2026年9月10日
DC Connector Rating vs AC Connector Derating: Key Specs Explained
Learn how to evaluate DC connector rating vs AC connector derating for 48V BOM substitutes. Get standards-based steps...
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Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
| Material | Value / Description |
|---|---|
| Housing Material | High-Temperature Thermoplastic (LCP), UL 94V-0, Color: Black |
| Contact Material | Copper Alloy, T=0.10 mm |
| Contact Plating | Gold Plated (Au) |
| Shell Material | Copper Alloy, T=0.30 mm |
| Shell Plating | Gold Plated (Au) |
| Characteristic | Value |
|---|---|
| Contact Resistance | 30 mΩ Max. |
| Insulation Resistance | 1000 MΩ Min. |
| Dielectric Withstanding Voltage | AC 500V, 1 Minute |
| Operating Temperature Range | -55°C to +105°C |
| General Tolerances | ±0.05 mm (PCB Layout) / ±0.15 mm (Overall Profile) |
Single Board Computers (SBCs) and Ultra-Compact Embedded Computing Modules
Portable Field Test Equipment and Digital Handheld Instruments
Compact Industrial Automation Controllers and Human-Machine Interfaces (HMIs)
High-Density FPV Drone Cameras, Action Cams, and Aerial Gimbal Vision Systems
Medical Handheld Endoscopes, Monitors, and Mobile Diagnostic Interfaces
Commercial Smart Displays, Signage Media Players, and Micro Projectors
The Mini HDMI Type C female receptacle is engineered with an SMT contact interface and a sinking mid-mount configuration featuring a 0.80mm below-board offset and 4 through-hole shell mounting legs for reinforced mechanical retention. Built with a neutral shell without embossed logos, it delivers high-integrity digital audio-video transmission in low-profile embedded systems, compact portable devices, and density-critical PCB layouts.
The connector requires a board cut-out width of 11.70mm to accommodate the mid-mount sinking body, with an outer shell footprint pitch of 14.00mm. Signal pads are spaced at a precision 0.40mm center-to-center pitch with recommended pad widths of 0.25mm. Recommended PCB thickness is 1.00mm to 1.20mm. The 4 solder tines ensure high-reliability ground grounding and mechanical latching during repeated cable insertion.
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