2026年7月17日
Wire Harness Connector Types: The Ultimate Guide (with Examples)
In the realm of electronics manufacturing, wire harnesses are indispensable. They serve as the critical linkages that connect...
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Drop-in Replacement
- Competitor Part Number
- Molex 48320 Series / Amphenol Equivalent (Standard Elevated USB 3.0 Type-A Receptacles)
- Mates With
- Standard USB 3.0 Type-A Plugs (Cable Assemblies)
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
Material Composition
| Material | Value / Description |
|---|---|
| Contact Material: | Copper Alloy |
| Contact Plating: | Gold Flash (Customizable) |
| Shell Material: | Brass / SPCC |
| Shell Plating: | Nickel |
| Insulator Material: | High-Temp Thermoplastic (UL94V-0) |
| Shell Stake Type: | Through Hole |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Voltage Rating: | 30V AC/DC (Max) |
| Current Rating: | 1.8A Max (VBUS) |
| Dielectric Withstanding: | 100V AC Min. |
| Mating Cycles: | 5,000 Cycles Min. |
| Operating Temp: | -40°C to +85°C |
| Contact Resistance: | 30 mΩ Max. |
Application Scenarios
-
Industrial Automation PCs (IPCs) : Utilizing the elevated footprint to save critical motherboard space while providing high-speed, secure diagnostic ports for factory floor equipment.
-
Telecom & Networking Routers : Serving as a stable, localized configuration and firmware update port on enterprise-grade server boards, supported by reliable through-hole retention.
-
Medical Diagnostic Carts : Ensuring error-free 5 Gbps data transfer for imaging devices, built to withstand the frequent daily plug insertions required in clinical environments.
-
Smart Kiosks & Vending Machines : Offering secure internal peripheral connectivity for touchscreens, card readers, and USB hubs with excellent EMI shielding.
Frequently Asked Questions
Why use an elevated (H=15.44mm) USB receptacle instead of a standard low-profile version?
The elevated design provides extra vertical clearance between the PCB and the connector body. This allows hardware engineers to place other low-profile surface-mount components or route complex signal traces directly under the connector, significantly optimizing overall board space.
Is this connector backward compatible with standard USB 2.0 cables?
Yes. The 9-pin configuration natively includes the standard 4 pins dedicated to USB 2.0. It offers seamless backward compatibility for older peripherals while enabling 5 Gbps speeds for USB 3.0 devices.
Can we request custom gold plating thicknesses for harsher environments?
Absolutely. While gold flash is our standard, our factory can apply heavier gold plating (such as 15µ" or 30µ") to enhance corrosion resistance and durability for demanding industrial applications.
What is the typical lead time and MOQ for this connector?
Our standard MOQ for bulk production is 1,000 pieces. Standard manufacturing lead times are approximately 2 to 4 weeks, though we provide rapid prototyping in 3-5 days for urgent engineering validation.
Are your connectors compliant with global environmental standards?
Yes, all EDOM Electronics components are manufactured to be fully RoHS and REACH compliant, adhering strictly to international environmental and safety regulations.
Overview and Application Notes
Overview Engineered for robust high-speed data transmission up to 5 Gbps, this 9-pin USB 3.0 Type-A receptacle features a 15.44mm elevated right-angle profile, making it a strategic component for complex, space-constrained PCB layouts. Manufactured with a durable through-hole (DIP) termination design, it guarantees exceptional mechanical retention and superior EMI shielding, reliably enduring over 5,000 mating cycles. As a factory-direct OEM solution, EDOM Electronics offers scalable manufacturing, customizable contact plating, and rigorous quality control in compliance with IPC/WHMA-A-620 standards, ensuring seamless integration into your industrial and commercial hardware systems.
Application Notes
-
Leverage the 15.44mm elevated standoff height to route critical signal traces or place low-profile SMT components directly underneath the connector, optimizing motherboard real estate.
-
Ensure optimized wave soldering thermal profiles for the through-hole pins to achieve full barrel fill, maximizing mechanical stability against repeated insertion and extraction forces.
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Connect the robust metal shell grounding stakes directly to the PCB ground plane to minimize EMI/RFI interference during 5 Gbps SuperSpeed differential data transmission.
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Maintain adequate front-panel clearance in the mechanical enclosure to accommodate full plug insertion without placing shear stress on the PCB solder joints.
