2026年7月14日
What Is a USB-C Connector? A Practical FAQ for OEM Buyers
What is a USB-C connector? Learn the four hidden parameters OEM buyers must check to avoid SMT rework...
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Drop-in Replacement
- Competitor Part Number
- Generic USB 3.1 Type-C 24-Pin Mid-Mount SMT+DIP Receptacle
- Mates With
- Standard USB Type-C Plugs and Cable Assemblies
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
Material Composition
| Material | Value / Description |
|---|---|
| Insulator / Housing | Synthetic Resin, Black |
| Contacts | Copper Alloy |
| Contact Plating | 15μ" Gold on Contact Area, 100μ" Tin on Solder Tails over 50μ" Min Nickel |
| Shell | Stainless Steel with 50μ" Min Nickel Plating (Dual Shells & Ground Plates) |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Current Rating | 1.5A |
| Voltage Rating | 100V AC (1 Minute) |
| Power Rating | Standard Bus Power (1.5A Rating) |
| Contact Resistance | 40 mΩ Max (Initial) |
| Insulation Resistance | 100 MΩ Min |
| Dielectric Withstanding | 100V AC for 1 Minute |
| Mating Cycles | 10,000 Cycles |
| Operating Temperature | -30°C to +85°C |
| Mating Force: | 5N–20N |
| Unmating Force: | 8N–20N |
Application Scenarios
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Ultra-Thin Industrial Embedded SBCs & Panel PCs: Space-saving mid-mount sink layout reduces vertical PCB profile while delivering 10Gbps data throughput.
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Medical Diagnostic Displays & Handheld Monitors: Features 15μ" gold contacts and 10,000-cycle durability for high-reliability medical instrumentation.
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Automotive Infotainment Modules: Rugged 4-DIP shell retention legs and dual stainless steel shields resist continuous vibration and EMI/RFI noise.
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Compact Multi-Port Docking & Expansion Hubs: Provides stable high-speed transmission with hybrid SMT/DIP solder joint integrity.
Frequently Asked Questions
What is the mounting configuration of the EU24FB3M1137 Type-C receptacle?
The EU24FB3M1137 is a mid-mount (sink-type) right-angle connector utilizing a hybrid SMT and DIP mounting design (12 SMT leads, 12 DIP pins, and 4 DIP shell retention stakes) for ultra-thin PCB edge integration.
What are the certified electrical and plating specifications?
According to the factory engineering drawing, it is rated for 1.5A current, 100V AC withstanding voltage, and features premium 15μ" gold plating on contact areas over a 50μ" nickel underplate.
What packaging is used for automated SMT assembly?
We supply this connector in standard Tape & Reel (T&R) packaging equipped with a pick-and-place polyimide cap (Mylar) to ensure seamless compatibility with high-speed automated SMT vacuum nozzles.
What is the Minimum Order Quantity (MOQ) for OEM buyers?
Our standard MOQ for Tape & Reel packaging is typically 1,000 pieces per reel. We also support flexible quantities for engineering validation and NPI (New Product Introduction) builds. Please consult our sales engineering team.
Can I request a 3D CAD model for PCB layout design?
Absolutely. We provide comprehensive engineering support, including 2D mechanical drawings and 3D models (STEP/IGES files). Contact us to request the design files for your footprint verification.
Overview and Application Notes
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Overview: Engineered for ultra-slim devices, industrial controllers, and portable electronics, the EU24FB3M1137 is a high-speed 24-pin USB 3.1 Type-C female receptacle featuring a space-saving mid-mount (sink-type, R/A) configuration. Built with high-temperature synthetic resin insulator housing, dual stainless steel shielding shells with ground plates, and 24 copper alloy contacts (12 SMT pins + 12 DIP pins with Au 15u” plating on contact areas and 100u” Tin on solder tails over 50u” Nickel), it supports up to 10 Gbps SuperSpeed+ data transmission and 1.5A current rating. Its hybrid SMT/DIP architecture—pairing 12 surface-mount leads with 12 through-hole pins and 4 DIP shell mounting stakes—delivers superior mechanical retention and peel resistance against continuous mating stress across 10,000 mating cycles.
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Application Notes:
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PCB Cutout & Mid-Mount Layout: Designed specifically for mid-mount sink installation; strictly adhere to the recommended PCB layout (9.50mm cutout width, 2.50mm edge setback) to ensure proper connector seating and mechanical alignment with external enclosures.
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Hybrid SMT & DIP Soldering: Features a staggered 24-pin dual-row architecture combining 12 SMT surface pads (12×0.35mm) with 12 through-hole DIP pins (12×0.72mm slots) alongside 4 shell DIP retention holes (4-1.10×0.75mm); ensure proper solder paste stencil volume and through-hole solder fill.
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Lead-Free Reflow Compatibility: Molded from high-temperature synthetic resin, fully rated for standard RoHS lead-free reflow and wave soldering processes (peak reflow temperature up to 260°C).
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Multi-Layer EMI Shielding: Incorporates dual outer stainless steel shells (SHELL-1 & SHELL-2) and top/bottom ground plates with nickel underplating (50u” min) to provide seamless 360-degree shielding and absorb 5N–20N mating force and 8N–20N unmating force.
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