2026年7月14日
What Is a USB-C Connector? A Practical FAQ for OEM Buyers
What is a USB-C connector? Learn the four hidden parameters OEM buyers must check to avoid SMT rework...
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Drop-in Replacement
- Competitor Part Number
- Molex 213716 Series / TE Connectivity 2305018-1
- Mates With
- Standard USB Type-C Plugs and Cable Assemblies
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
Material Composition
| Material | Value / Description |
|---|---|
| Insulator / Housing | High-Temperature Thermoplastic (UL94 V-0) |
| Contact Material | Copper Alloy |
| Contact Plating | Gold Flash (15μ" / 30μ" Gold Optional) over Nickel |
| Shell Material | Stainless Steel |
| Shell Plating | Nickel Plated |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Data Transfer Rate | Up to 10 Gbps (SuperSpeed+) |
| Current Rating | 5.0A (VBUS/GND Combined), 1.25A (VCONN), 0.25A (Signal Pins) |
| Voltage Rating | 20V / 48V DC Max (USB PD 3.1 Support) |
| Contact Resistance | 40 mΩ Max Initial (10 mΩ Max Change After Test) |
| Insulation Resistance | 100 MΩ Min |
| Dielectric Withstanding Voltage | 100V AC for 1 minute |
| Operating Temperature | -40°C to +85°C |
| Mechanical Force | Mating Force: 5N–20N / Unmating Force: 8N–20N |
| Recommended PCB Thickness | 1.00mm or 1.20mm |
Application Scenarios
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Industrial Automation Controllers : Delivers high-speed 10 Gbps data logging and firmware updating capabilities for compact edge gateways and human-machine interfaces (HMIs).
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Medical Diagnostic Equipment : Provides secure, EMI-shielded Type-C connectivity for portable diagnostic tablets and monitoring consoles requiring high insertion durability.
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Networking Switches & Routers : Acts as a high-performance front-panel service interface for system configuration and external storage expansion on commercial network devices.
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Embedded Single-Board Computers (SBCs) : Offers a compact, low-profile 24-pin top-mount SMT socket solution for space-constrained IoT hardware and embedded mainboards.
Frequently Asked Questions
What mounting type and PCB thickness are recommended for EU24FB3N1130?
This receptacle utilizes a hybrid SMT + DIP configuration with extended shell legs (L=1.65mm), engineered specifically for 1.0mm or 1.2mm PCB thickness.
What are the mechanical mating force specifications and durability ratings?
It is rated for 10,000 mating cycles, with an initial insertion force of 5N to 20N and an unmating force of 8N to 20N after durability testing.
Does this receptacle support custom contact gold plating for harsh operating environments?
Yes. While gold flash is standard, we provide customizable 15μ" or 30μ" selective gold plating to satisfy stringent anti-corrosion and high-mating-cycle requirements for industrial applications.
What is the typical Minimum Order Quantity (MOQ) and sample lead time?
We provide rapid prototyping samples within 3 to 5 business days. Standard production MOQ depends on custom specifications, but we offer flexible initial order volumes to support your testing phase.
Can your factory provide 3D STEP files and PCB layout footprint drawings?
Yes, complete engineering packages including 3D STEP models, PCB footprint recommendations, and detailed product datasheets are available immediately upon request.
Overview and Application Notes
Overview Engineered for compact, high-speed electronic devices, this USB 3.1 Gen 2 Type-C 24-pin female receptacle features a short-body top-mount configuration (7.35mm depth, 5.50mm body width) with extended DIP shell retention legs (L=1.65mm). Designed with a high-temperature UL94 V-0 thermoplastic insulator and copper alloy contacts, it supports high-efficiency power delivery (5A on VBUS, 1.25A on VCONN) alongside SuperSpeed+ 10 Gbps data transmission. Its hybrid mounting design—combining dual-row SMT/DIP signal contacts with 4 robust through-hole shell stakes—delivers exceptional mechanical peel resistance against heavy mating cycles (rated for 10,000 cycles). As a direct factory OEM/ODM solution, it ensures seamless lead-free reflow soldering compatibility and robust 360-degree EMI shielding for space-constrained PCB designs.
Application Notes
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Hybrid SMT/DIP Footprint: Features a 24-pin dual-row staggered layout combining surface-mount leads with through-hole pins; follow the recommended PCB hole patterns (4x 0.50mm slot, 4x 1.10mm shell holes) for precise solder paste application and pin registration.
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Recommended PCB Thickness: The connector footprint and extended shell stake length (L=1.65mm) are optimized specifically for 1.00mm or 1.20mm thick circuit boards.
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Reflow & Wave Compatibility: Molded from high-temperature UL94 V-0 plastic designed to withstand standard lead-free reflow profiles (peak ~260°C); ensure proper thermal zone management during soldering.
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Mechanical Retention: The 4 outer DIP shell retention stakes absorb 5N–20N insertion and 8N–20N extraction forces, providing rugged grounding and protecting fine-pitch signal solder joints from shear stress.
