2026年7月14日
What Is a USB-C Connector? A Practical FAQ for OEM Buyers
What is a USB-C connector? Learn the four hidden parameters OEM buyers must check to avoid SMT rework...
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Drop-in Replacement
- Competitor Part Number
- TE Connectivity 2129691-1 / Molex 105444 series equivalents
- Mates With
- Standard USB Type-C Plugs and Type-C Panel Mount Socket Cable with Screw Locking
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
Material Composition
| Material | Value / Description |
|---|---|
| Housing | High-Temperature Thermoplastic, UL 94V-0 |
| Contacts | Copper Alloy |
| Contact Plating | Gold Flash over Nickel (Mating Area), Tin (Solder Tails) |
| Shell / Shield | Stainless Steel, Nickel Plated |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Voltage Rating | 30V DC |
| Current Rating | 2A (Standard signal/power mix; up to 5A for EPR configurations) |
| Data Rate | Up to 10 Gbps |
| Mating Cycles | 10,000 Cycles Min. |
| Operating Temperature | -40°C to +85°C |
Application Scenarios
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Industrial Panel PCs & HMIs : Delivers secure, high-durability 10 Gbps data interfaces and high-power charging for compact industrial control terminals.
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Docking Stations & Hubs : Enables multi-lane data streaming and simultaneous 240W power delivery in premium multi-port consumer and enterprise hubs.
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Portable Medical Diagnostic Units : Saves critical interior vertical height in slim medical equipment while ensuring reliable, high-cycle peripheral connections.
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Automotive Infotainment Systems : Provides ruggedized, reversible high-speed connectivity for modern in-vehicle computing and device charging modules.
Frequently Asked Questions
Does this Type-C receptacle support USB PD 3.1 Extended Power Range (EPR)?
Yes. It is engineered with a 48V DC rating to support 240W EPR power delivery requirements for high-power devices and laptops.
Is this part a drop-in replacement for major brand connectors?
Yes, it is designed with standard industry dimensions, acting as a direct drop-in alternative for major manufacturer footprints. Engineering drawings and 3D step files are available upon request.
What is the standard packaging method for automated assembly?
This receptacle is shipped in standard EIA-compliant tape and reel packaging, perfectly optimized for automated pick-and-place surface-mount lines.
Can EDOM Electronics supply custom cable assemblies matching this connector?
Absolutely. As an integrated OEM/ODM manufacturer, we specialize in producing custom overmolded cable assemblies and wire harnesses tailored to your exact system requirements.
What is the typical lead time and MOQ for bulk orders?
Our standard manufacturing lead time is 2 to 4 weeks. Standard MOQ is typically one full reel, though we fully support low-volume prototype samples for evaluation.
Overview and Application Notes
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Overview: The EU24FB3N11284 is a high-performance 24-pin USB 3.2 Gen2 Type-C female receptacle engineered for advanced data transmission and power delivery. Featuring a mid-mount SMT design with a 0.60mm board-drop profile, it optimizes vertical space within ultra-slim electronic enclosures. It supports blistering 10 Gbps data rates and robust power delivery capabilities. Backed by EDOM Electronics’ factory-direct manufacturing, this connector guarantees 10,000 mating cycles, offering reliable OEM/ODM solutions for global electronics manufacturers and distributors.
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Application Notes:
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PCB Footprint & Clearance: Ensure precise layout for the mid-mount cutout and inner shell stakes to maximize mechanical retention and peel strength against PCB stress.
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Thermal Management & Current Load: Operating at higher currents requires adequate copper pour and trace width on VBUS and GND layers to manage thermal dissipation.
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EMI/RFI Shielding: Properly ground the stainless steel shell and inner stakes to the chassis ground plane to maintain Signal Integrity (SI) at 10 Gbps speeds.
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Reflow Soldering Profile: Compatible with standard lead-free convection reflow profiles; control paste volume carefully to prevent bridging across the fine-pitch 24 SMT pads.
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