2026年7月14日
What Is a USB-C Connector? A Practical FAQ for OEM Buyers
What is a USB-C connector? Learn the four hidden parameters OEM buyers must check to avoid SMT rework...
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Drop-in Replacement
- Competitor Part Number
- Molex 217175 Series / TE 2320115 Equivalent
- Mates With
- Standard USB Type-C Cable Plugs
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
Material Composition
| Material | Value / Description |
|---|---|
| Insulator | High-Temperature Thermoplastic (UL 94V-0), Black |
| Contacts | Copper Alloy |
| Contact Plating | Gold Flash over Nickel on Mating Area, Matte Tin on Solder Tails |
| Shell/Shield | Stainless Steel with Nickel Plating |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Power Rating (Max) | 240W (EPR Support) |
| Voltage Rating | 48V DC Max. |
| Current Rating | 5A Max. (Corrected from 2A) |
| Mating Cycles | 10,000 Cycles (Minimum) |
| Contact Resistance | 40 mΩ Max. |
| Insulation Resistance | 100 MΩ Min. |
| Operating Temperature | -40°C to +85°C |
Application Scenarios
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Ultra-Thin Laptops & Tablets : The elevated form factor allows for efficient use of vertical space on crowded motherboards, while the 240W EPR rating powers high-performance computing without thermal degradation.
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Industrial Panel PCs & IPCs : Provides robust, high-cycle durability (10,000 insertions) and secure inner shell staking for factory-floor automation devices subject to frequent vibrations and plug/unplug cycles.
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Medical Diagnostic Carts : Guarantees reliable 10Gbps data transfer for real-time, high-resolution imaging displays, combined with a secure physical connection via built-in locating pegs.
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Automotive Infotainment Systems : Offers stable surface-mount retention and wide temperature tolerance (-40°C to +85°C) suitable for in-cabin multimedia and high-speed device charging.
Frequently Asked Questions
Why is an elevated (CH3) USB-C receptacle used instead of a standard mid-mount?
An elevated top-mount receptacle provides specific vertical clearance (standoff) above the PCB. This allows hardware engineers to place other low-profile components or route complex signal traces directly underneath the connector, optimizing overall board space.
Does this connector truly support 240W Power Delivery?
Yes. To meet the 240W Extended Power Range (EPR) specification under USB PD 3.1, this connector is engineered to handle 48V at a 5A current rating safely. The robust copper alloy contacts and optimized plating prevent overheating under maximum load.
Are you the direct manufacturer, and can you provide custom modifications?
Yes, we are the direct OEM/ODM manufacturer. We can customize shell plating, contact gold thickness, and even packaging methods depending on your volume requirements.
Is the packaging suitable for automated pick-and-place assembly?
Absolutely. We supply these SMD receptacles in standard Tape & Reel packaging, compatible with automated SMT pick-and-place machines for high-volume manufacturing.
What is your standard lead time and MOQ for this connector?
Standard lead times range from 2 to 4 weeks depending on the order volume. Please contact our sales team for exact MOQ details and prototype sample requests.
Overview and Application Notes
Overview Engineered for next-generation power and data delivery, the EU24F2B3N32352SR is a robust USB 3.2 Gen 2 Type-C receptacle featuring an elevated center height (CH3) to accommodate complex, space-constrained PCB layouts. Supporting up to 240W (48V/5A) Power Delivery and 10Gbps high-speed data transmission, this 24-pin connector is an ideal solution for demanding industrial, medical, and consumer applications. Manufactured in our certified OEM facility, we guarantee strict IPC/WHMA-A-620 compliance, offering reliable factory-direct sourcing, customizable modifications, and scalable production to meet your engineering requirements.
Application Notes
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PCB Clearance & Standoff: The elevated design provides additional clearance beneath the connector shell, allowing engineers to route traces or place low-profile SMT components underneath, maximizing PCB real estate.
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Thermal Management: When operating at the maximum 240W (48V/5A) capacity, ensure adequate thermal dissipation through the PCB ground planes connected to the shield grounding tabs.
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EMI Shielding: The inner shell stake design provides excellent structural retention and grounding. Ensure all outer shield pins are properly soldered to the system ground to minimize EMI during 10Gbps data transmission.
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Reflow Soldering: Compatible with standard lead-free SMT reflow profiles. The high-temperature thermoplastic housing safely withstands high reflow temperatures without deformation.
