2026年7月30日
Wiring and Harness Design for OEM Buyers: Key Specification Points
Get essential wiring and harness design specs for OEM buyers: wire gauge, connectors, routing. Prevent costly errors—read now.
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Product Specifications
Key parameters for OEM, distributor and engineering evaluation.
Detailed Product Information
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
| Material | Value / Description |
|---|---|
| Contact Material: | Copper Alloy |
| Contact Plating: | Gold Plated over Copper Alloy |
| Shell & Mid Plate | Stainless Steel, Nickel Plated (Outer Shell & Mid Plate) |
| Insulator Material: | LCP Thermoplastic (UL94 V-0) |
| Shell Stake Type: | Inner Shell Stake |
| Characteristic | Value |
|---|---|
| Voltage Rating: | 5V AC Max |
| Current Rating: | 5A (VBUS) |
| Mating Cycles: | 10,000 Cycles Min. |
| Operating Temp: | -55°C to +85°C |
| Contact Resistance: | 40 mΩ Max. |
| Withstanding Voltage | 100V AC |
| Insulation Resistance | 100 MΩ Min |
| Insertion | 5N–20N |
| Extraction | 8N–20N |
Industrial Automation Controllers: Providing rugged, high-speed diagnostic and control data interfaces for PLCs and robotic systems where PCB space is at a premium.
Medical & Diagnostic Devices: Enabling reliable data transfer for portable patient monitors and ultrasound equipment across wide operating temperatures.
Consumer Electronics & IoT: Serving as a durable high-speed charging and data sync port for laptops, tablets, and smart devices.
Automotive Infotainment Systems: Facilitating seamless media integration for dashboard modules, withstanding -55°C to +85°C temperatures, vibrations, and 10,000 mating cycles.
Overview: Engineered for reliable high-speed data transmission and durable hardware integration, the EU24FB3N11253 is a 24-pin USB 3.1 Type-C female receptacle featuring a top-mount right-angle (R/A) dual-row SMT architecture. Constructed with high-temperature UL94 V-0 black LCP housing, a nickel-plated stainless steel shell, an internal stainless steel mid-plate, and 24 gold-plated copper alloy contacts, it delivers SuperSpeed+ 10Gbps data throughput. The surface-mount footprint features dual plastic locating pegs for precise PCB positioning and mechanical stability, operating reliably across an extended industrial temperature range of -55°C to +85°C with a tested durability of 10,000 mating cycles.
Application Notes:
Top-Mount PCB Layout & Locating Pegs: Designed for top-mount horizontal placement; follow the recommended PCB layout (width 8.64mm, dual positioning pegs) to ensure accurate alignment and prevent mechanical shifting during solder reflow.
Dual-SMT Soldering & Stencil Design: Features a 24-pin dual-row surface-mount configuration (0.50mm pitch, 0.25mm pad width) paired with 4 SMT outer shell grounding pads (0.60×1.50mm); optimize solder paste volume to prevent bridging across fine-pitch contacts.
Reflow Soldering Profile: Molded from high-temperature UL94 V-0 LCP thermoplastic, fully compatible with standard RoHS lead-free IR and convection reflow soldering profiles (peak temperature up to 260°C).
Mechanical Shielding & Retention: The nickel-plated stainless steel outer shell and internal mid-plate ensure continuous 360-degree EMI shielding while absorbing 5N–20N insertion force and 8N–20N extraction force to protect signal solder joints.
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Get essential wiring and harness design specs for OEM buyers: wire gauge, connectors, routing. Prevent costly errors—read now.
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