2026年8月7日
What Is a Connector? A Practical Overview for OEM Buyers
What is a connector? Learn the key factors OEM buyers must evaluate—contact plating, termination, and retention—to avoid field...
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Drop-in Replacement
- Competitor Part Number
- Wurth Elektronik 692112030100 / Amphenol GSB31 Series (Vertical H15.0mm configurations)
- Mates With
- Standard USB 3.0 & 2.0 Type-A Male Cable Assemblies
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
Material Composition
| Material | Value / Description |
|---|---|
| Housing Material | High-Temperature Thermoplastic (UL 94V-0 Rated) |
| Contact Material | Copper Alloy |
| Contact Plating | Gold Flash on Contact Area, Tin on Solder Tails |
| Shielding Shell | Brass / SPCC, Nickel Plated |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Data Transfer Rate | Up to 5 Gbps (SuperSpeed) |
| Rated Voltage | 30V AC (RMS) Max |
| Rated Current | 1.8A (Power Pins), 0.25A (Signal Pins) |
| Contact Resistance | 30 mΩ Max (Initial) |
| Insulation Resistance | 1000 MΩ Min |
| Dielectric Withstanding | 500V AC for 1 minute |
| Operating Temperature | -40°C to +85°C |
Application Scenarios
-
Industrial PCs (IPCs) & Embedded Motherboards: Provides a space-saving, vertically oriented high-speed data interface where standard horizontal edge mounting is not feasible due to enclosure constraints.
-
Networking & Edge Routers: Acts as a reliable physical diagnostic, firmware update, or memory expansion interface on the top face of telecommunications boards.
-
Medical & Diagnostic Carts: Guarantees secure, high-bandwidth data logging for stationary medical equipment requiring frequent peripheral connections.
-
Smart Kiosks & POS Terminals: Delivers long-term reliability and easy vertical access for maintenance technicians in high-traffic retail and self-service environments.
Frequently Asked Questions
Is this vertical USB connector manufactured in-house, or are you a distributor?
We are an ISO-certified direct manufacturer. We handle the entire engineering, tooling, and OEM/ODM mass production process in-house, ensuring factory-direct pricing and strict quality control.
What is the primary advantage of the 15.0mm height profile?
The 15.0mm elevated height is specifically designed to bridge the gap between the motherboard and thick external chassis panels, making it much easier for end-users to plug in peripherals without the port being deeply recessed.
Can we customize the gold plating thickness for harsher environments?
Absolutely. While standard plating is gold flash, we offer customizable plating options (e.g., 15µ" or 30µ") to meet stringent anti-corrosion and durability requirements for heavy-duty industrial applications.
What is the standard lead time and MOQ for mass production?
Our standard mass production lead time is typically 2 to 3 weeks. Prototyping takes only 3 to 5 days. We offer flexible MOQs to support both prototyping phases and high-volume continuous manufacturing.
Overview and Application Notes
Overview Engineered for reliable high-speed 5 Gbps data transmission in demanding industrial environments, this vertical USB 3.0 Type-A receptacle offers a robust top-mount connectivity solution for complex PCB layouts. Featuring a 180-degree vertical orientation with an extended 15.0mm profile height, it provides excellent accessibility for peripheral integration on embedded systems and thick enclosures. The through-hole (DIP) signal pins and reinforced shell stakes ensure superior mechanical retention, effortlessly withstanding continuous mating cycles. As an ISO-certified OEM/ODM manufacturer, we deliver scalable production and customized plating options to meet your exact specifications.
Application Notes
-
Mechanical Grounding: The outer through-hole shell stakes must be wave-soldered securely to the PCB ground plane. This is critical to absorb the mechanical stress of frequent plugging and to provide complete 360° EMI/RFI shielding.
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Z-Axis Clearance: This connector features an extended 15.0mm height. Ensure your chassis enclosure and mating cable overmold have sufficient vertical clearance during the mechanical design phase.
-
Thermal Profiling: Fully compatible with standard wave soldering processes. Verify that pre-heat and peak wave temperatures align with the thermal limits of the high-temperature thermoplastic housing.
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Impedance Control: Maintain a strict 90Ω ±15% differential impedance on the motherboard routing for the SuperSpeed (TX/RX) lanes to prevent data loss.
