2026年8月7日
What Is a Connector? A Practical Overview for OEM Buyers
What is a connector? Learn the key factors OEM buyers must evaluate—contact plating, termination, and retention—to avoid field...
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Product Specifications
Key parameters for OEM, distributor and engineering evaluation.
Detailed Product Information
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
| Material | Value / Description |
|---|---|
| Contact Material | Phosphor Bronze (4PIN) & Copper Alloy (5PIN) |
| Contact Plating | Gold Flash on Contact Area, Tin on Solder Tails |
| Shell Material | Copper Alloy, Nickel Plated |
| Shell Plating | Nickel Plated |
| Housing Material | Halogen-Free LCP, Blue (UL94V-0) |
| Characteristic | Value |
|---|---|
| Data Transfer Rate | Up to 5 Gbps (SuperSpeed) |
| Current Rating | 1.8A Max (Pin 1 & 4), 0.25A (Other Pins) |
| Voltage Rating | 30V AC (rms) |
| Mating Cycles | 1,500 Cycles Min. |
| Operating Temperature | -55°C to +105°C |
| Contact Resistance | 30 mΩ Max. |
Industrial Printers & Scanners : Provides a highly ruggedized, secure data connection that withstands the vibration and frequent cable manipulation typical in commercial printing environments.
Data Acquisition Modules (DAQ) : Guarantees reliable 5 Gbps SuperSpeed data transfer for real-time sensor monitoring and industrial control systems without signal degradation.
Medical Diagnostic Equipment : Ensures secure, stable connections for stationary ultrasonic and imaging devices, backed by durable through-hole mounting that resists accidental cable pulls.
Audio/MIDI Interfaces : Offers robust grounding and EMI shielding to maintain pristine, interference-free digital audio signal transmission in professional studio equipment.
Server & Enclosure Management : Acts as a dependable diagnostic and configuration port on industrial racks and server chassis, benefiting from the robust physical footprint of the Type-B form factor.
Overview: Engineered for demanding industrial and commercial environments, this USB 3.0 Type-B receptacle delivers SuperSpeed 5 Gbps data transmission while ensuring robust mechanical stability. Featuring a horizontal through-hole (90° DIP) design with integrated through-hole copper alloy shell retention stakes, it provides superior board-level pull-out resistance compared to SMT alternatives. The connector is constructed with a blue halogen-free LCP insulator (UL94V-0 rated) and high-conductivity contacts (phosphor bronze 4-pin and copper alloy 5-pin) with gold plating, operating reliably across an extended industrial temperature range of -55°C to +105°C and rated for 1,500 mating cycles. As an ISO-certified direct manufacturer, EDOM Electronics provides factory pricing, scalable volume production, and custom plating options to fit your exact engineering specifications.
Application Notes:
Operating Temperature Limits: Constructed with halogen-free LCP thermoplastic, this connector is rated for an extended operating temperature range of -55°C to +105°C.
Wave Soldering Compatibility: Fully compatible with standard lead-free wave soldering profiles. The halogen-free LCP housing resists thermal deformation during the soldering cycle.
PCB Layout & Hole Tolerances: Adhere to the recommended PCB hole sizing (4-φ0.92mm for USB 2.0 pins, 5-φ0.70mm for SuperSpeed pins, and 2-φ2.30mm for shell retention stakes) to avoid terminal strain during automated or manual insertion.
Mechanical Grounding & EMI Shielding: Solder both outer nickel-plated copper alloy shell stakes securely to the PCB ground plane to dissipate mechanical strain from heavy Type-B cable insertion and provide continuous 360° EMI/RFI shielding.
Differential Impedance: Maintain strict 90Ω differential impedance routing for the two SuperSpeed differential pairs to prevent signal loss at 5 Gbps.
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Use this document for internal review, engineering comparison, and RFQ preparation.
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