2026年7月30日
Wiring and Harness Design for OEM Buyers: Key Specification Points
Get essential wiring and harness design specs for OEM buyers: wire gauge, connectors, routing. Prevent costly errors—read now.
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Drop-in Replacement
- Competitor Part Number
- Molex 48320 Series / Würth Elektronik 692112030100
- Mates With
- Standard USB 3.0 Type-A Plugs and Cable Assemblies
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
Material Composition
| Material | Value / Description |
|---|---|
| Insulator / Housing | High-Temperature Thermoplastic (UL94V-0), Blue |
| Contact Material | Copper Alloy |
| Contact Plating | Gold Flash (Customizable 15μ" or 30μ") over Nickel |
| Shell Material | Brass or SPCC |
| Shell Plating | Nickel Plated |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Data Rate | Up to 5 Gbps (SuperSpeed) |
| Current Rating | 1.8A (Power Pins 1 & 4), 0.25A (Signal Pins) |
| Voltage Rating | 30V AC/DC Max |
| Contact Resistance | 30 mΩ Max (Initial) |
| Insulation Resistance | 1000 MΩ Min |
| Dielectric Withstanding | 500V AC for 1 minute |
| Mating Cycles | Up to 5,000 Cycles |
| Operating Temperature | -40°C to +85°C |
Application Scenarios
-
Industrial Panel PCs and IPCs : Provides a ruggedized, high-retention data interface that withstands vibration and repeated plugging in factory automation environments.
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Networking & Edge Routers : Delivers reliable 5Gbps connectivity for firmware upgrades, diagnostic logging, and external storage expansion on networking equipment motherboards.
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Medical Diagnostics & Instrumentation : Ensures stable SuperSpeed data transfer for high-resolution imaging and patient monitoring data output where secure PCB mounting is critical.
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Self-Service Kiosks & POS Systems : Acts as the primary peripheral connection port, utilizing its durable through-hole mounting to handle high-frequency consumer or operator usage without port failure.
Frequently Asked Questions
Is this through-hole USB 3.0 connector compatible with automated wave soldering?
Yes, the high-temperature UL94V-0 thermoplastic insulator and precise DIP pin layout are designed to withstand standard automated wave soldering processes without deformation.
Can we customize the gold plating thickness for harsher environments?
Absolutely. While gold flash is standard, we can provide 15μ" or 30μ" hard gold plating on the contact areas for OEMs requiring enhanced corrosion resistance and higher mating cycle longevity.
What makes the "flangeless" and 6.99mm height design beneficial for my PCB layout?
The flangeless design allows multiple ports to be stacked closer together side-by-side, saving valuable PCB real estate, while the 6.99mm height provides a standard, low-profile fit for typical electronic enclosures.
What is your standard Minimum Order Quantity (MOQ) and lead time for production?
Our standard lead time is 2 to 4 weeks. MOQ depends on the specific customization, but we support flexible pilot-run quantities to accommodate your engineering validation and testing phases.
Do you provide 3D CAD models and PCB footprint files for our engineering team?
Yes, comprehensive engineering support is part of our OEM service. We can provide 3D STEP files and accurate PCB layout footprints to ensure seamless integration into your design.
Overview and Application Notes
Overview Engineered for reliable 5 Gbps SuperSpeed data transmission, this USB 3.0 Type-A receptacle features a robust right-angle, through-hole (DIP) mounting design ideal for industrial and commercial PCBs. With a standard 6.99mm profile and a flangeless configuration, it optimizes board space while ensuring secure mechanical retention against mating forces. Manufactured as a direct factory OEM solution, this connector guarantees high mating cycle durability and excellent signal integrity, supported by our rapid prototyping and scalable volume production capabilities.
Application Notes
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Wave Soldering Compatibility: Designed with through-hole (DIP) pins and high-temperature insulators to withstand standard wave soldering thermal profiles.
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Mechanical Retention: The through-hole shell stakes must be securely soldered to the PCB ground plane to absorb insertion and extraction forces, protecting the 9-pin signal contacts.
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PCB Clearance: The flangeless design allows for tighter side-by-side port placement; verify your enclosure cutout dimensions to ensure proper alignment.
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EMI/RFI Shielding: Connect the metal housing’s grounding stakes directly to the system chassis ground to optimize shielding effectiveness for high-speed 5 Gbps signals.
