2026年7月14日
What Is a USB-C Connector? A Practical FAQ for OEM Buyers
What is a USB-C connector? Learn the four hidden parameters OEM buyers must check to avoid SMT rework...
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Drop-in Replacement
- Competitor Part Number
- Molex 217175 Series / TE 2320115 Equivalent
- Mates With
- Standard USB Type-C Cable Plugs
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
Material Composition
| Material | Value / Description |
|---|---|
| Insulator | LCP Thermoplastic (UL 94V-0), Black |
| Contacts | Copper Alloy (C7025) |
| Contact Plating | Selective 3μ" Gold on Mating Area, 80μ" Tin on Solder Tails |
| Shell/Shield | SUS304 Stainless Steel Shell (Ni Plated) with SUS301 Mid Plate |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Power Rating (Max) | 100W (5A / 20V Max) |
| Voltage Rating | 5V AC Max |
| Current Rating | 5A Max. |
| Mating Cycles | 10,000 Cycles (Minimum) |
| Contact Resistance | 40 mΩ Max. |
| Insulation Resistance | 100 MΩ Min. |
| Operating Temperature | -55°C to +85°C |
| Mechanical Force | Insertion: 5N–20N / Extraction: 8N–20N |
| Recommended PCB Thickness | 2.00 ± 0.05mm |
Application Scenarios
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Ultra-Thin Laptops & Tablets: The elevated form factor allows for efficient use of vertical space on crowded motherboards, supporting up to 5A high-current fast charging without thermal degradation.
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Industrial Panel PCs & IPCs: Provides robust, high-cycle durability (10,000 insertions) and secure hybrid shell staking for factory-floor automation devices subject to frequent vibrations and plug/unplug cycles.
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Medical Diagnostic Carts: Guarantees reliable 10Gbps data transfer for real-time, high-resolution imaging displays, combined with a secure physical connection via built-in locating pegs.
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Automotive Infotainment Systems: Offers stable hybrid DIP/SMT retention and wide industrial operating temperature tolerance (-55°C to +85°C) suitable for in-cabin multimedia and high-speed device charging.
Frequently Asked Questions
What are the exact elevation height and mounting configuration of this connector?
The EU24F2B3N32352SR features an elevated center height of CH=3.40mm (total body height 5.18mm) and uses a hybrid DIP/SMT mounting design (12 SMT pins + 12 through-hole DIP pins) optimized for 2.0mm thick PCBs.
What is the certified operating temperature range for this elevated Type-C receptacle?
Built with high-grade LCP housing and C7025 copper alloy contacts, it operates reliably across an extended industrial temperature range of -55°C to +85°C.
Are you the direct manufacturer, and can you provide custom modifications?
Yes, we are the direct OEM/ODM manufacturer. We can customize shell plating, contact gold thickness, and even packaging methods depending on your volume requirements.
Is the packaging suitable for automated pick-and-place assembly?
Absolutely. We supply these SMD receptacles in standard Tape & Reel packaging, compatible with automated SMT pick-and-place machines for high-volume manufacturing.
What is your standard lead time and MOQ for this connector?
Standard lead times range from 2 to 4 weeks depending on the order volume. Please contact our sales team for exact MOQ details and prototype sample requests.
Overview and Application Notes
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Overview:
Engineered for multi-layer, high-density hardware layouts, the EU24F2B3N32352SR is an elevated USB 3.2 Gen 2 Type-C 24-pin receptacle featuring an elevated center height of CH=3.40mm (total vertical height 5.18mm above PCB). Designed with a high-temperature UL94 V-0 black LCP housing, stainless steel inner/outer shells (SUS304, Ni plated), an internal SUS301 mid-plate, and 24 copper alloy contacts (C7025 with Au 3u” + Sn 80u” plating), it delivers reliable SuperSpeed+ 10Gbps data transmission and 5A power handling. Its hybrid DIP/SMT termination—pairing 12 surface-mount contacts with 12 through-hole pins and dual-layer shell hold-downs—ensures superior peel strength on thick circuit boards (recommended PCB thickness 2.0±0.05mm) while withstanding extreme industrial operating temperatures from -55°C to +85°C across 10,000 mating cycles.
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Application Notes:
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Elevated Standoff & PCB Clearance: Designed with an elevated CH=3.40mm profile, providing vertical standoff space beneath the connector housing to route high-density traces or place low-profile SMT components.
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Hybrid DIP/SMT Footprint: Utilizes a dual-row staggered terminal structure combining 12 SMT leads with 12 through-hole pins (12-Ø0.40mm holes); strictly follow the recommended layout for a 2.0±0.05mm PCB thickness to ensure full solder fill.
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Dual-Shell EMI & Structural Shielding: Constructed with an SUS304 outer shell, an SUS304 inner shell, and an internal SUS301 mid-plate to deliver seamless 360-degree shielding and absorb 5N–20N mating / 8N–20N extraction forces.
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Automated Reflow & Tape Packaging: Molded from high-temperature LCP (UL94 V-0) capable of withstanding standard lead-free reflow profiles (peak 260°C); supplied in 330mm Tape & Reel packaging (carrier tape width 26.40mm) for automated high-speed SMT pick-and-place lines.
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