2026年7月19日
Wire Harness Design Principles for Reliable OEM Products
Learn wire harness design principles for reliable OEM cable assemblies. Discover best practices, components, and tips to optimize...
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Drop-in Replacement
- Competitor Part Number
- Molex 48258 Series / Amphenol GSB31 Series
- Mates With
- Standard USB 3.0 Type-A Receptacles
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
Material Composition
| Material | Value / Description |
|---|---|
| Contact Material | Copper Alloy |
| Contact Plating | Gold Flash on Contact Area, Tin on Solder Tails |
| Shell Material | SPCC / Brass |
| Shell Plating | Nickel Plated |
| Housing Material | High-Temperature Thermoplastic, UL94V-0 |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Data Transfer Rate | Up to 5 Gbps (SuperSpeed) |
| Current Rating | 1.8A Max (VBUS / GND), 0.25A (Other Pins) |
| Voltage Rating | 30V AC/DC Max |
| Mating Cycles | 1,500 Cycles Min. |
| Operating Temperature | -20°C to +85°C |
| Contact Resistance | 30 mΩ Max. |
Application Scenarios
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Industrial IoT Gateways : Offers a low-profile, edge-mounted connection for compact networking equipment requiring reliable 5 Gbps data transfer for local diagnostics.
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USB Flash Drives & Wireless Dongles : Provides the perfect form factor and robust SMT mounting required for portable storage and Wi-Fi/Bluetooth dongle PCB designs.
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Medical Diagnostic Devices : Ensures stable and secure data logging capabilities in portable and space-constrained healthcare equipment.
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Consumer Electronics : Delivers high-speed connectivity for slim-profile smart home hubs, streaming devices, and embedded multimedia systems.
Frequently Asked Questions
What is the maximum data transfer speed of this USB 3.0 plug?
It fully supports USB 3.0 SuperSpeed specifications, delivering up to 5 Gbps data transfer rates, which is 10 times faster than legacy USB 2.0.
Is this connector backward compatible with USB 2.0 receptacles?
Yes, the 9-pin architecture maintains physical and electrical backward compatibility with standard USB 2.0 Type-A ports, safely reverting to 480 Mbps when connected to older devices.
Can the housing withstand automated SMT reflow processes?
Absolutely. The insulator housing is manufactured from high-temperature thermoplastic (UL94V-0) specifically chosen to endure standard lead-free SMT reflow soldering profiles without deformation.
What is your standard lead time and MOQ for this connector?
As a factory-direct supplier, our standard MOQ is typically 1,000 pieces (packaged in Tape & Reel for automated assembly). Standard lead times range from 2 to 4 weeks, with fast-track options available for urgent OEM prototype builds.
Do you offer custom plating options for high-corrosion environments?
Yes. While standard gold flash is suitable for most general applications, we can customize the contact plating thickness (e.g., 15µ" or 30µ" Gold) to meet stringent industrial or marine environmental requirements.
Overview and Application Notes
Overview: Engineered for high-performance board-level integration, this USB 3.0 Type-A male plug features an SMT edge mount design with a low 3.20mm profile, making it ideal for space-constrained PCB applications. Delivering SuperSpeed 5 Gbps data transfer rates, it provides stable and reliable connections for industrial, commercial, and consumer electronics dongles. As an experienced OEM/ODM manufacturer, we guarantee rigorous quality control, high mating cycles, and scalable manufacturing solutions to meet your specific hardware demands.
Application Notes:
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PCB Layout: Maintain strict 90-ohm differential impedance routing for the SuperSpeed signal pairs to ensure optimal data integrity and minimize EMI.
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SMT Soldering: Suitable for standard reflow soldering profiles. Verify that your PCB pad layouts accurately match the edge-mount specifications to prevent tombstoning or misalignment.
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Mechanical Reinforcement: Ensure the through-hole shield stakes (if applicable) or robust SMT ground pads are securely soldered to the PCB ground plane for enhanced mechanical retention against repetitive plugging forces.
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Clearance & Enclosure Design: Account for the 3.20mm height profile in low-clearance enclosures, commonly found in compact wireless dongles or slim industrial communication modules.
