2026年7月14日
What Is a USB-C Connector? A Practical FAQ for OEM Buyers
What is a USB-C connector? Learn the four hidden parameters OEM buyers must check to avoid SMT rework...
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Drop-in Replacement
- Competitor Part Number
- Molex 48393-0001 / TE Connectivity 2129680-1
- Mates With
- Standard USB 3.0 Type-A Male Plugs / Cable Assemblies
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
Material Composition
| Material | Value / Description |
|---|---|
| Contact Base Material | High-Conductivity Copper Alloy |
| Contact Plating | Selective Gold Plated on Mating Area, Tin on Tails |
| Housing Insulator | Thermoplastic (PA9T), Black/Blue, UL 94V-0 Rated |
| Shell Material | Copper Alloy, Nickel Plated |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Rated Voltage | 30V AC (RMS) / DC Max |
| Rated Current | 1.5A |
| Insulation Resistance | 1000 MΩ Min. |
| Dielectric Withstanding Voltage | 500V AC for 1 minute |
| Operating Temperature | -55°C to +105°C |
Application Scenarios
-
Industrial Automation & Embedded Computing: Space-saving SuperSpeed USB data interface for ultra-thin panel PCs, PLC controllers, and edge computers requiring low vertical PCB clearance.
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Medical Diagnostic & Portable Equipment: Reliable external USB data logging ports for portable monitoring carts needing high durability and secure grounding in clinical environments.
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Consumer Electronics & Slim Docking Stations: Low-profile USB 3.0 connectivity integrated into slim hubs, laptops, and external storage enclosures.
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Automotive In-Vehicle Infotainment: High-speed media transfer interface for in-dash modules demanding sturdy mid-mount mechanical stability under continuous vibration.
Frequently Asked Questions
What is the primary mechanical advantage of a mid-mount USB 3.0 receptacle?
A mid-mount receptacle sits partially inside a PCB cutout rather than mounted entirely on top of the board surface. This lowers the total vertical height profile (H2.45 offset), making it essential for compact enclosures with strict Z-axis height limitations.
Is this connector fully backward compatible with legacy USB standards?
Yes, the 9-pin USB 3.0 Type-A pinout incorporates standard USB 2.0 interface contacts, ensuring full backward compatibility with USB 2.0 and USB 1.1 male plugs.
Can EDOM supply custom contact plating thickness for harsh environments?
Absolutely. We provide OEM customization for contact plating ranging from Gold Flash up to 30µ" selective gold to satisfy elevated mating cycle and anti-corrosion requirements.
What compliance certifications and environmental standards apply to this product?
All EDOM USB connectors conform strictly to RoHS, REACH, and UL94V-0 flame retardancy requirements, with full material test reports available upon request.
What are the minimum order quantities (MOQ) and sample lead times?
Standard production MOQ starts at 1,000 units in Tape & Reel or Tray packaging. Engineering samples are available within 3 to 5 business days, and mass production delivery is typically 2 to 3 weeks.
Overview and Application Notes
Overview The EU09FL1N12185 is a high-performance USB 3.0 Type-A female receptacle specifically engineered for low-profile printed circuit board integrations. Featuring a 9-pin surface-mount (SMT) contact configuration combined with a horizontal mid-mount (sink-board, H2.45 profile) structure, it supports SuperSpeed 5 Gbps data signaling while significantly reducing vertical board height in compact device chassis. Constructed with high-temperature PA9T thermoplastic insulation and a robust copper alloy shell with through-hole stakes for EMI shielding and mechanical strain relief, EDOM Electronics offers complete OEM/ODM customization—including selective contact plating, custom reel packaging, and engineering DFM support for global distributors and equipment manufacturers.
Application Notes
-
PCB Cutout Dimensions: Ensure precise board cutouts matching the mid-mount footprint drawing to avoid mechanical housing interference during automated placement.
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Reflow Soldering Profile: Maintain standard lead-free SMT reflow profile limits (peak temperature max 260°C). The high-temperature PA9T thermoplastic insulator (UL 94V-0) provides excellent thermal stability during the SMT process to prevent deformation.
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Grounding & Shell Retention: Solder all through-hole shell stakes solidly to the main PCB ground plane to maximize mechanical strain resistance and achieve optimal EMI/RFI suppression.
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Coplanarity Control: Inspect pin coplanarity within 0.10 mm prior to SMT reflow to guarantee consistent solder joint formation across all 9 signal contacts.
