2026年7月14日
What Is a USB-C Connector? A Practical FAQ for OEM Buyers
What is a USB-C connector? Learn the four hidden parameters OEM buyers must check to avoid SMT rework...
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Drop-in Replacement
- Competitor Part Number
- Molex 213716 Series / TE Connectivity 2305018-1
- Mates With
- Standard USB Type-C Plugs and Cable Assemblies
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
Material Composition
| Material | Value / Description |
|---|---|
| Insulator / Housing | High-Temperature Thermoplastic (UL94V-0), Black |
| Contact Material | High-Conductivity Copper Alloy |
| Contact Plating | Gold Flash (15μ" / 30μ" Gold Optional) over Nickel |
| Shell Material | Stainless Steel |
| Shell Plating | Nickel Plated |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Data Transfer Rate | Up to 10 Gbps (SuperSpeed+) |
| Current Rating | 5.0A (VBUS/GND Combined), 1.25A (VCONN), 0.25A (Signal Pins) |
| Voltage Rating | 20V / 48V DC Max (USB PD 3.1 Support) |
| Contact Resistance | 40 mΩ Max (Initial) |
| Insulation Resistance | 100 MΩ Min |
| Dielectric Withstanding Voltage | 100V AC for 1 minute |
| Operating Temperature | -40°C to +85°C |
Application Scenarios
-
Industrial Automation Controllers : Delivers high-speed 10 Gbps data logging and firmware updating capabilities for compact edge gateways and human-machine interfaces (HMIs).
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Medical Diagnostic Equipment : Provides secure, EMI-shielded Type-C connectivity for portable diagnostic tablets and monitoring consoles requiring high insertion durability.
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Networking Switches & Routers : Acts as a high-performance front-panel service interface for system configuration and external storage expansion on commercial network devices.
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Embedded Single-Board Computers (SBCs) : Offers a compact, low-profile 24-pin top-mount SMT socket solution for space-constrained IoT hardware and embedded mainboards.
Frequently Asked Questions
Is this 24-pin USB Type-C receptacle fully compliant with USB 3.2 Gen 2 data speeds?
Yes, it is fully engineered to support USB 3.2 Gen 2 SuperSpeed+ protocol delivering data rates up to 10 Gbps, while maintaining backward compatibility with USB 3.0 and USB 2.0 standards.
Can this connector withstand standard lead-free SMT reflow soldering?
Absolutely. The housing is molded from high-temperature UL94V-0 thermoplastic engineered to endure standard Pb-free reflow profiles with peak temperatures up to 260°C.
Does this receptacle support custom contact gold plating for harsh operating environments?
Yes. While gold flash is standard, we provide customizable 15μ" or 30μ" selective gold plating to satisfy stringent anti-corrosion and high-mating-cycle requirements for industrial applications.
What is the typical Minimum Order Quantity (MOQ) and sample lead time?
We provide rapid prototyping samples within 3 to 5 business days. Standard production MOQ depends on custom specifications, but we offer flexible initial order volumes to support your testing phase.
Can your factory provide 3D STEP files and PCB layout footprint drawings?
Yes, complete engineering packages including 3D STEP models, PCB footprint recommendations, and detailed product datasheets are available immediately upon request.
Overview and Application Notes
Overview Engineered for high-speed 10 Gbps SuperSpeed+ data transmission and USB Power Delivery applications, this USB 3.2 Gen 2 Type-C 24-pin receptacle features a robust horizontal SMT top-mount design with locating pegs for precise PCB alignment. Constructed with high-temperature thermoplastics and inner shell solder stakes, it provides maximum mechanical anchoring and high signal integrity for demanding industrial, medical, and commercial electronic assemblies. As a direct factory OEM manufacturer, we offer flexible custom engineering, rapid 3-5 day prototyping, and scalable volume production.
Application Notes
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PCB Peg Alignment: Ensure accurate positioning of locating peg holes on your PCB layout to maintain exact terminal pin registration during SMT pick-and-place operation.
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Reflow Soldering Control: Molded from high-temperature LCP/Thermoplastic designed to withstand lead-free reflow profiles peaking at 260°C; strictly control thermal ramp rates to avoid shell deformation.
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Grounding & EMI Shielding: Solidly solder the inner shell stakes to system ground pads to optimize high-frequency EMI/RFI suppression and absorb repeated insertion/extraction mechanical stresses.
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Fine-Pitch Stencil Design: The 24-pin high-density terminal layout requires precise solder paste stencil thickness and aperture sizing to prevent micro-bridging across signal pins.
