2026年7月22日
Top 10 Critical Specifications for Cable Assembly & Wiring Harness Quotes
Discover the top 10 electrical specifications for cable assembly & wiring harness design. Ensure proper conductor, terminal, and...
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Functional Alternative
- Competitor Part Number
- Lotes ABA-USB Series / Amphenol G881 Series (Functional Equivalents)
- Mates With
- Standard USB 3.1 Type E Front Panel Cable Assemblies
Functional Alternative: This part provides equivalent performance characteristics as a cost-optimized substitute. Minor design review recommended before adoption.
Material Composition
| Material | Value / Description |
|---|---|
| Housing | Thermoplastic LCP, Black (UL94 V-0) |
| Contacts | Copper Alloy (C5210-EH, T=0.15mm) |
| Contact Plating | Gold (Au) Plated |
| Solder Tail Plating | Tin Plated |
| Outer Shell | Stainless Steel (SUS304-H, T=0.15mm) |
| Shell Finish | Tin Plated on Solder Area |
| RoHS Status | Compliant |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Current Rating | 1.5A Max (Per Pin) |
| Voltage Rating | 30V AC (R.M.S.) |
| Contact Resistance | 40 mΩ Max (Initial) |
| Insulation Resistance | 100 MΩ Min |
| Dielectric Withstanding | 100V AC |
| Operating Temperature | -40°C to +85°C |
| Mating Cycles | 1,500 Cycles |
Application Scenarios
-
Industrial PCs & Server Motherboards: Provides a secure, high-speed internal connection point for expanding front-panel Type-C diagnostic and data ports in rack-mount servers.
-
Custom Gaming Desktop Enclosures: Enables chassis manufacturers to offer fast 10Gbps USB-C front I/O connectivity directly routed from the motherboard to the top/front panel.
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Automated Test Equipment (ATE): Facilitates reliable internal cabling solutions where compact, keyed connections are necessary to prevent assembly line mis-wiring.
-
Medical Diagnostic Carts: Ensures stable, shielded data transfer between the central processing unit and external access panels without risking accidental disconnects inside the machine.
Frequently Asked Questions
What is the difference between Key A and Key B for USB 3.1 Type E headers?
Key A is specifically designed to support front-panel USB Type-C ports, carrying the necessary signals for Type-C functionality. Key B is designed to support front-panel USB Type-A ports. They are mechanically incompatible to prevent improper connections during assembly.
Is this connector capable of delivering 100W or 240W Power Delivery?
The Type E internal header itself is designed for data and base power transfer (typically rated at 1.5A per pin). High-wattage Power Delivery (like 100W or 240W) requires dedicated power delivery circuits on the motherboard and is negotiated at the external Type-C receptacle, not at this internal data header.
Does the product support automated SMT assembly?
Yes, it is manufactured with high-temperature Liquid Crystal Polymer (LCP) and is supplied in tape-and-reel packaging, making it fully compatible with automated pick-and-place machines and lead-free reflow soldering.
Can you provide custom manufacturing or alternative plating options?
As an OEM/ODM factory, we offer flexible customization. We can adjust the gold plating thickness on the contact area based on your specific insertion cycle and environmental requirements.
What is the minimum order quantity (MOQ) and lead time?
Our standard MOQ for wholesale and OEM orders is typically one reel (varies by packaging standard). Standard production lead times run between 2 to 4 weeks, depending on current raw material availability and order volume.
Overview and Application Notes
Overview: Engineered for next-generation motherboard and industrial PC layouts, the EU20F2B3N11350SR is a high-performance USB 3.1 Type E 20-pin internal header. Featuring a specific Key A mechanical design, it is purpose-built to connect directly to front-panel USB Type-C modules, supporting high-speed data transmission up to 10 Gbps (USB 3.1 Gen 2). Manufactured with a robust SUS304 stainless steel shell and high-temperature LCP housing, this connector guarantees excellent EMI shielding and thermal resilience during automated reflow processes. As a factory-direct solution, it provides OEM and ODM equipment manufacturers with uncompromised reliability and seamless integration for modern I/O panel expansions.
Application Notes:
-
Keying Verification: This header features a “Key A” mechanical profile, which is strictly designed for front-panel USB Type-C module connections. Do not confuse it with “Key B” which is intended for standard USB Type-A modules.
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PCB Trace Routing: For 10 Gbps signal integrity, ensure differential pairs (TX/RX) are routed with strict impedance control (typically 90 ohms) and matched trace lengths.
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EMI Shielding Anchors: The inner shell stakes must be securely soldered to the PCB ground plane to minimize electromagnetic interference and provide mechanical strain relief during cable insertion.
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Thermal Profiling: The UL94 V-0 LCP housing is designed to withstand standard lead-free IR reflow temperatures up to 260°C.
