2026年7月31日
What Is a Cable Assembly? Definition, Components, and Applications
What is a cable assembly? Learn the engineered definition per IPC/WHMA-A-620, key components, and applications. Avoid mismatched specs—read...
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Intermateable With
- Competitor Part Number
- Amphenol GSB311131HR / Molex 48405-0001
- Mates With
- Standard USB 3.0 Type-A Male Cable Assemblies
Intermateable: This part is mechanically and electrically compatible for mating with the listed competitor connector. Mixed use in the same connector system is supported.
Material Composition
| Material | Value / Description |
|---|---|
| Housing Material | High-Temperature Thermoplastic (UL 94V-0 Rated) |
| Contact Material | Copper Alloy |
| Contact Plating | Gold Plating on Contact Area, Tin on Solder Tails |
| Shell Material | Stainless Steel / Copper Alloy, Nickel Plated |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Rated Voltage | 30V AC/DC |
| Rated Current | 1.8A per contact (VBUS/GND), 0.25A (Signal) |
| Contact Resistance | 30 mΩ Max (Initial) |
| Insulation Resistance | 1000 MΩ Min |
| Dielectric Withstanding Voltage | 100V AC for 1 minute |
| Mating Cycles | 1,500 Cycles |
| Operating Temperature | -40°C to +85°C |
Application Scenarios
-
Industrial Automation & PLC Units: Provides dual high-speed data interfaces for programmable logic controllers and industrial PCs in compact panel cutouts.
-
Medical & Diagnostic Equipment: Space-saving dual video/data stream connections between diagnostic instruments, handheld scanners, and main processing units.
-
Telecommunications & Networking Hubs: High-density peripheral interconnect for network switches, routers, and edge gateway devices requiring multi-port USB expansion.
-
Commercial Computing & POS Terminals: Long-life peripheral interfaces for point-of-sale systems, kiosks, and embedded single-board computers (SBCs).
Frequently Asked Questions
Are you the direct manufacturer or a trading company for this USB connector?
We are an ISO-certified OEM/ODM factory specializing in connector manufacturing and custom cable assemblies. We provide factory-direct pricing, rapid prototyping (3-5 days), and full engineering support.
Can we customize the gold plating thickness or shell stake configuration?
Yes. We offer customizable gold plating (from Flash up to 30u") on contact areas to match your durability requirements, as well as customized shell stake styles for custom PCB layouts.
What certifications and environmental standards do your connectors comply with?
All our USB connectors are manufactured in compliance with RoHS, REACH, and UL standards. Detailed compliance documentation and material test reports are available upon request.
What is your standard lead time for sample prototyping and bulk orders?
Sample prototypes are typically completed within 3 to 5 business days. Standard mass production orders are fulfilled within 2 to 3 weeks depending on quantity and customization specifications.
Overview and Application Notes
Overview Designed for high-density industrial and commercial electronics, this dual-port stacked USB 3.0 Type-A receptacle provides reliable data transfer speeds up to 5 Gbps and robust power delivery in a space-saving vertical footprint. Featuring 18 precision contacts and reinforced through-hole shell stakes, this connector delivers exceptional mechanical retention and structural integrity under high-vibration and frequent insertion cycles. As a direct-from-factory OEM/ODM manufacturer, we offer fully customized plating options, shell modifications, and specialized packaging to fit your automated SMT/DIP assembly line requirements.
Application Notes
-
PCB Layout & Stacking Height: Ensure precise board hole alignment for all 18 signal pins and shell stakes to avoid mechanical strain during manual DIP insertion.
-
Grounding & EMI Shielding: Solder all four outer shell stakes securely to the chassis/PCB ground plane to ensure full 360° EMI/RFI protection and optimal signal integrity.
-
Thermal Management: Designed for standard wave soldering processes; ensure thermal profiles do not exceed housing material limits during assembly.
-
Power Trace Routing: Route power lines (VBUS) with adequate copper width to support standard USB 3.0 power loads without inducing voltage drop across stacked ports.
