2026年7月25日
What Connectors Are Commonly Used in Custom Cable Assemblies?
Discover what connectors are essential for custom cable assemblies. From wire-to-board to circular connectors, learn to specify with...
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Drop-in Replacement
- Competitor Part Number
- Molex / Amphenol standard USB 3.1 Gen 2 Type-A mid-mount equivalents
- Mates With
- Standard USB 3.0 / 3.1 Type-A Male Plugs and Cable Assemblies
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
Material Composition
| Material | Value / Description |
|---|---|
| Insulator Housing | Thermoplastic, Blue (UL 94V-0) |
| Contact Terminal | Copper Alloy |
| Contact Plating | 30μ" Gold in mating area, Matte Tin on tails, Nickel underplate |
| Outer Shell | Stainless Steel, Nickel Plated |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Current Rating | 1.5A |
| Voltage Rating | 30V AC/DC max. |
| Contact Resistance | 30 mΩ max. initial |
| Insulation Resistance | 1000 MΩ min. |
| Dielectric Withstanding Voltage | 500V AC (1 min) |
| Operating Temperature | -25°C to +85°C |
| Mating Cycles | 1,500 cycles min. |
Application Scenarios
-
Industrial PCs (IPCs) & Machine Vision: The space-saving mid-mount design reduces the vertical footprint in compact industrial chassis while delivering the critical 10Gbps bandwidth needed for high-resolution machine vision cameras.
-
Automotive Infotainment Systems: Provides a ruggedized, high-durability data and charging port for vehicle dashboards, where vibration resistance and a low-profile PCB assembly are essential.
-
Premium Consumer Electronics: Ideal for ultrathin laptops, mini PCs, and smart home hubs where external chassis thickness is highly restricted but legacy Type-A backward compatibility is still required.
-
Telecommunication & Networking Equipment: Serves as a reliable, high-speed diagnostic and firmware update port on enterprise routers and edge computing servers.
Frequently Asked Questions
Why choose a mid-mount (sink board) USB receptacle over a standard top-mount?
A mid-mount design drops the connector profile partially through the PCB, significantly reducing the overall height of the assembly above the board. This is crucial for engineering ultra-thin devices or compact industrial enclosures.
Are these connectors compatible with high-speed automated SMT assembly?
Yes. We supply these USB 3.1 receptacles in Tape and Reel packaging with high-temperature Kapton tape (pick-and-place caps), perfectly suited for standard vacuum nozzle automated placement.
Can you customize the gold plating thickness on the contact pins?
Absolutely. While our standard high-durability option is 30μ" gold, as an OEM factory we can adjust the plating thickness (e.g., Gold Flash, 15μ", or 50μ") based on your specific cycle-life requirements and budget.
Does this Type-A connector support 100W or 240W Power Delivery?
No. High-wattage Power Delivery (like 100W or 240W EPR) is exclusive to the USB Type-C standard. This USB 3.1 Gen 2 Type-A connector is designed for high-speed 10Gbps data and standard VBUS power applications (typically up to 1.5A to 1.8A at 5V).
What is your standard lead time for bulk orders?
No. High-wattage Power Delivery (such as 100W or 240W USB-PD EPR) is exclusive to USB Type-C architecture. This USB 3.1 Gen 2 Type-A connector is engineered for 10Gbps SuperSpeed+ data transfer and standard 1.5A VBUS power delivery at 30V AC/DC.
Overview and Application Notes
-
Overview: Engineered for next-generation 10 Gbps SuperSpeed+ data transmission, this USB 3.1 Gen 2 Type-A female receptacle features an ultra-low-profile mid-mount (sink-board H2.11mm, CH -0.75mm) design to minimize vertical footprint in space-constrained enclosures. Built with hybrid mounting termination—surface-mount (SMT) signal contacts for pristine 10 Gbps differential impedance and through-hole (DIP) shield stakes for rigid PCB retention—it withstands demanding insertion cycles. Constructed with a blue thermoplastic insulator (UL 94V-0), gold-plated copper alloy contacts, and a nickel-plated stainless steel shell, this connector operates reliably across a temperature range of -25°C to +85°C with a 1.5A contact current rating and 500V AC dielectric withstanding voltage. As an ISO-certified direct manufacturer, EDOM Electronics provides factory pricing, customizable plating options, and carrier tape-and-reel packaging for automated SMT lines.
-
PCB Cutout & Sinking Height: This connector features a mid-mount configuration with a sink depth of 2.11mm (CH -0.75mm). Follow the recommended PCB cutout layout strictly (tolerance ±0.05mm) to ensure precise board-edge seating and prevent physical interference with adjacent components.
-
Differential Impedance for 10Gbps: Maintain strict 90Ω (±15%) differential trace impedance on the high-speed data pairs (SSRX/SSTX) leading to the SMT pads to prevent signal degradation at 10 Gbps Gen 2 speeds.
-
Hybrid Soldering Process: The SMT signal contacts and blue high-temperature housing support standard lead-free reflow soldering, while the outer stainless steel shell retention stakes require secure wave or selective soldering to the ground plane.
-
Mechanical Grounding & Retention: Solder all 4 outer stainless steel shell stakes firmly to the PCB ground plane to dissipate mechanical strain during cable insertion and ensure continuous 360° EMI/RFI shielding.
-
Application Notes:
