2026年7月22日
Top 10 Critical Specifications for Cable Assembly & Wiring Harness Quotes
Discover the top 10 electrical specifications for cable assembly & wiring harness design. Ensure proper conductor, terminal, and...
Detailed Product Information
Technical Data & Reference
Structured parameters, material notes, application context and frequently asked questions for engineering and procurement evaluation.
Competitor & Cross-Reference
- Alternative Type
- Drop-in Replacement
- Competitor Part Number
- Amphenol G881H2022CEU / Lotes ABA-USB-054-K01
- Mates With
- Standard USB 3.1 Type E Front Panel Cable Assemblies
Drop-in Replacement: This part is a direct, pin-compatible substitute for the competitor part number listed above. No design modification required.
Material Composition
| Material | Value / Description |
|---|---|
| Housing | Thermoplastic LCP, Black (UL94 V-0) |
| Contacts | Copper Alloy C5210-EH (T=0.15mm) |
| Contact Plating | Selective Gold (Au) on Contact Area, Au/Tin on Solder Tails, 50u" Min Nickel Underplate |
| Solder Tail Plating | Tin Plated |
| Outer Shell | SUS304-H Stainless Steel (T=0.15mm) |
| Shell Finish | Tin Plated on Solder Tails |
| RoHS Status | Compliant |
Technical Characteristics
| Characteristic | Value |
|---|---|
| Current Rating | 1.5A Max (Per Pin) |
| Voltage Rating | 30V AC (R.M.S.) |
| Terminal Pitch | 0.80mm Pitch |
| Contact Resistance | 40 mΩ Max (Initial) |
| Insulation Resistance | 100 MΩ Min |
| Dielectric Withstanding | 100V AC |
| Operating Temperature | -40°C to +85°C |
| Mating Cycles | 1,500 Cycles |
| Solder Tail Coplanarity | 0.10mm Max |
Application Scenarios
-
Industrial PCs & Server Motherboards: Provides a secure, high-speed internal connection point for expanding front-panel Type-C diagnostic and data ports in rack-mount servers.
-
Custom Gaming Desktop Enclosures: Enables chassis manufacturers to offer fast 10Gbps USB-C front I/O connectivity directly routed from the motherboard to the top/front panel.
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Automated Test Equipment (ATE): Facilitates reliable internal cabling solutions where compact, keyed connections are necessary to prevent assembly line mis-wiring.
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Medical Diagnostic Carts: Ensures stable, shielded data transfer between the central processing unit and external access panels without risking accidental disconnects inside the machine.
Frequently Asked Questions
What specific pin configuration and pitch does this Type E internal header have?
It features a 20-pin (2x10) dual-row surface-mount configuration with an 0.80mm pitch, designed specifically to support front-panel USB 3.1 Gen 2 Key A connections.
What are the PCB layout precautions regarding the EMI shell solder leads?
As specified in the engineering drawing, if an EMI shell solder lead connects to an adjacent GND pin via PCB traces, it must be properly isolated with solder resist to prevent bridging during reflow.
Does the product support automated SMT assembly?
Yes, it is manufactured with high-temperature Liquid Crystal Polymer (LCP) and is supplied in tape-and-reel packaging, making it fully compatible with automated pick-and-place machines and lead-free reflow soldering.
Can you provide custom manufacturing or alternative plating options?
As an OEM/ODM factory, we offer flexible customization. We can adjust the gold plating thickness on the contact area based on your specific insertion cycle and environmental requirements.
What is the minimum order quantity (MOQ) and lead time?
Our standard MOQ for wholesale and OEM orders is typically one reel (varies by packaging standard). Standard production lead times run between 2 to 4 weeks, depending on current raw material availability and order volume.
Overview and Application Notes
Overview: Engineered for modern high-performance motherboards, industrial PCs, and edge computing enclosures, the EU20F2B3N11350SR is a high-speed USB 3.1 Type E 20-pin internal header with a Key A mechanical interface. Designed to link internal motherboards directly to front-panel USB Type-C ports, it delivers reliable SuperSpeed+ 10Gbps (USB 3.1 Gen 2) data transmission. Molded from high-temperature UL94 V-0 Liquid Crystal Polymer (LCP) and reinforced with an SUS304-H stainless steel shielding shell (T=0.15mm), it provides 360-degree EMI suppression and thermal resilience during automated lead-free SMT reflow. Featuring 2×10 dual-row 0.80mm pitch contacts (C5210-EH) with gold plating on contact interfaces and tin/gold on solder tails, it offers OEM/ODM equipment manufacturers a durable, drop-in internal interconnect solution.
Application Notes:
-
Pin Mapping & Interface Support: Designed with a 20-pin dual-row layout (0.80mm pitch, 0.40mm pin width) supporting Key A single Type-C routing (TX1/2, RX1/2, CC1/2, SBU1/2, VBUS, GND) or dual Standard-A port routing.
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PCB Layout & Solder Resist Isolation: Follow the exact recommended PCB footprint (0.80mm pitch, 0.40mm pad width). Note that if the EMI shell solder leads are connected to adjacent GND pins via traces, they must be isolated by solder resist.
-
Reflow Soldering Profile: The UL94 V-0 black LCP housing and SUS304-H shell withstand lead-free IR reflow profiles with peak temperatures up to 260°C.
-
Coplanarity & Pick-and-Place: Designed with an integrated protective pick-and-place cap (F1) for automated SMT tape-and-reel feeding; maintains strict terminal coplanarity (0.10mm max across all solder tails).
