2026年10月7日
How CAN Bus Connectors Work: Types, Pinouts, and Wiring Basics
Learn how CAN bus connectors work, including types, pinouts, and wiring basics. Read this guide to choose the...
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Drop-in Replacement
- Competitor Part Number
- Amphenol FCI BergStak 0.80mm 61082 Series (e.g., 61082-041402LF for 40-Position)
- Mates With
- 0.80mm Pitch Dual Row Vertical or Right-Angle Board-to-Board Headers (Compatible with Amphenol FCI 61083 Series Mating Headers)
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
Technical Specifications
- Connector Type
- Board-to-Board (BTB) Receptacle / Socket
- Contact Pitch
- 0.80 mm
- Number of Positions
- 40, 50, 60, 80, 100, 120, 140, 160, 180, 200 Pins (Dual Row)
- Mounting Type
- Surface Mount (SMT), Vertical / Straight, Top Entry
- Profile Height
- 3.70 mm Body Height (3.75 mm / 3.76 mm Overall Seated Height)
- Housing Width
- 5.60 mm ±0.20 mm (6.00 mm Across Solder Tails)
- Overall Length (Dimension A)
- 21.80 mm (40P) to 85.80 mm (200P)
- Locating Peg Dimensions
- Asymmetric Bosses: Ø0.70 mm & Ø1.10 mm ±0.05 mm (Length: 0.75 mm ±0.15 mm)
- Recommended PCB Layout
- Pad Size: 0.50×2.00 mm; Outer Span: 6.40 mm; Peg Holes: Ø0.80 mm & Ø1.20 mm
- Terminal Coplanarity
- 0.10 mm Max.
- Standard Compliance
- UL94V-0 Flammability Rated, RoHS Compliant
Material Composition
| Material | Value / Description |
|---|---|
| Housing Material | High-Temperature Thermoplastic LCP, UL94V-0, Beige |
| Contact Material | Phosphor Bronze |
| Contact Plating | Gold Flash Overall; 15 µin Min. Gold on Contact Area |
| Shell / Retention Material | Not Applicable (Unshielded Insulator Design) |
| Packaging Material | Standard Embossed Carrier Tape & Reel |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Operating Temperature Range | High-Temperature Reflow Compatible (Exact °C Range Not Specified on Drawing) |
| General Linear Tolerances | .X = ±0.25 mm; .XX = ±0.20 mm; .XXX = ±0.10 mm |
| Angular Tolerance | ±1° |
Application Scenarios
-
Industrial Automation Controllers, PLCs, and Embedded Single Board Computers (SBCs)
-
High-Speed Data Acquisition Modules and Telecommunications Mezzanine Cards
-
Medical Diagnostic Imaging and Patient Monitoring Circuit Boards
-
Automotive Infotainment, ADAS Control Units, and Telematics Systems
-
Smart Metering, Test & Measurement Instruments, and Industrial HMI Displays
Frequently Asked Questions
What are the PCB footprint and locating hole requirements for this 0.80mm pitch BTB receptacle?
This vertical surface-mount receptacle requires a dual-row PCB pad layout with 0.50mm ±0.03mm pad width, 2.00mm ±0.05mm pad length, and 0.80mm ±0.03mm pitch spacing. The outer row-to-row pad span is 6.40mm ±0.05mm with a 2.50mm ±0.03mm inner clearance. To ensure polarized orientation during automated SMT placement, the PCB must include two asymmetric drilled locating holes of Ø0.80mm ±0.05mm and Ø1.20mm ±0.05mm spaced at Dimension D ±0.08mm to accommodate the 0.70mm and 1.10mm alignment pegs.
How is solder joint reliability maintained across high pin counts up to 200 positions?
Terminal solder tail coplanarity is strictly controlled within 0.10mm maximum across all pin configurations from 40 to 200 contacts (spanning lengths from 21.80mm to 85.80mm). Combined with a UL94V-0 beige high-temperature LCP housing that resists warpage during lead-free reflow soldering, this coplanarity specification prevents open circuits and solder bridging on dense PCB assemblies.
What contact plating specification is used to ensure signal integrity and corrosion resistance?
The receptacle terminals are stamped from phosphor bronze and finished with overall gold flash plating and a minimum of 15 µin selective gold plating on the mating contact area. This metallurgy provides stable mechanical spring force, low contact resistance, and protection against fretting corrosion in industrial and embedded computing environments.
Is this 0.80mm board-to-board socket intermateable with standard BergStak 0.80mm headers?
Yes, this 0.80mm pitch dual-row vertical receptacle is designed as a drop-in replacement and mating counterpart for industry-standard 0.80mm mezzanine interconnect systems, including the Amphenol FCI BergStak 61082 receptacle series and mating 61083 plug headers, supporting flexible board-to-board stacking heights.
Overview and Application Notes
This 0.80mm pitch Board-to-Board (BTB) vertical surface-mount receptacle is engineered for high-density mezzanine PCB interconnections. Featuring a compact 3.70mm profile height and available in 40, 50, 60, 80, 100, 120, 140, 160, 180, and 200 contact configurations, it delivers reliable high-speed signal and power transmission across compact electronic assemblies. Constructed with a beige UL94V-0 high-temperature LCP thermoplastic insulator and phosphor bronze terminals with 15 µin minimum gold plating on the contact area, this surface-mount socket withstands lead-free SMT reflow soldering processes while maintaining low contact resistance and superior corrosion resistance.
Key Features
- Fine Pitch & Versatile Pin Counts: 0.80mm contact pitch in a dual-row vertical configuration, supporting 40, 50, 60, 80, 100, 120, 140, 160, 180, and 200 positions.
- Low-Profile Vertical Design: 3.70mm insulator height (3.75mm overall seated height) with a 5.60mm to 6.00mm width footprint for space-constrained board-to-board stacking.
- High-Reliability Contact Metallurgy: Precision-stamped phosphor bronze terminals featuring gold flash overall and a minimum of 15 µin gold plating on the mating contact area.
- Reflow-Compatible Housing: Beige high-temperature Liquid Crystal Polymer (LCP) thermoplastic housing rated UL94V-0 for dimensional stability during automated SMT assembly.
- Polarized Alignment & Coplanarity: Integrated asymmetric locating pegs (0.70mm and 1.10mm diameters) and 0.10mm maximum solder tail coplanarity ensure accurate placement and solder joint integrity.
- Automated Assembly Ready: Supplied in standard carrier tape and reel packaging for high-speed pick-and-place manufacturing lines.
Engineering Specifications & PCB Integration
For optimal surface-mount solderability and mechanical retention, the recommended PCB land pattern requires 0.50mm ±0.03mm wide by 2.00mm ±0.05mm long copper pads spaced at a 0.80mm ±0.03mm pitch, maintaining a 6.40mm ±0.05mm outer span across rows and a 2.50mm ±0.03mm inner clearance. Asymmetric polarization mounting holes must be drilled at Ø0.80mm ±0.05mm and Ø1.20mm ±0.05mm to match the connector’s 0.70mm and 1.10mm locating bosses (with a 0.75mm ±0.15mm peg standoff length). Strict 0.10mm maximum terminal coplanarity is maintained across all pin counts from 40 to 200 positions to prevent open solder joints during automated reflow.
