2026年7月31日
What Is a Cable Assembly? Definition, Components, and Applications
What is a cable assembly? Learn the engineered definition per IPC/WHMA-A-620, key components, and applications. Avoid mismatched specs—read...
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Intermateable With
- Competitor Part Number
- Amphenol GSB311131HR / Molex 48405-0001
- Mates With
- Standard USB 3.0 Type-A Male Cable Assemblies
Intermateable: This part is mechanically and electrically compatible for mating with the listed competitor connector. Mixed use in the same connector system is supported.
Material Composition
| Material | Value / Description |
|---|---|
| Housing Material | PA9T Blue Housing & LCP Blue Cover (UL 94V-0) |
| Contact Material | Copper Alloy, Gold Plated on Contact Area & Tin Plated on Solder Tails |
| Contact Plating | Stainless Steel, Nickel Plated |
| Shell Material | Stainless Steel, Nickel Plated |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Rated Voltage | 30V AC/DC |
| Rated Current | 1.8A per contact (VBUS/GND), 0.25A (Signal) |
| Contact Resistance | 30 mΩ Max (Initial) |
| Insulation Resistance | 1000 MΩ Min |
| Dielectric Withstanding Voltage | 500V AC for 1 minute |
| Mating Cycles | 1,500 Cycles |
| Operating Temperature | -55°C to +105°C |
Application Scenarios
-
Industrial Automation & PLC Units: Provides dual high-speed data interfaces for programmable logic controllers and industrial PCs in compact panel cutouts.
-
Medical & Diagnostic Equipment: Space-saving dual video/data stream connections between diagnostic instruments, handheld scanners, and main processing units.
-
Telecommunications & Networking Hubs: High-density peripheral interconnect for network switches, routers, and edge gateway devices requiring multi-port USB expansion.
-
Commercial Computing & POS Terminals: Long-life peripheral interfaces for point-of-sale systems, kiosks, and embedded single-board computers (SBCs).
Frequently Asked Questions
Are you the direct manufacturer or a trading company for this USB connector?
We are an ISO-certified OEM/ODM factory specializing in connector manufacturing and custom cable assemblies. We provide factory-direct pricing, rapid prototyping (3-5 days), and full engineering support.
What materials are used in the housing and shell of this dual USB 3.0 connector?
The EU18FL3N12225 is constructed with a UL 94V-0 rated PA9T blue housing and LCP blue cover for exceptional thermal stability during wave soldering, paired with a heavy-duty nickel-plated stainless steel shell and gold/tin-plated copper alloy contacts.
What certifications and environmental standards do your connectors comply with?
All our USB connectors are manufactured in compliance with RoHS, REACH, and UL standards. Detailed compliance documentation and material test reports are available upon request.
What is your standard lead time for sample prototyping and bulk orders?
Sample prototypes are typically completed within 3 to 5 business days. Standard mass production orders are fulfilled within 2 to 3 weeks depending on quantity and customization specifications.
Overview and Application Notes
Overview: The EU18FL3N12225 is an industrial-grade, dual-port stacked USB 3.0 Type-A female receptacle engineered for 90-degree right-angle through-hole (DIP) PCB horizontal mounting. Designed to double front-panel port density while maintaining SuperSpeed data transfer rates up to 5 Gbps, it features an 18-pin configuration (9 pins per port) and 4 robust through-hole outer shell stakes for superior mechanical board retention. Constructed with high-temperature thermoplastic insulators (UL 94V-0 rated PA9T Blue housing and LCP Blue cover), gold-and-tin-plated copper alloy contacts, and a nickel-plated stainless steel shell, this connector operates reliably across an industrial temperature range of -55°C to +105°C with a tested durability of 1,500 mating cycles. It provides a durable, factory-direct interconnect solution for industrial automation, IPCs, edge networking servers, and commercial computing systems.
Application Notes
-
PCB Layout & Stacking Height: Ensure precise board hole alignment for all 18 signal pins and shell stakes to avoid mechanical strain during manual DIP insertion. The recommended PCB thickness is 1.2mm to 1.6mm.
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Grounding & EMI Shielding: Solder all four outer shell stakes securely to the chassis/PCB ground plane to ensure full 360° EMI/RFI protection and optimal signal integrity.
-
Thermal Management: Designed for standard wave soldering processes; ensure thermal profiles do not exceed housing material limits during assembly. The high-temperature thermoplastic housing supports extreme operating environments from -55°C to +105°C.
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Power Trace Routing: Route power lines (VBUS) with adequate copper width to support standard USB 3.0 power loads without inducing voltage drop across stacked ports.
