI shielding.
-
PCB Footprint & Tolerances: Ensure precision hole alignment for the 9 data/power pins to prevent mechanical strain during manual or automated DIP insertion processes.
-
Thermal Profiling: Compatible with standard wave soldering processes. Verify that pre-heat and peak wave temperatures align with the thermal limits of the high-temperature thermoplastic housing.
-
Impedance Control: Maintain a 90Ω differential impedance on the motherboard routing for the SuperSpeed (TX/RX) lines to ensure optimal signal integrity.
