2026年10月7日
How CAN Bus Connectors Work: Types, Pinouts, and Wiring Basics
Learn how CAN bus connectors work, including types, pinouts, and wiring basics. Read this guide to choose the...
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Drop-in Replacement
- Competitor Part Number
- Amphenol FCI BergStak 0.80mm 61083 Series (e.g., 61083-041402LF for 40-Position)
- Mates With
- 0.80mm Pitch Dual Row Board-to-Board Receptacles / Sockets (Compatible with Amphenol FCI 61082 Series Mating Receptacles)
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
Technical Specifications
- Connector Type
- Board-to-Board (BTB) Plug / Male Header
- Contact Pitch
- 0.80 mm
- Number of Positions
- 40, 50, 60, 80, 100, 120, 140, 160, 180, 200 Pins (Dual Row)
- Mounting Type
- Surface Mount (SMT), Vertical / Straight
- Profile Height
- 4.70 mm Nominal Height (4.55 mm Housing Height; 3.70 mm Mating Wall Height)
- Housing Width
- 5.60 mm ±0.20 mm (6.00 mm Across Solder Tails)
- Overall Length (Dimension A)
- 21.80 mm (40P) to 85.80 mm (200P)
- Locating Peg Dimensions
- Asymmetric Bosses: Ø0.70 mm & Ø1.10 mm ±0.05 mm (Length: 1.10 mm ±0.10 mm)
- Recommended PCB Layout
- Pad Size: 0.50×2.00 mm; Outer Span: 6.40 mm; Peg Holes: Ø0.80 mm & Ø1.20 mm
- Terminal Coplanarity
- 0.10 mm Max.
- Standard Compliance
- UL94V-0 Flammability Rated, RoHS Compliant
Material Composition
| Material | Value / Description |
|---|---|
| Housing Material | High-Temperature Thermoplastic LCP, UL94V-0, Beige |
| Contact Material | Phosphor Bronze |
| Contact Plating | Gold Flash Overall; 15 µin Min. Gold on Contact Area |
| Shell / Retention Material | Not Applicable (Unshielded Insulator Design) |
| Packaging Material | Standard Embossed Carrier Tape & Reel |
Technical Characteristics
| Characteristic | Value |
|---|---|
| General Linear Tolerances | .X = ±0.25 mm; .XX = ±0.20 mm; .XXX = ±0.10 mm |
| Angular Tolerance | ±1° |
Application Scenarios
-
Industrial Automation Controllers, PLCs, and Embedded Single Board Computers (SBCs)
-
High-Speed Telecommunications Mezzanine Cards and Network Routers
-
Medical Diagnostic Equipment and Portable Patient Monitoring Modules
-
Automotive Infotainment Head Units, ADAS Controllers, and Telematics Systems
-
Industrial HMI Displays, Smart Meters, and Precision Test Instruments
Frequently Asked Questions
What are the PCB land pattern and locating hole specifications for this 0.80mm pitch BTB plug header?
This surface-mount vertical plug requires a dual-row PCB footprint with 0.50mm ±0.03mm pad width, 2.00mm ±0.05mm pad length, and 0.80mm ±0.03mm pitch spacing. The outer span across the solder pads is 6.40mm ±0.05mm with a 2.50mm ±0.03mm inner clearance. For polarized PCB mounting, two asymmetric non-plated holes of Ø0.80mm ±0.05mm and Ø1.20mm ±0.05mm spaced at Dimension D ±0.08mm are required to engage the 0.70mm and 1.10mm alignment pegs (1.10mm ±0.10mm peg length).
How does this 0.80mm plug connector maintain solder joint reliability on up to 200 pins?
Across all pin configurations from 40 to 200 contacts (overall lengths from 21.80mm to 85.80mm), the solder tail coplanarity is tightly controlled within 0.10mm maximum. Paired with a high-temperature UL94V-0 beige LCP insulator that resists thermal deformation during lead-free reflow soldering, this ensures uniform solder paste wetting and prevents open circuits.
What terminal material and gold plating thickness are applied to the mating contacts?
The plug contacts are manufactured from phosphor bronze with overall gold flash plating and a minimum of 15 µin selective gold plating on the mating blade area. This contact metallurgy ensures low contact resistance, durability across repeated mating cycles, and reliable protection against oxidation in industrial environments.
Is this 0.80mm pitch vertical plug compatible with standard BergStak 0.80mm receptacles?
Yes, this 0.80mm pitch dual-row vertical plug header is engineered as a drop-in replacement for the Amphenol FCI BergStak 61083 plug series and is fully intermateable with standard 0.80mm pitch BTB receptacles, including the 61082 series sockets, to achieve precise parallel board-to-board spacing.
Overview and Application Notes
This 0.80mm pitch Board-to-Board (BTB) vertical surface-mount plug header is designed for high-density mezzanine PCB stacking applications. Featuring a 4.70mm nominal profile height (4.55mm insulator body height) and available across 40, 50, 60, 80, 100, 120, 140, 160, 180, and 200 contact positions, it provides dependable high-speed signal integrity and mechanical stability in compact electronic architectures. Manufactured with a beige UL94V-0 high-temperature LCP thermoplastic housing and phosphor bronze contacts plated with a minimum of 15 µin gold on the mating area, this SMT plug connector withstands lead-free reflow soldering while preventing fretting corrosion.
Key Features
- High-Density Pin Configurations: 0.80mm contact pitch in a dual-row vertical plug layout, available in 40, 50, 60, 80, 100, 120, 140, 160, 180, and 200 positions.
- Compact Mezzanine Profile: 4.70mm height specification (4.55mm housing height with 3.70mm mating shroud depth) and a narrow 5.60mm body width for space-saving parallel board stacking.
- Superior Contact Metallurgy: Precision-formed phosphor bronze terminals finished with gold flash overall and 15 µin minimum selective gold plating on the contact interface.
- High-Temperature Insulator: Beige Liquid Crystal Polymer (LCP) thermoplastic housing rated UL94V-0 ensures thermal resistance and dimensional stability during automated SMT reflow.
- Polarized PCB Alignment & Coplanarity: Dual asymmetric locating bosses (Ø0.70mm and Ø1.10mm, 1.10mm length) and 0.10mm maximum solder tail coplanarity guarantee precise pick-and-place registration and reliable solder joints.
- Automated Manufacturing Ready: Supplied in standard embossed carrier tape and reel packaging for high-speed surface-mount assembly lines.
Engineering Specifications & PCB Integration
To achieve optimal solder fillet formation and mechanical retention, the recommended PCB land pattern requires 0.50mm ±0.03mm wide by 2.00mm ±0.05mm long copper pads arranged at a 0.80mm ±0.03mm pitch, with a 6.40mm ±0.05mm outer row-to-row span and a 2.50mm ±0.03mm inner clearance. Polarization mounting holes should be drilled at Ø0.80mm ±0.05mm and Ø1.20mm ±0.05mm (spaced at Dimension D ±0.08mm) to receive the connector’s 0.70mm and 1.10mm alignment pegs. Terminal solder tails are held to a strict 0.10mm maximum coplanarity across all pin counts from 40 to 200 positions to eliminate open solder defects during reflow processing.
