2026年8月2日
Aerospace Cable Manufacturers: What OEM Buyers Need to Know
Discover what to demand from aerospace cable manufacturers: engineering expertise, material traceability, and in-process testing. Avoid costly failures....
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Drop-in Replacement
- Competitor Part Number
- Generic USB 3.1 Type-C 24-Pin Top Mount SMT+DIP Receptacle
- Mates With
- Standard USB Type-C Plugs & Cable Assemblies
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
Material Composition
| Material | Value / Description |
|---|---|
| Contact Material: | Copper Alloy |
| Contact Plating: | Gold Flash (Customizable up to 30µ") |
| Shell Material: | Stainless Steel |
| Shell Plating: | Nickel |
| Insulator Material: | High-Temperature Thermoplastic (UL94 V-0) |
| Shielding | Full Metal Shield |
| Shell Construction | Stainless Steel Shell (Tail Solder Joint, No Top Spring) |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Voltage Rating: | 100V AC R.M.S. |
| Current Rating: | 5.0A (VBUS Pin) / 1.25A (VCONN Pin) |
| Mating Cycles: | 10,000 Cycles Min. |
| Operating Temp: | -40°C to +85°C |
| Contact Resistance: | 40 mΩ Max Initial (10 mΩ Max Change After Test) |
| Insulation Resistance | 100 MΩ Min |
| Recommended PCB Thickness | 1.00mm |
| Mating Force | 5N–20N |
| Unmating Force | 8N–20N |
Application Scenarios
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Industrial Panel PCs (IPCs): Delivers 10 Gbps SuperSpeed+ data transfer with rugged hybrid SMT/DIP PCB retention to resist high-vibration factory environments.
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Medical Diagnostic Equipment: Guarantees high-integrity signal transmission and secure 100V AC withstanding voltage across 10,000 insertion cycles.
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Smart IoT Gateways & Embedded SBCs: Provides 5A power handling on VBUS and robust through-hole anchoring on standard 1.00mm circuit boards.
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Automotive In-Cabin Modules: Offers high thermal resilience (-40°C to +85°C) and continuous stainless steel EMI shielding against electrical interference.
Frequently Asked Questions
What are the electrical ratings and power handling of the EU24FB3N61312 receptacle?
According to the engineering drawing, the connector is rated for 100V AC R.M.S. dielectric withstanding voltage, 5A on VBUS pins, and 1.25A on VCONN pins, providing dependable high-speed data transmission and power transfer.
What mounting type and PCB thickness are recommended for EU24FB3N61312?
It utilizes a 90-degree hybrid SMT + DIP configuration (12 SMT contacts, 12 DIP pins, and 4 DIP shell stakes) engineered specifically for standard 1.00mm thick circuit boards.
Can we request thicker gold plating for the contacts?
Absolutely. While gold flash is our standard, as a direct OEM manufacturer, we can customize the contact plating (e.g., 15µ" or 30µ" gold) to increase corrosion resistance for harsher environments.
Is this connector designed for automated PCB assembly?
Yes. The receptacles are packaged in Tape & Reel format, perfectly optimized for high-volume automated SMT pick-and-place manufacturing.
What is your standard MOQ and lead time?
The standard MOQ is typically 1,000 pieces per reel. Lead times run approximately 2 to 4 weeks depending on the order volume, but we can accommodate rapid 3-5 day prototyping for engineering validation.
Overview and Application Notes
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Overview: Engineered for reliable high-speed data transmission and robust hardware integration, the EU24FB3N61312 is a 24-pin USB 3.1 Gen 2 Type-C female receptacle featuring a 90-degree top-mount hybrid SMT/DIP configuration. Constructed with high-temperature UL94 V-0 thermoplastic insulator housing, a durable stainless steel shielding shell with tail solder points (no top spring), and copper alloy contacts, it delivers 10 Gbps SuperSpeed+ data throughput and up to 5.0A current rating on VBUS lines (1.25A on VCONN). Its hybrid architecture—pairing 12 surface-mount contacts with 12 through-hole DIP signal pins and 4 through-hole shell retention legs—delivers outstanding board retention and shear resistance on 1.00mm PCBs across an operating temperature range of -40°C to +85°C with a tested lifespan of 10,000 mating cycles.
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Application Notes:
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Hybrid SMT/DIP Layout & PCB Thickness: Features a dual-row staggered terminal configuration combining 12 SMT leads with 12 through-hole pins; strictly adhere to the recommended PCB layout designed for a 1.00mm PCB thickness (T=1.00mm) to guarantee proper through-hole solder fill.
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Reflow & Through-Hole Soldering: Molded from high-temperature UL94 V-0 plastic; fully compatible with standard lead-free pin-in-paste or reflow soldering profiles (peak temperature up to 260°C) without blistering or deformation.
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Outer Shell Shielding & Retention: The stainless steel outer shell features welded tail joints and 4 DIP grounding stakes, providing continuous 360-degree EMI/RFI suppression while absorbing 5N–20N mating force and 8N–20N extraction force.
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Contact & Solder Pad Tolerances: Maintain strict stencil apertures and solder volume on the SMT pads to ensure terminal coplanarity (0.10mm max) and prevent solder bridging across adjacent high-speed differential pairs.
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