2026年7月14日
What Is a USB-C Connector? A Practical FAQ for OEM Buyers
What is a USB-C connector? Learn the four hidden parameters OEM buyers must check to avoid SMT rework...
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Drop-in Replacement
- Competitor Part Number
- Amphenol GSB31 Series / TE Connectivity 1932768-1 equivalents (Edge Mount/Sink Type configurations)
- Mates With
- Standard USB 3.1, 3.0 & 2.0 Type-A Male Cable Assemblies
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
Material Composition
| Material | Value / Description |
|---|---|
| Housing Material | PA9T High-Temperature Thermoplastic (UL 94V-0), Blue/Black |
| Contact Material | Phosphor Bronze (USB 2.0 4-Pin) & Copper Alloy (SuperSpeed 5-Pin) |
| Contact Plating | Gold Flash on Contact Area, Tin on Solder Tails |
| Shielding Shell | Stainless Steel, Nickel Plated |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Data Transfer Rate | Up to 10 Gbps (SuperSpeed+) |
| Rated Voltage | 30V AC (RMS) Max |
| Rated Current | 1.8A (Power Pins), 0.25A (Signal Pins) |
| Contact Resistance | 30 mΩ Max (Initial) |
| Insulation Resistance | 1000 MΩ Min |
| Dielectric Withstanding | 500V AC (1 Minute) |
| Mating Cycles | 5,000 Cycles |
| Operating Temperature | -55°C to +105°C |
| Recommended PCB Thickness | 1.20mm to 1.60mm |
Application Scenarios
-
Ultra-Thin Industrial PCs (IPCs): Provides a high-bandwidth 10 Gbps data interface while minimizing board thickness through its sink/edge-mount design, ideal for compact fanless enclosures.
-
Slim POS Terminals & Smart Kiosks: Integrates seamlessly into space-constrained retail displays, offering reliable legacy and high-speed peripheral connectivity without increasing device thickness.
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Medical Tablets & Handheld Diagnostics: Guarantees secure, high-speed data logging and image transfer in portable medical devices where every millimeter of internal space is critical.
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Telecommunications & IoT Gateways: Acts as a low-profile diagnostic or firmware update port on the edge of densely packed networking motherboards.
Frequently Asked Questions
Is this edge-mount USB 3.1 connector designed for SMT or DIP through-hole soldering?
This connector features a 90-degree DIP straight-pin configuration for all 9 signal and power pins, along with 4 shell retention stakes, making it ideal for wave soldering or selective through-hole soldering.
What is the operating temperature range and durability rating?
Molded from high-grade PA9T thermoplastic, it operates across an extended temperature range of -55°C to +105°C and is rated for a minimum of 5,000 mating cycles.
Are you a direct manufacturer or a trading company?
We are an ISO-certified direct manufacturer. We handle everything from engineering and tooling to mass production in-house, ensuring factory-direct pricing and strict quality control for OEM/ODM clients.
Can we customize the gold plating thickness for higher durability?
Absolutely. While the standard is gold flash, we can provide custom plating thicknesses (e.g., 15µ" or 30µ" gold) to increase the mating cycle lifespan for harsh industrial environments.
What is the typical lead time for bulk orders?
Standard mass production lead times typically range from 2 to 3 weeks. Prototyping and sample runs can usually be completed within 3 to 5 business days.
Overview and Application Notes
Overview Engineered for ultra-thin industrial and commercial devices, this USB 3.1 Gen 2 Type-A receptacle delivers high-speed data transmission up to 10 Gbps in a space-saving edge-mount (sink) configuration. Featuring a 3.40mm center height (CH3.40mm) and high-temperature PA9T (UL 94V-0) thermoplastic housing, it significantly reduces the overall Z-axis profile on your PCB. The connector utilizes a full 90-degree through-hole (DIP) straight-pin configuration for all 9 signal and power contacts alongside robust stainless steel shell stakes, ensuring exceptional mechanical retention against heavy mating cycles. With an extended operating temperature range of -55°C to +105°C and 5,000 mating cycle durability, it provides a reliable factory-direct OEM/ODM interconnect solution for demanding embedded systems.
Application Notes
-
PCB Cutout & Profile: The edge-mount sink configuration requires a dedicated PCB cutout with a 3.40mm center height; verify the recommended PCB thickness (1.20mm to 1.60mm) to ensure precise terminal alignment and flush panel fit.
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DIP Wave Soldering: Features a full 90-degree DIP straight-pin configuration ($9\times$ signal/power pins plus 4 shell retention stakes); suitable for wave soldering or selective soldering processes without SMT coplanarity risks.
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Thermal & Material Rating: Molded from premium PA9T thermoplastic (UL 94V-0) with an operating temperature rating of -55°C to +105°C, ensuring housing stability under severe industrial thermal cycles.
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Shielding & Grounding: Stainless steel shell with nickel plating and 4 DIP grounding stakes delivers seamless 360-degree EMI/RFI shielding and withstands up to 5,000 mating cycles.
