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USB 3.1 Type-C 24-Pin Receptacle, Mid-Mount Dual SMT CH0.60 BH2.18 (PN: EU24FB3N11284)

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USB 3.1 Type-C 24-Pin Receptacle, Mid-Mount Dual SMT CH0.60 BH2.18 (PN: EU24FB3N11284)

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Product Specifications

Key parameters for OEM, distributor and engineering evaluation.

Parameters
USB Connector Style
Type C
USB Version
3.1 Gen 2
Interface
C
Waterproof
N/A
Approvals
N/A
Gender
Receptacle (socket)
PCB Orientation
Horizontal
Number of Contacts
24
PCB Mount Position
Mid Mount
Elevated
No
Mating Cycles
10,000
Power Rating
N/A
Current Rating
3A
Contact Pin Type
Surface Mount
Voltage Rating
100V AC
Shell Stake Type
Inner shell stake
Locating Peg
Without
Mating Face Lead In
Without

Detailed Product Information

Technical Data & Reference

Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.

Competitor & Cross-Reference

Alternative Type
Drop-in Replacement
Competitor Part Number
TE Connectivity 2129691-1 / Molex 105444 series equivalents
Mates With
Standard USB Type-C Plugs and Type-C Panel Mount Socket Cable with Screw Locking

Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.

Material Composition

Material Value / Description
Housing High-Temperature Thermoplastic, UL 94V-0
Contacts Copper Alloy
Contact Plating Gold Plated over Nickel
Shell / Shield Stainless Steel Shell (Ni Plated) with Stainless Steel Mid Plate & EMC Shield

Technical Characteristics

Characteristic Value
Voltage Rating 100V AC RMS
Current Rating 3.0A (VBUS/GND) / 1.25A (Signal Pins)
Data Rate Up to 10 Gbps
Mating Cycles 10,000 Cycles Min.
Operating Temperature -40°C to +85°C
Dielectric Withstanding Voltage 100V AC RMS (50Hz, 1 Min)

Application Scenarios

  • Industrial Panel PCs & HMIs : Delivers secure, high-durability 10 Gbps data interfaces and high-power charging for compact industrial control terminals.

  • Docking Stations & Hubs : Enables multi-lane data streaming and simultaneous 240W power delivery in premium multi-port consumer and enterprise hubs.

  • Portable Medical Diagnostic Units : Saves critical interior vertical height in slim medical equipment while ensuring reliable, high-cycle peripheral connections.

  • Automotive Infotainment Systems : Provides ruggedized, reversible high-speed connectivity for modern in-vehicle computing and device charging modules.

Frequently Asked Questions

What are the exact sink dimensions and mounting profile for EU24FB3N11284?
The connector is designed as a dual-SMT mid-mount receptacle featuring a 0.60mm center drop height (CH=0.60mm) and a total body height of 2.18mm (BH=2.18mm), optimized for ultra-slim PCB cutouts.
What are the voltage and current ratings specified in the engineering drawing?
It is rated for a dielectric withstanding voltage of 100V AC RMS, supporting 3.0A max on VBUS power contacts (pins A4, A9, B4, B9) and 1.25A on all other signal contacts.
What is the standard packaging method for automated assembly?
This receptacle is shipped in standard EIA-compliant tape and reel packaging, perfectly optimized for automated pick-and-place surface-mount lines.
Can EDOM Electronics supply custom cable assemblies matching this connector?
Absolutely. As an integrated OEM/ODM manufacturer, we specialize in producing custom overmolded cable assemblies and wire harnesses tailored to your exact system requirements.
What is the typical lead time and MOQ for bulk orders?
Our standard manufacturing lead time is 2 to 4 weeks. Standard MOQ is typically one full reel, though we fully support low-volume prototype samples for evaluation.

Overview and Application Notes

  • Overview: Engineered for ultra-thin portable electronics, industrial panels, and compact embedded systems, the EU24FB3N11284 is a high-speed 24-pin USB 3.1 Type-C female receptacle featuring a space-saving mid-mount dual-SMT configuration (sink center height CH=0.60mm, body height BH=2.18mm). Molded with a high-temperature UL 94V-0 thermoplastic housing, stainless steel shell (Ni plated), internal stainless steel mid-plate, EMC shield, and 24 gold-plated copper alloy contacts, it supports 10 Gbps SuperSpeed+ data transmission and standard 3.0A power delivery on VBUS lines (1.25A on signal pins). Its all-SMT surface mount architecture delivers seamless automated lead-free reflow assembly and exceptional 360-degree EMI suppression across an operating temperature range of -40°C to +85°C with a tested durability of 10,000 mating cycles.

  • PCB Edge Cutout & Profile: Designed for mid-mount installation with a 0.60mm center drop height (CH=0.60mm) and 2.18mm body height (BH=2.18mm); verify PCB edge cutout routing and tolerances against the recommended layout to ensure proper connector seating and panel alignment.

  • Dual-SMT Soldering & Stencil Design: Features a dual-row SMT layout (20 signal pads at 0.25mm width, 4 power pads at 0.30mm width, 0.50mm pitch); strictly optimize stencil apertures and solder paste volume to prevent bridging across fine-pitch contacts.

  • Reflow Soldering Profile: Molded from high-temperature UL 94V-0 thermoplastic, fully compatible with standard lead-free convection reflow soldering profiles (peak temperature up to 260°C).

  • EMI/RFI Suppression & Grounding: Features an integrated internal mid-plate, dedicated EMC shielding element, and multiple shell solder tabs to ensure continuous 360-degree grounding and maintain 10 Gbps signal integrity.

  • Application Notes:

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Product Document

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EU24FB3N11284-USB3.1 C TYPE FEMALE R&A SMT CH0.60 BH2

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  • 1 Target quantity, annual forecast, and delivery destination.
  • 2 Drawing, datasheet, sample photo, or current supplier part number.
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