2026年7月14日
What Is a USB-C Connector? A Practical FAQ for OEM Buyers
What is a USB-C connector? Learn the four hidden parameters OEM buyers must check to avoid SMT rework...
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Drop-in Replacement
- Competitor Part Number
- Amphenol GSB31 Series / TE Connectivity 1932768-1 equivalents (Edge Mount/Sink Type configurations)
- Mates With
- Standard USB 3.1, 3.0 & 2.0 Type-A Male Cable Assemblies
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
Material Composition
| Material | Value / Description |
|---|---|
| Housing Material | High-Temperature Thermoplastic (UL 94V-0) |
| Contact Material | Copper Alloy |
| Contact Plating | Gold Flash on Contact Area, Tin on Solder Tails |
| Shielding Shell | Brass / Stainless Steel, Nickel Plated |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Data Transfer Rate | Up to 10 Gbps (SuperSpeed+) |
| Rated Voltage | 30V AC (RMS) Max |
| Rated Current | 1.8A (Power Pins), 0.25A (Signal Pins) |
| Contact Resistance | 30 mΩ Max (Initial) |
| Insulation Resistance | 1000 MΩ Min |
| Dielectric Withstanding | 100V AC for 1 minute |
| Mating Cycles | 1,500 Cycles |
| Operating Temperature | -40°C to +85°C |
Application Scenarios
-
Ultra-Thin Industrial PCs (IPCs): Provides a high-bandwidth 10 Gbps data interface while minimizing board thickness through its sink/edge-mount design, ideal for compact fanless enclosures.
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Slim POS Terminals & Smart Kiosks: Integrates seamlessly into space-constrained retail displays, offering reliable legacy and high-speed peripheral connectivity without increasing device thickness.
-
Medical Tablets & Handheld Diagnostics: Guarantees secure, high-speed data logging and image transfer in portable medical devices where every millimeter of internal space is critical.
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Telecommunications & IoT Gateways: Acts as a low-profile diagnostic or firmware update port on the edge of densely packed networking motherboards.
Frequently Asked Questions
Why choose an edge-mount (sink) USB connector over a standard top-mount version?
Edge-mount connectors are embedded into a cutout on the PCB edge (Center Height 3.4mm in this case). This design drastically reduces the vertical height (Z-axis) of the connector above the board, making it perfect for ultra-thin laptops, tablets, and compact industrial devices.
Is this connector compatible with automated SMT assembly?
Yes. The 9 data/power pins are designed for Surface Mount Technology (SMT). We provide the connectors in standard tape-and-reel packaging compatible with high-speed pick-and-place machines.
Are you a direct manufacturer or a trading company?
We are an ISO-certified direct manufacturer. We handle everything from engineering and tooling to mass production in-house, ensuring factory-direct pricing and strict quality control for OEM/ODM clients.
Can we customize the gold plating thickness for higher durability?
Absolutely. While the standard is gold flash, we can provide custom plating thicknesses (e.g., 15µ" or 30µ" gold) to increase the mating cycle lifespan for harsh industrial environments.
What is the typical lead time for bulk orders?
Standard mass production lead times typically range from 2 to 3 weeks. Prototyping and sample runs can usually be completed within 3 to 5 business days.
Overview and Application Notes
Overview Engineered for ultra-thin industrial and commercial devices, this USB 3.1 Gen 2 Type-A receptacle delivers high-speed data transmission up to 10 Gbps in a space-saving edge-mount (sink) configuration. Featuring a 3.4mm center height (CH3.4), it significantly reduces the overall Z-axis profile on your PCB. The connector utilizes precise Surface Mount Technology (SMT) for the 9 signal/power contacts and robust through-hole (DIP) stakes for the outer shell, ensuring exceptional mechanical retention against mating forces. As an ISO-certified OEM/ODM manufacturer, we offer customized plating and automated tape-and-reel packaging for seamless SMT line integration.
Application Notes
-
PCB Cutout & Coplanarity: Ensure the PCB edge cutout dimensions match the recommended footprint precisely. The edge-mount design relies on accurate board thickness and cutout tolerances to maintain SMT pad coplanarity during reflow.
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Mechanical Grounding: The through-hole outer shell stakes must be securely wave-soldered or manually soldered to the PCB ground plane to absorb plugging stress and provide 360° EMI/RFI shielding.
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Impedance Control: Maintain a 90Ω ±15% differential impedance on the motherboard routing for the SuperSpeed (TX/RX) lanes to support 10 Gbps signal integrity.
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Thermal Profiling: Compatible with standard lead-free reflow processes for the SMT pins. Ensure thermal profiles do not warp the high-temperature LCP housing.
