2026年8月7日
What Is a Connector? A Practical Overview for OEM Buyers
What is a connector? Learn the key factors OEM buyers must evaluate—contact plating, termination, and retention—to avoid field...
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Product Specifications
Key parameters for OEM, distributor and engineering evaluation.
Detailed Product Information
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
| Material | Value / Description |
|---|---|
| Contact Material | Copper Alloy |
| Contact Plating | Gold Flash on Contact Area, Tin on Solder Tails |
| Shell Material | Copper Alloy, Nickel Plated |
| Shell Plating | Nickel Plated |
| Housing Material | Halogen-Free LCP, Blue (UL 94V-0) |
| Characteristic | Value |
|---|---|
| Data Transfer Rate | Up to 5 Gbps (SuperSpeed) |
| Current Rating | 1.8A Max (Pin 1 & 4), 0.25A (Other Pins) |
| Voltage Rating | 30V AC/DC Max |
| Mating Cycles | 1,500 Cycles Min. |
| Operating Temperature | -55°C to +105°C |
| Contact Resistance | 30 mΩ Max. |
Industrial Printers & Scanners : Provides a highly ruggedized, secure data connection that withstands the vibration and frequent cable manipulation typical in commercial printing environments.
Data Acquisition Modules (DAQ) : Guarantees reliable 5 Gbps SuperSpeed data transfer for real-time sensor monitoring and industrial control systems without signal degradation.
Medical Diagnostic Equipment : Ensures secure, stable connections for stationary ultrasonic and imaging devices, backed by durable through-hole mounting that resists accidental pulls.
Audio & MIDI Interfaces : Offers robust grounding and EMI shielding to maintain pristine, interference-free digital audio signal transmission in professional studio equipment.
Server & Enclosure Management : Acts as a dependable diagnostic and configuration port on industrial racks and server chassis, benefiting from the robust physical footprint of the Type-B form factor.
Overview: Engineered for demanding industrial, commercial, and medical peripherals, this vertical USB 3.0 Type-B receptacle delivers SuperSpeed 5 Gbps data transmission with high mechanical stability. Featuring a 180-degree straight vertical through-hole (DIP) orientation with retention kinked shell legs, it minimizes PCB footprint while providing superior resistance against heavy insertion and accidental unmating forces. Molded from blue halogen-free LCP thermoplastic (UL 94V-0) and constructed with copper alloy contacts and a nickel-plated copper alloy shell, it operates reliably across an extended temperature range of -55°C to +105°C and supports a standard durability of 1,500 mating cycles. As an ISO-certified direct manufacturer, EDOM Electronics provides factory pricing, scalable production, and custom plating options to fit your exact engineering requirements.
Application Notes:
Operating Temperature Limits: Constructed with halogen-free LCP thermoplastic, this connector is rated for an extended industrial operating temperature range of -55°C to +105°C.
PCB Layout & Hole Tolerances: Adhere strictly to the recommended PCB layout (4-φ0.92mm for USB 2.0 pins, 5-φ0.70mm for SuperSpeed pins, and 2-φ2.30mm for shell kinked stakes, recommended PCB thickness 1.2mm to 1.6mm) to ensure seamless DIP mounting.
Mechanical Grounding & Kinked Retention: The through-hole copper alloy shell features kinked retention legs that lock into the PCB during assembly. Ensure these stakes are securely wave-soldered to the PCB ground plane to dissipate mechanical strain and maintain 360° EMI/RFI shielding.
Wave Soldering Compatibility: Molded from high-temperature halogen-free LCP, the housing is fully compatible with standard lead-free wave soldering profiles without risk of blister or deformation.
Differential Impedance: Maintain strict 90Ω differential impedance routing for the SuperSpeed (TX/RX) differential pairs to prevent signal degradation at 5 Gbps.
2026年8月7日
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