2026年7月31日
What Is a Cable Assembly? Definition, Components, and Applications
What is a cable assembly? Learn the engineered definition per IPC/WHMA-A-620, key components, and applications. Avoid mismatched specs—read...
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Drop-in Replacement
- Competitor Part Number
- Molex 105444 Series / TE Connectivity 2320115 Series (Depending on specific PCB cutout tolerances)
- Mates With
- Standard USB 3.2 Gen2 Type-C Plugs & Cable Assemblies
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
Material Composition
| Material | Value / Description |
|---|---|
| Housing / Insulator | PA9T + 45% G.F. Thermoplastic (UL94 V-0), Black |
| Contacts | C19400 Copper Alloy (T=0.12mm), 1μ" Gold Plated |
| Outer Shell | Dual SUS301R Stainless Steel Shells (60μ" Min Ni Plated) with SUS304 RFI Pad |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Voltage Rating | 5.0V |
| Current Rating | 3.0A |
| Mating Cycles | 10,000 Cycles (Minimum) |
| Operating Temperature | -40°C to +85°C |
| Contact Resistance | 40 mΩ Max (Initial), 10 mΩ Max Change After Durability Test |
| Insulation Resistance | 100 MΩ Min |
| Insertion Force | 0.5–2.0 kg |
| Withdrawal Force | 0.8–2.0 kg (Initial), 0.6–2.0 kg (After 10k Cycles) |
Application Scenarios
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Ultra-Thin Laptops & Tablets: Leverages the mid-mount C.H=0.55mm profile to drastically reduce vertical Z-axis height for slim enclosures while delivering 10 Gbps SuperSpeed+ data transmission.
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Industrial Panel PCs (IPCs): Dual SUS301R stainless steel shells with 6 SMT tabs ensure superior EMI suppression and high vibration resistance across 10,000 mating cycles.
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Portable Medical Diagnostic Monitors: High-reliability PA9T+45%G.F. housing and C19400 contacts provide stable, clean signal integrity for space-constrained medical imaging and diagnostic devices.
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Smart Edge Computing & Docking Hubs: Serves as a compact all-SMT 10Gbps Type-C interface, streamlining high-volume SMT surface mount assembly lines.
Frequently Asked Questions
What are the electrical ratings and power delivery capability for EU24F2B3N11385SR?
According to the engineering drawing, the connector is rated for 3.0A current and 5.0V voltage, providing robust standard bus power and 10 Gbps high-speed data transmission.
What are the exact sink height and structural shell materials?
The connector features a mid-mount center drop height of C.H=0.55mm (overall length 9.60mm) and utilizes dual SUS301R stainless steel shells (outer T=0.25mm, inner T=0.20mm with 60u" min nickel plating) combined with an SUS304 RFI pad for enhanced shielding.
Can this connector withstand lead-free reflow soldering processes?
Absolutely. The housing is molded from high-temperature Liquid Crystal Polymer (LCP) rated at UL94V-0, making it fully compatible with standard RoHS lead-free IR reflow soldering profiles up to 260°C.
Do you provide 3D CAD models and PCB footprints?
Yes, we provide comprehensive technical documentation. 2D dimension drawings, 3D STEP files, and recommended mid-mount PCB cutout guidelines are available upon request to assist your hardware engineers.
Are the shell stakes also Surface Mount (SMT)?
Yes, this specific part number (18.EU24F2B3N11385SR) features full SMT termination for both the 24 signal contacts and the outer shell stakes, streamlining your assembly process to a single reflow pass.
Overview and Application Notes
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Overview: Engineered for ultra-thin profile devices, industrial panel computers, and portable electronics, the EU24F2B3N11385SR is a 24-pin USB 3.2 Gen 2 Type-C female receptacle featuring a space-saving mid-mount all-SMT architecture with a 0.55mm center drop height (C.H=0.55mm, overall length 9.60mm). Constructed with a high-temperature PA9T+45%G.F. (UL94V-0) thermoplastic housing, dual stainless steel shielding shells (SUS301R-1/2H outer shell T=0.25mm, inner shell T=0.20mm with 60u” min nickel plating), SUS304 RFI pad, and C19400 copper alloy contacts (T=0.12mm with Au 1u” plating), it delivers reliable 10 Gbps SuperSpeed+ data transmission and 3.0A power transfer at 5.0V. The full surface-mount design—featuring 24 signal leads and 6 SMT shell grounding tabs—provides seamless automated reflow assembly, exceptional EMI/RFI suppression, and 10,000-cycle durability across harsh operating environments.
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Application Notes:
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PCB Edge Cutout & Profile: Designed for mid-mount installation with a 0.55mm center drop height (C.H=0.55mm, stand-off 0.35mm); strictly adhere to the recommended PCB cutout (7.35mm / 9.85mm width, 5.65mm setback) and positioning holes (2-Ø0.70mm, 2-Ø0.60mm) to guarantee precise alignment.
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Full SMT Soldering & Coplanarity: Features 24 surface-mount signal contacts (0.25mm pad width, 0.50mm pitch) and 6 SMT shell solder tabs (6-0.90×0.25mm); maintain precise solder paste volume and stencil aperture to ensure strict coplanarity (0.10mm max) without bridging.
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Lead-Free Reflow Compatibility: Molded from high-temperature PA9T+45%G.F. resin (UL94V-0 rated), fully compatible with standard RoHS lead-free IR/convection reflow soldering profiles (peak temperature up to 260°C).
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EMI/RFI Suppression & Grounding: Integrates an SUS304 RFI pad (T=0.08mm) and dual spot-welded stainless steel shells (outer SUS301R T=0.25mm, inner SUS301R T=0.20mm) with 60μ” min nickel plating to deliver seamless 360-degree shielding while absorbing 0.5–2.0 kg insertion force and 0.8–2.0 kg withdrawal force.
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