2026年7月31日
What Is a Cable Assembly? Definition, Components, and Applications
What is a cable assembly? Learn the engineered definition per IPC/WHMA-A-620, key components, and applications. Avoid mismatched specs—read...
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Intermateable With
- Competitor Part Number
- Amphenol GSB31 Series / Wurth Elektronik 69020 Series equivalent (4-port stacked configurations)
- Mates With
- Standard USB 3.0 & 2.0 Type-A Male Cable Assemblies
Intermateable: This part is mechanically and electrically compatible for mating with the listed competitor connector. Mixed use in the same connector system is supported.
Material Composition
| Material | Value / Description |
|---|---|
| Housing Material | High-Temperature Thermoplastic (UL 94V-0 Rated) |
| Contact Material | Copper Alloy |
| Contact Plating | Gold Plating on Contact Area, Tin on Solder Tails |
| Shielding Shell | Stainless Steel / Brass, Nickel Plated |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Rated Voltage | 30V AC/DC Max |
| Rated Current | 1.8A (USB 3.0 VBUS) / 1.5A (USB 2.0 VBUS) per contact |
| Contact Resistance | 30 mΩ Max (Initial) |
| Insulation Resistance | 1000 MΩ Min |
| Dielectric Withstanding | 500V AC for 1 minute |
| Mating Cycles | 1,500 Cycles |
| Operating Temperature | -40°C to +85°C |
Application Scenarios
-
Industrial Automation PCs (IPCs) : Consolidates multiple peripheral connections (keyboards, scanners, USB drives) into a single high-density I/O block on motherboard designs with limited edge real estate.
-
Smart Kiosks & POS Terminals : Provides reliable, long-life interconnects for customer-facing self-service stations requiring both legacy (USB 2.0) peripheral support and high-speed (USB 3.0) data transfers.
-
Telecommunications & Network Hubs : Ideal for network edge devices and routers that require extensive physical diagnostic, expansion, or configuration interfaces on the front panel.
-
Medical Diagnostic Equipment : Ensures stable, interference-free simultaneous connections between diagnostic mainframes, handheld imaging sensors, and external data storage drives.
Frequently Asked Questions
Is this connector manufactured directly by your facility, or are you a distributor?
We are an ISO-certified direct manufacturer. We handle the entire engineering, tooling, and OEM/ODM manufacturing process in-house, ensuring factory-direct pricing and strict quality control.
Can we customize the gold plating thickness for harsher industrial environments?
Yes. While standard plating is often gold flash, we offer custom plating options up to 30µ" (micro-inches) to meet stringent durability and anti-corrosion requirements for heavy-duty applications.
What are the differences between the top and bottom ports on this stacked connector?
This specific 27.EU26FB3N12236 model features two USB 3.0 ports (9 pins each) on the upper layers for 5 Gbps high-speed transfer, and two USB 2.0 ports (4 pins each) on the lower layers for standard 480 Mbps peripheral connections.
Do you provide 3D CAD models (STEP/IGES) for our PCB layout engineers?
Absolutely. We provide comprehensive technical drawings, PCB footprint layouts, and 3D STEP models to assist your engineering team with rapid integration. Please contact our sales team to request the files.
What is the standard lead time for bulk orders of this stacked USB receptacle?
Standard mass production lead times typically range from 2 to 3 weeks. If you require rapid prototyping, we can deliver sample runs within 3 to 5 business days.
Overview and Application Notes
Overview Designed for high-density I/O panels in industrial and commercial electronics, this quad-port stacked USB Type-A receptacle integrates two USB 3.0 ports and two USB 2.0 ports into a single, space-saving vertical footprint. Featuring 26 precision-engineered contacts and a robust through-hole (DIP) mounting design, this elevated connector ensures exceptional mechanical retention and signal integrity under continuous plugging and unplugging. As a direct-from-factory OEM/ODM manufacturer, we offer fully customizable contact plating, shielding modifications, and automated-assembly-ready packaging to streamline your manufacturing process.
Application Notes
-
PCB Layout & Stacking Height: Ensure precise board hole alignment for all 26 signal pins and multiple outer shell stakes. The elevated four-layer profile requires adequate vertical clearance within the chassis enclosure.
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Grounding & EMI Shielding: Solder all structural shield tabs directly to the PCB ground plane to guarantee full 360° EMI/RFI protection, preventing crosstalk between the high-speed USB 3.0 (5 Gbps) and USB 2.0 (480 Mbps) data lanes.
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Thermal Profiling: Optimized for standard wave soldering processes. Verify that pre-heat and peak wave temperatures do not exceed the thermal threshold of the UL 94V-0 thermoplastic housing.
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Power Delivery Routing: Route separate, adequately widened copper traces for the VBUS lines to support up to 1.8A per USB 3.0 port and 1.5A per USB 2.0 port without inducing localized voltage drops.
